JP2008508664A5 - - Google Patents
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- Publication number
- JP2008508664A5 JP2008508664A5 JP2007522901A JP2007522901A JP2008508664A5 JP 2008508664 A5 JP2008508664 A5 JP 2008508664A5 JP 2007522901 A JP2007522901 A JP 2007522901A JP 2007522901 A JP2007522901 A JP 2007522901A JP 2008508664 A5 JP2008508664 A5 JP 2008508664A5
- Authority
- JP
- Japan
- Prior art keywords
- paste
- series
- ptc
- thick film
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100508301A CN100386829C (zh) | 2004-07-28 | 2004-07-28 | Ptc厚膜电路可控电热元件 |
| CN200410050830.1 | 2004-07-28 | ||
| PCT/CN2005/001052 WO2006010317A1 (en) | 2004-07-28 | 2005-07-15 | Controllable electrothermal element of ptc thick film circuit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008508664A JP2008508664A (ja) | 2008-03-21 |
| JP2008508664A5 true JP2008508664A5 (OSRAM) | 2011-09-15 |
| JP4874244B2 JP4874244B2 (ja) | 2012-02-15 |
Family
ID=34602285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007522901A Expired - Fee Related JP4874244B2 (ja) | 2004-07-28 | 2005-07-15 | Ptc厚膜電気回路制御の電熱素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7800028B2 (OSRAM) |
| EP (1) | EP1791396B1 (OSRAM) |
| JP (1) | JP4874244B2 (OSRAM) |
| CN (1) | CN100386829C (OSRAM) |
| WO (1) | WO2006010317A1 (OSRAM) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4753642B2 (ja) * | 2005-07-04 | 2011-08-24 | 株式会社リコー | 電子部品実装体の製造方法 |
| CN1937856B (zh) * | 2006-07-28 | 2010-12-15 | 王克政 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
| CN100499941C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土介质浆料及其制备工艺 |
| CN100499942C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺 |
| CN100499940C (zh) * | 2006-07-28 | 2009-06-10 | 王克政 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
| DE102006041054A1 (de) * | 2006-09-01 | 2008-04-03 | Epcos Ag | Heizelement |
| CN201100690Y (zh) * | 2007-02-02 | 2008-08-13 | 盛光润 | 一种电膜炉 |
| FR2951348B1 (fr) * | 2009-10-12 | 2012-02-03 | Tornier Sa | Element chauffant et appareil chirurgical le mettant en oeuvre |
| CN102685942B (zh) * | 2012-05-29 | 2014-05-07 | 王克政 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
| DE102014110164B4 (de) | 2014-05-02 | 2022-11-03 | Borgwarner Ludwigsburg Gmbh | Verfahren zum Herstellen eines Heizstabs |
| CA2959163C (en) * | 2014-09-02 | 2023-02-14 | Graphene 3D Lab Inc. | Electrochemical devices comprising nanoscopic carbon materials made by additive manufacturing |
| CN104318979A (zh) * | 2014-09-19 | 2015-01-28 | 王晨 | 复合材料基厚膜电路稀土介质浆料及其制备工艺 |
| CN104827857B (zh) * | 2015-04-03 | 2017-11-07 | 佛山市海辰科技有限公司 | PTCR‑xthm电热芯片为热源的电动汽车智能暖气机系统 |
| WO2018002994A1 (ja) * | 2016-06-27 | 2018-01-04 | 日本たばこ産業株式会社 | エアロゾル吸引器用カートリッジ及びそれを備えるエアロゾル吸引器、並びにエアロゾル吸引器用発熱シート |
| CN107446408A (zh) * | 2017-07-18 | 2017-12-08 | 德阳烯碳科技有限公司 | Ptc石墨烯发热油墨及其制备方法、及其制备的发热膜 |
| US10899427B2 (en) | 2018-07-03 | 2021-01-26 | Goodrich Corporation | Heated floor panel with impact layer |
| US10875623B2 (en) | 2018-07-03 | 2020-12-29 | Goodrich Corporation | High temperature thermoplastic pre-impregnated structure for aircraft heated floor panel |
