JP2008508664A5 - - Google Patents

Download PDF

Info

Publication number
JP2008508664A5
JP2008508664A5 JP2007522901A JP2007522901A JP2008508664A5 JP 2008508664 A5 JP2008508664 A5 JP 2008508664A5 JP 2007522901 A JP2007522901 A JP 2007522901A JP 2007522901 A JP2007522901 A JP 2007522901A JP 2008508664 A5 JP2008508664 A5 JP 2008508664A5
Authority
JP
Japan
Prior art keywords
paste
series
ptc
thick film
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007522901A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008508664A (ja
JP4874244B2 (ja
Filing date
Publication date
Priority claimed from CNB2004100508301A external-priority patent/CN100386829C/zh
Application filed filed Critical
Publication of JP2008508664A publication Critical patent/JP2008508664A/ja
Publication of JP2008508664A5 publication Critical patent/JP2008508664A5/ja
Application granted granted Critical
Publication of JP4874244B2 publication Critical patent/JP4874244B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007522901A 2004-07-28 2005-07-15 Ptc厚膜電気回路制御の電熱素子 Expired - Fee Related JP4874244B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNB2004100508301A CN100386829C (zh) 2004-07-28 2004-07-28 Ptc厚膜电路可控电热元件
CN200410050830.1 2004-07-28
PCT/CN2005/001052 WO2006010317A1 (en) 2004-07-28 2005-07-15 Controllable electrothermal element of ptc thick film circuit

Publications (3)

Publication Number Publication Date
JP2008508664A JP2008508664A (ja) 2008-03-21
JP2008508664A5 true JP2008508664A5 (OSRAM) 2011-09-15
JP4874244B2 JP4874244B2 (ja) 2012-02-15

Family

ID=34602285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007522901A Expired - Fee Related JP4874244B2 (ja) 2004-07-28 2005-07-15 Ptc厚膜電気回路制御の電熱素子

Country Status (5)

Country Link
US (1) US7800028B2 (OSRAM)
EP (1) EP1791396B1 (OSRAM)
JP (1) JP4874244B2 (OSRAM)
CN (1) CN100386829C (OSRAM)
WO (1) WO2006010317A1 (OSRAM)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753642B2 (ja) * 2005-07-04 2011-08-24 株式会社リコー 電子部品実装体の製造方法
CN1937856B (zh) * 2006-07-28 2010-12-15 王克政 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺
CN100499941C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺
CN100499942C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺
CN100499940C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺
DE102006041054A1 (de) * 2006-09-01 2008-04-03 Epcos Ag Heizelement
CN201100690Y (zh) * 2007-02-02 2008-08-13 盛光润 一种电膜炉
FR2951348B1 (fr) * 2009-10-12 2012-02-03 Tornier Sa Element chauffant et appareil chirurgical le mettant en oeuvre
CN102685942B (zh) * 2012-05-29 2014-05-07 王克政 一种ptc稀土厚膜电路智能电热元件及其制备方法
DE102014110164B4 (de) 2014-05-02 2022-11-03 Borgwarner Ludwigsburg Gmbh Verfahren zum Herstellen eines Heizstabs
CA2959163C (en) * 2014-09-02 2023-02-14 Graphene 3D Lab Inc. Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing
CN104318979A (zh) * 2014-09-19 2015-01-28 王晨 复合材料基厚膜电路稀土介质浆料及其制备工艺
CN104827857B (zh) * 2015-04-03 2017-11-07 佛山市海辰科技有限公司 PTCR‑xthm电热芯片为热源的电动汽车智能暖气机系统
WO2018002994A1 (ja) * 2016-06-27 2018-01-04 日本たばこ産業株式会社 エアロゾル吸引器用カートリッジ及びそれを備えるエアロゾル吸引器、並びにエアロゾル吸引器用発熱シート
CN107446408A (zh) * 2017-07-18 2017-12-08 德阳烯碳科技有限公司 Ptc石墨烯发热油墨及其制备方法、及其制备的发热膜
US10899427B2 (en) 2018-07-03 2021-01-26 Goodrich Corporation Heated floor panel with impact layer
US10875623B2 (en) 2018-07-03 2020-12-29 Goodrich Corporation High temperature thermoplastic pre-impregnated structure for aircraft heated floor panel
US11273897B2 (en) 2018-07-03 2022-03-15 Goodrich Corporation Asymmetric surface layer for floor panels
US11499724B2 (en) 2018-07-03 2022-11-15 Goodrich Corporation Heated floor panels
US11376811B2 (en) 2018-07-03 2022-07-05 Goodrich Corporation Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels
US10920994B2 (en) 2018-07-03 2021-02-16 Goodrich Corporation Heated floor panels
CN109650933B (zh) * 2019-01-28 2021-03-30 陕西科技大学 一种多孔Co3O4/Al2SiO5低密度吸波型复相陶瓷及其制备方法
CN111761788A (zh) * 2019-04-02 2020-10-13 厦门市同骏电子有限公司 一种注塑压塑加热模块设备及生产工艺
CN111981674A (zh) * 2019-05-22 2020-11-24 帅和节能电器科技(上海)有限公司 云控物联网即热式热水器
US11903101B2 (en) 2019-12-13 2024-02-13 Goodrich Corporation Internal heating trace assembly
CN114126112A (zh) * 2021-11-23 2022-03-01 浙江波仕科技有限公司 一种高分子电热膜电极及其生产工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03246901A (ja) * 1990-02-23 1991-11-05 Hitachi Ltd 厚膜抵抗組成物、該組成物を用いたハイブリッドicおよびその製法
DE69320098T2 (de) * 1992-05-15 1999-04-01 Denso Corp., Kariya, Aichi Kaltleiterthermistor für Heizgeräte und Verfahren zur Herstellung
JPH0794260A (ja) * 1993-07-30 1995-04-07 Toshiba Lighting & Technol Corp ヒータおよび定着装置
JPH07140022A (ja) * 1993-11-16 1995-06-02 Matsushita Electric Ind Co Ltd 抵抗素子用ペースト、抵抗素子および力学量センサ
JPH07297008A (ja) * 1994-03-04 1995-11-10 Komatsu Ltd 正特性サーミスタおよびこれを用いたサーミスタ装置
EP0749132A4 (en) * 1994-03-04 1997-05-14 Komatsu Mfg Co Ltd THERMISTOR WITH POSITIVE TEMPERATURE COEFFICIENT
US5702653A (en) * 1995-07-11 1997-12-30 Spectrol Electronics Corporation Thick-film circuit element
JP3927250B2 (ja) * 1995-08-16 2007-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 窒化アルミニウム基板用厚膜導体ペースト組成物
CN1202511A (zh) * 1998-06-02 1998-12-23 武汉景辉科技发展有限公司 厚膜高温发热材料
US6443999B1 (en) * 2000-03-16 2002-09-03 The Gillette Company Lithium cell with heat formed separator
US6723420B2 (en) * 2001-04-09 2004-04-20 Morgan Chemical Products, Inc. Thick film paste systems for circuits on diamond substrates
JPWO2003021664A1 (ja) * 2001-08-31 2005-07-07 株式会社日立製作所 半導体装置、構造体及び電子装置
JP3797281B2 (ja) * 2001-09-20 2006-07-12 株式会社村田製作所 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品
JP3807609B2 (ja) * 2002-03-07 2006-08-09 Tdk株式会社 セラミック電子部品及びその製造方法
US6780494B2 (en) * 2002-03-07 2004-08-24 Tdk Corporation Ceramic electronic device and method of production of same
CN1273560C (zh) * 2003-09-01 2006-09-06 王培英 半导瓷厚膜发热材料

