JP2008511972A5 - - Google Patents

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JP2008511972A5
JP2008511972A5 JP2007515571A JP2007515571A JP2008511972A5 JP 2008511972 A5 JP2008511972 A5 JP 2008511972A5 JP 2007515571 A JP2007515571 A JP 2007515571A JP 2007515571 A JP2007515571 A JP 2007515571A JP 2008511972 A5 JP2008511972 A5 JP 2008511972A5
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patterning device
force
pair
deformation
determining
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JP2007515571A
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JP4573873B2 (ja
JP2008511972A (ja
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Priority claimed from PCT/US2005/019392 external-priority patent/WO2005121903A2/en
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JP2007515571A 2004-06-03 2005-06-02 マイクロリソグラフィにおけるアラインメントとオーバーレイを改善するシステムおよび方法 Expired - Lifetime JP4573873B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57657004P 2004-06-03 2004-06-03
PCT/US2005/019392 WO2005121903A2 (en) 2004-06-03 2005-06-02 System and method for improvement of alignment and overlay for microlithography

Related Child Applications (1)

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JP2010119275A Division JP5059909B2 (ja) 2004-06-03 2010-05-25 マイクロリソグラフィにおけるアラインメントとオーバーレイを改善するシステムおよび方法

Publications (3)

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JP2008511972A JP2008511972A (ja) 2008-04-17
JP2008511972A5 true JP2008511972A5 (enExample) 2010-07-15
JP4573873B2 JP4573873B2 (ja) 2010-11-04

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JP2007515571A Expired - Lifetime JP4573873B2 (ja) 2004-06-03 2005-06-02 マイクロリソグラフィにおけるアラインメントとオーバーレイを改善するシステムおよび方法
JP2010119275A Expired - Lifetime JP5059909B2 (ja) 2004-06-03 2010-05-25 マイクロリソグラフィにおけるアラインメントとオーバーレイを改善するシステムおよび方法

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Country Status (6)

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US (1) US7535549B2 (enExample)
EP (1) EP1774407B1 (enExample)
JP (2) JP4573873B2 (enExample)
KR (1) KR101175108B1 (enExample)
CN (1) CN101379435A (enExample)
WO (1) WO2005121903A2 (enExample)

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JP6552185B2 (ja) 2014-11-20 2019-07-31 キヤノン株式会社 インプリント装置、補正機構の校正方法、および物品の製造方法
JP6609158B2 (ja) * 2015-10-19 2019-11-20 キヤノン株式会社 調整装置、インプリント装置および物品製造方法
JP2017152673A (ja) * 2015-11-05 2017-08-31 ボード・オブ・リージェンツ， ジ・ユニバーシティー・オブ・テキサス・システム ジェット・アンド・フラッシュ・インプリントリソグラフィにおけるマルチフィールドオーバーレイ制御
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