| US11273897B2 (en) | 2018-07-03 | 2022-03-15 | Goodrich Corporation | Asymmetric surface layer for floor panels |
| US11499724B2 (en) | 2018-07-03 | 2022-11-15 | Goodrich Corporation | Heated floor panels |
| US11376811B2 (en) | 2018-07-03 | 2022-07-05 | Goodrich Corporation | Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels |
| US10920994B2 (en) | 2018-07-03 | 2021-02-16 | Goodrich Corporation | Heated floor panels |
| CN109650933B (zh) * | 2019-01-28 | 2021-03-30 | 陕西科技大学 | 一种多孔Co3O4/Al2SiO5低密度吸波型复相陶瓷及其制备方法 |
| CN111761788A (zh) * | 2019-04-02 | 2020-10-13 | 厦门市同骏电子有限公司 | 一种注塑压塑加热模块设备及生产工艺 |
| CN111981674A (zh) * | 2019-05-22 | 2020-11-24 | 帅和节能电器科技(上海)有限公司 | 云控物联网即热式热水器 |
| US11903101B2 (en) | 2019-12-13 | 2024-02-13 | Goodrich Corporation | Internal heating trace assembly |
| CN114126112A (zh) * | 2021-11-23 | 2022-03-01 | 浙江波仕科技有限公司 | 一种高分子电热膜电极及其生产工艺 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03246901A (ja) * | 1990-02-23 | 1991-11-05 | Hitachi Ltd | 厚膜抵抗組成物、該組成物を用いたハイブリッドicおよびその製法 |
| DE69320098T2 (de) * | 1992-05-15 | 1999-04-01 | Denso Corp., Kariya, Aichi | Kaltleiterthermistor für Heizgeräte und Verfahren zur Herstellung |
| JPH0794260A (ja) * | 1993-07-30 | 1995-04-07 | Toshiba Lighting & Technol Corp | ヒータおよび定着装置 |
| JPH07140022A (ja) * | 1993-11-16 | 1995-06-02 | Matsushita Electric Ind Co Ltd | 抵抗素子用ペースト、抵抗素子および力学量センサ |
| JPH07297008A (ja) * | 1994-03-04 | 1995-11-10 | Komatsu Ltd | 正特性サーミスタおよびこれを用いたサーミスタ装置 |
| EP0749132A4 (en) * | 1994-03-04 | 1997-05-14 | Komatsu Mfg Co Ltd | THERMISTOR WITH POSITIVE TEMPERATURE COEFFICIENT |
| US5702653A (en) * | 1995-07-11 | 1997-12-30 | Spectrol Electronics Corporation | Thick-film circuit element |
| JP3927250B2 (ja) * | 1995-08-16 | 2007-06-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 窒化アルミニウム基板用厚膜導体ペースト組成物 |
| CN1202511A (zh) * | 1998-06-02 | 1998-12-23 | 武汉景辉科技发展有限公司 | 厚膜高温发热材料 |
| US6443999B1 (en) * | 2000-03-16 | 2002-09-03 | The Gillette Company | Lithium cell with heat formed separator |
| US6723420B2 (en) * | 2001-04-09 | 2004-04-20 | Morgan Chemical Products, Inc. | Thick film paste systems for circuits on diamond substrates |
| JPWO2003021664A1 (ja) * | 2001-08-31 | 2005-07-07 | 株式会社日立製作所 | 半導体装置、構造体及び電子装置 |
| JP3797281B2 (ja) * | 2001-09-20 | 2006-07-12 | 株式会社村田製作所 | 積層セラミック電子部品の端子電極用導電性ペースト、積層セラミック電子部品の製造方法、積層セラミック電子部品 |
| JP3807609B2 (ja) * | 2002-03-07 | 2006-08-09 | Tdk株式会社 | セラミック電子部品及びその製造方法 |
| US6780494B2 (en) * | 2002-03-07 | 2004-08-24 | Tdk Corporation | Ceramic electronic device and method of production of same |
| CN1273560C (zh) * | 2003-09-01 | 2006-09-06 | 王培英 | 半导瓷厚膜发热材料 |
-
2004
- 2004-07-28 CN CNB2004100508301A patent/CN100386829C/zh not_active Expired - Lifetime
-
2005
- 2005-07-15 EP EP05766847.7A patent/EP1791396B1/en not_active Expired - Lifetime
- 2005-07-15 US US11/658,793 patent/US7800028B2/en not_active Expired - Fee Related
- 2005-07-15 WO PCT/CN2005/001052 patent/WO2006010317A1/zh not_active Ceased
- 2005-07-15 JP JP2007522901A patent/JP4874244B2/ja not_active Expired - Fee Related
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