JP2008515656A - 抗微生物材料およびろ過材料製造用ポリマー発泡体の金属処理方法 - Google Patents
抗微生物材料およびろ過材料製造用ポリマー発泡体の金属処理方法 Download PDFInfo
- Publication number
- JP2008515656A JP2008515656A JP2007530050A JP2007530050A JP2008515656A JP 2008515656 A JP2008515656 A JP 2008515656A JP 2007530050 A JP2007530050 A JP 2007530050A JP 2007530050 A JP2007530050 A JP 2007530050A JP 2008515656 A JP2008515656 A JP 2008515656A
- Authority
- JP
- Japan
- Prior art keywords
- foam
- metal
- substrate
- antimicrobial
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/36—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1644—Composition of the substrate porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Filtering Materials (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
Abstract
Description
化工程/核形成工程の必要がなく、発泡体材料を金属処理することができるからである。得られる金属処理された発泡体材料は、金属が発泡体に充分に接着して形成される。得られる発泡体材料は、低抵抗値および/または最適な銀イオン放出量を有するように設計することができる。
発泡体がエッチングされた後、同発泡体表面を濡れるようにしたり、残渣やごみがないようにしたりするため、非イオン性界面活性剤または他の適切な材料により発泡体を処理することができる。70℃未満の温度を有する脱イオン水を用いる優れた水洗工程は、表4に記載の実施態様により行うことができる。
、トリトンX−100などの非イオン性界面活性剤を用いて洗浄し、その後充分に水洗した。発泡体は15%HClを用い20分間エッチングを行った。その後、発泡体を10%HClおよび10g/lの無水塩化スズを含有する溶液により20分間金属処理前工程で処理した。さらに発泡体を逆流脱イオン水により水洗した。0.63gのEDTA−4ナトリウム塩を2リットルの脱イオン水に溶解した。6.5mlのNEL/AEM界面活性剤も前記処理浴に添加した。発泡体を反応浴中に配置し、溶液を撹拌した。銀錯塩を添加し、さらに1.8mlのホルムアルデヒドを添加した。3時間後に試料を取り出し、熱水により水洗した。その後、0.2%NaOH溶液を50mlに仕上げ、60℃にした。金属処理された発泡体をその後この溶液に浸漬した。色調は金色に変化した。
Claims (11)
- 発泡体を金属処理する方法であって、
エッチング剤を用いて前記発泡体基材の表面の一部をエッチングし、前記発泡体基材の表面積を増大させるエッチング工程と、
前記発泡体基材に金属処理の前処理を行い、前記発泡体基材に金属を付与する準備を行う金属処理前工程と、
前記発泡体基材に金属処理を行い、前記発泡体に金属を付与する金属処理工程とを備え、前記方法は活性化工程を要しない方法。 - エッチング剤はアルカリ溶液からなる請求項1に記載の方法。
- アルカリ溶液は水酸化アルカリからなる請求項2に記載の方法。
- 水酸化アルカリは水酸化ナトリウムからなる請求項3に記載の方法。
- 前記発泡体基材の金属処理前工程は、塩化第1スズと酸との混合物を用いる工程と、前記発泡体基材を同混合物中に浸漬する工程とからなる請求項1に記載の方法。
- 前記発泡体基材は前記混合物中に約5〜約60分間浸漬される請求項5に記載の方法。
- 前記混合物は約5〜約40%の塩化第1スズと、約4〜約25%の酸とを含む請求項5に記載の方法。
- 金属は銀、金、アルミニウム、銅、およびこれらの組み合わせのうちの1つである請求項1に記載の方法。
- 金属は銀からなる請求項8に記載の方法。
- 請求項1に記載の方法により製造される金属処理された前記発泡体基材。
- ポリエーテル発泡体を金属処理する方法であって、
前記発泡体基材に金属処理の前処理を行い、前記発泡体基材に金属を付与する準備を行う工程と、
前記発泡体基材に金属処理を行い、前記発泡体に金属を付与する工程とを備え、前記方法はエッチング工程または活性化工程を要しない方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60361004P | 2004-08-23 | 2004-08-23 | |
US60/603,610 | 2004-08-23 | ||
PCT/US2005/029956 WO2006023913A2 (en) | 2004-08-23 | 2005-08-23 | Process of metallizing polymeric foam to produce an anti-microbial and filtration material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008515656A true JP2008515656A (ja) | 2008-05-15 |
JP4805270B2 JP4805270B2 (ja) | 2011-11-02 |
Family
ID=35968292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007530050A Active JP4805270B2 (ja) | 2004-08-23 | 2005-08-23 | 抗微生物材料およびろ過材料製造用ポリマー発泡体の金属処理方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7666476B2 (ja) |
EP (1) | EP1786621A4 (ja) |
JP (1) | JP4805270B2 (ja) |
KR (1) | KR20070061539A (ja) |
CN (1) | CN101107121A (ja) |
CA (1) | CA2578100C (ja) |
WO (1) | WO2006023913A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9192625B1 (en) | 2011-07-01 | 2015-11-24 | Mangala Joshi | Antimicrobial nanocomposite compositions, fibers and films |