Similar Documents

Publication Publication Date Title
JP4874244B2 (ja) Ptc厚膜電気回路制御の電熱素子
JP2008508664A5 (OSRAM)
CN102685942B (zh) 一种ptc稀土厚膜电路智能电热元件及其制备方法
CN205017608U (zh) 一种功能膜陶瓷电阻电加热元件
CN101860993A (zh) Mch共烧陶瓷发热基板及其制备方法
KR200448882Y1 (ko) 페이스트 조성물을 이용한 히터
JP6301558B2 (ja) 両面に高熱伝導能力がある厚膜発熱体
CN202652562U (zh) 一种曲面印刷稀土厚膜电路智能电热元件
CN101616511B (zh) 陶瓷发热器件的制备方法
CN111063477B (zh) 一种不锈钢基板厚膜电路绝缘介质浆料及其制备方法
JP2008115069A (ja) 二珪化モリブデン組成物及びその応用
CN203632890U (zh) 铝铜Cu+复合基稀土厚膜电路智能电热芯片
CN107986810B (zh) 功率电子器件用AlN陶瓷敷铜基板及其制备方法
CN201401860Y (zh) 基于陶瓷发热组件的电暖器
CN104992744A (zh) 一种用于不锈钢基板的厚膜电路电阻浆料及其制备方法
KR200399652Y1 (ko) 후막형 발열체가 구비된 핫 플레이트
CN108682478A (zh) 一种复合氧化物微晶玻璃、绝缘介质浆料及其制备方法和应用
CN207775101U (zh) 功率电子器件用AlN陶瓷敷铜基板
CN201418159Y (zh) 陶瓷发热元件及陶瓷发热组件
KR100438329B1 (ko) 인공발열체
JP2537606B2 (ja) セラミツクヒ−タ
JPH04129189A (ja) セラミックヒータ
JPH04325462A (ja) AlNセラミックヒータ用発熱抵抗体用ペースト
JPS603883A (ja) 面状発熱体
CN201947465U (zh) 陶瓷ptc电极结构