CN103572270B (zh) * | 2013-11-12 | 2016-04-13 | 无锡英普林纳米科技有限公司 | 金属-聚合物复合滤网的制备方法 |
CN108659252A (zh) * | 2018-05-15 | 2018-10-16 | 东莞泰康泡绵有限公司 | 一种抗菌泡绵及其制备方法 |
CN109763084B (zh) * | 2019-01-30 | 2021-03-23 | 浙江华达新型材料股份有限公司 | 带表面抗菌镀涂层的钢板的制备工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5417977A (en) * | 1977-07-09 | 1979-02-09 | Sumitomo Electric Ind Ltd | Method of plating polyurethane foam |
JP2001137631A (ja) * | 1999-11-12 | 2001-05-22 | Osaka Gas Co Ltd | 金属多孔質体及びその製造方法 |
JP2002275306A (ja) * | 2001-03-21 | 2002-09-25 | Bridgestone Corp | 導電性多孔質体及びその製造方法 |
WO2004027113A2 (en) * | 2002-09-20 | 2004-04-01 | Noble Fiber Technologies | Improved silver plating method and articles made therefrom |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3877965A (en) * | 1970-09-28 | 1975-04-15 | Rohm & Haas | Conductive nylon substrates and method of producing them |
US4687553A (en) * | 1985-05-30 | 1987-08-18 | Eltech Systems Corporation | Unitized electrode-intercell connector module |
US4941940A (en) * | 1988-11-07 | 1990-07-17 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
FI95816C (fi) * | 1989-05-04 | 1996-03-25 | Ad Tech Holdings Ltd | Antimikrobinen esine ja menetelmä sen valmistamiseksi |
DE4242443C1 (en) * | 1992-12-16 | 1993-06-03 | Deutsche Automobilgesellschaft Mbh, 3300 Braunschweig, De | Wet chemical metallising process for pre-activated plastic substrates - involves collecting used metallising soln., activating soln. and aq. washings for processing and recycling in the process |
AU5453200A (en) | 1999-06-09 | 2000-12-28 | Laird Technologies, Inc. | Electrically conductive polymeric foam and method of preparation thereof |
US6703123B1 (en) | 2000-02-18 | 2004-03-09 | Mitsubishi Materials Corporation | Conductive fiber, manufacturing method therefor, apparatus, and application |
EP1235473B1 (en) * | 2001-02-27 | 2008-12-31 | Seiren Co., Ltd. | Gasket material for shielding electromagnetic waves and method for producing same |
US6645557B2 (en) * | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
US20030175497A1 (en) * | 2002-02-04 | 2003-09-18 | 3M Innovative Properties Company | Flame retardant foams, articles including same and methods for the manufacture thereof |
CA2564919A1 (en) * | 2003-05-02 | 2004-11-18 | N. Satish Chandra | Enhanced metal ion release rate for anti-microbial applications |
US20050123621A1 (en) * | 2003-12-05 | 2005-06-09 | 3M Innovative Properties Company | Silver coatings and methods of manufacture |
-
2005
- 2005-08-23 KR KR1020077005510A patent/KR20070061539A/ko not_active Application Discontinuation
- 2005-08-23 CN CNA2005800329431A patent/CN101107121A/zh active Pending
- 2005-08-23 WO PCT/US2005/029956 patent/WO2006023913A2/en active Application Filing
- 2005-08-23 EP EP05789076A patent/EP1786621A4/en not_active Ceased
- 2005-08-23 CA CA2578100A patent/CA2578100C/en active Active
- 2005-08-23 JP JP2007530050A patent/JP4805270B2/ja active Active
- 2005-08-23 US US11/209,567 patent/US7666476B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5417977A (en) * | 1977-07-09 | 1979-02-09 | Sumitomo Electric Ind Ltd | Method of plating polyurethane foam |
JP2001137631A (ja) * | 1999-11-12 | 2001-05-22 | Osaka Gas Co Ltd | 金属多孔質体及びその製造方法 |
JP2002275306A (ja) * | 2001-03-21 | 2002-09-25 | Bridgestone Corp | 導電性多孔質体及びその製造方法 |
WO2004027113A2 (en) * | 2002-09-20 | 2004-04-01 | Noble Fiber Technologies | Improved silver plating method and articles made therefrom |
Also Published As
Publication number | Publication date |
---|---|
EP1786621A2 (en) | 2007-05-23 |
KR20070061539A (ko) | 2007-06-13 |
CN101107121A (zh) | 2008-01-16 |
CA2578100A1 (en) | 2006-03-02 |
WO2006023913A2 (en) | 2006-03-02 |
WO2006023913A3 (en) | 2006-10-26 |
JP4805270B2 (ja) | 2011-11-02 |
US20070281093A1 (en) | 2007-12-06 |
EP1786621A4 (en) | 2008-08-13 |
US7666476B2 (en) | 2010-02-23 |
CA2578100C (en) | 2013-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3682786A (en) | Method of treating plastic substrates and process for plating thereon | |
JP4729255B2 (ja) | 銀触媒および無電解金属組成物を用いた非導電表面のメタライゼーション | |
JP5177426B2 (ja) | 樹脂成形体に対するエッチング処理用組成物 | |
JP6142407B2 (ja) | 樹脂めっき方法 | |
JPH0380872B2 (ja) | ||
JP4805270B2 (ja) | 抗微生物材料およびろ過材料製造用ポリマー発泡体の金属処理方法 | |
JP6982383B2 (ja) | 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法 | |
KR100555928B1 (ko) | 무전해 도금재의 전처리방법 | |
JP2015518924A (ja) | 非導電性プラスチック表面を金属化するための方法 | |
JP2003193247A (ja) | 無電解めっき素材の前処理方法 | |
US4166012A (en) | Method of preparation of electrooptical elements | |
EP0625590A1 (en) | Improvement of adhesion of metal coatings to resinous articles | |
CA1162354A (en) | Process for electroless metal plating of a polysulfone substrate | |
JP2005146330A (ja) | 非導体材料への表面処理方法 | |
US6063445A (en) | Method of preparation of polymer substrates for metal plating | |
JP2003183841A (ja) | 無電解めっき素材の前処理方法 | |
DE4221948C1 (de) | Verfahren zur Metallisierung von Kunststoffen und Verwendung | |
JP7160306B2 (ja) | 無電解めっきの前処理用組成物、無電解めっきの前処理方法、無電解めっき方法 | |
KR102591173B1 (ko) | 수지 표면의 다단 에칭 방법 및 이것을 이용한 수지에 대한 도금 방법 | |
CA1232104A (en) | Electroless nickel initiator solution and process for rejuvenation | |
JP4471089B2 (ja) | めっき方法 | |
JP3675347B2 (ja) | 無電解めっき処理方法 | |
JPH04180571A (ja) | 無電解鍍金方法 | |
JP2009263743A (ja) | 磁性材料への無電解めっきの前処理方法 | |
JP2005068497A (ja) | めっき素材及びめっき被覆部材とそれらの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080808 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110117 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110125 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110425 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110506 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110525 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110712 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110810 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4805270 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140819 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |