JP2008500728A - シリサイド層を有する半導体素子の製造方法 - Google Patents
シリサイド層を有する半導体素子の製造方法 Download PDFInfo
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- JP2008500728A JP2008500728A JP2007515098A JP2007515098A JP2008500728A JP 2008500728 A JP2008500728 A JP 2008500728A JP 2007515098 A JP2007515098 A JP 2007515098A JP 2007515098 A JP2007515098 A JP 2007515098A JP 2008500728 A JP2008500728 A JP 2008500728A
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- 229910021332 silicide Inorganic materials 0.000 title claims abstract description 137
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 155
- 239000002184 metal Substances 0.000 claims abstract description 155
- 238000000034 method Methods 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 31
- 229920005591 polysilicon Polymers 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 238000000059 patterning Methods 0.000 claims description 15
- 239000010941 cobalt Substances 0.000 claims description 14
- 229910017052 cobalt Inorganic materials 0.000 claims description 14
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 12
- 238000000231 atomic layer deposition Methods 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910021341 titanium silicide Inorganic materials 0.000 claims description 3
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021334 nickel silicide Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 151
- 239000010408 film Substances 0.000 description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 238000005468 ion implantation Methods 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000000137 annealing Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000008901 benefit Effects 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- 102100022717 Atypical chemokine receptor 1 Human genes 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 101000678879 Homo sapiens Atypical chemokine receptor 1 Proteins 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- -1 silicide metals Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide
- H01L29/66507—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide providing different silicide thicknesses on the gate and on source or drain
-
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28052—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a silicide layer formed by the silicidation reaction of silicon with a metal layer
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28061—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3215—Doping the layers
- H01L21/32155—Doping polycristalline - or amorphous silicon layers
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Abstract
Description
当業者であれば、これらの図における構成要素が説明を簡単かつ明瞭にするために示され、そして必ずしも寸法通りには描かれていないことが分かるであろう。例えば、これらの図における幾つかの構成要素の寸法を他の構成要素に対して誇張して描いて本発明の実施形態を理解し易くしている。
Claims (21)
- 半導体基板を設ける工程と、
絶縁層を半導体基板の上に形成する工程と、
導電層を絶縁層の上に形成する工程と、
第1膜厚を有する第1金属シリサイド層を導電層の上に形成する工程と、
導電層をパターニングして、制御電極の一部分であるパターニング済み第1層を形成する工程と、
パターニング済み第1金属シリサイド層を制御電極の上に残すように第1金属シリサイド層をパターニングして、パターニング済み第1金属シリサイド層を制御電極の上に形成する工程と、
第2金属シリサイド層は第2膜厚を有し、かつ第2金属シリサイドの第2膜厚は第1金属シリサイドの第1膜厚よりも厚い、第2金属シリサイド層をパターニング済み第1金属シリサイド層の上に形成する工程とを備える、半導体素子の製造方法。 - 第1金属シリサイド層を第1層の上に形成する処理では更に、第1金属シリサイド層を、化学気相成長法(CVD)及び原子層堆積法(ALD)から成るグループから選択されるプロセスを使用して堆積させる、請求項1記載の方法。
- 第1金属シリサイド層を第1層の上に形成する処理では更に、
金属層を第1層の上にスパッタリング法により堆積させる工程と、
第1アニールを第1の温度で行う工程と、
第2アニールを第1の温度よりも高い第2の温度で行う工程とを備える、請求項1記載の方法。 - 第1金属シリサイド層を形成する処理では更に、窒素を第1金属シリサイド層にイオン注入する、請求項3記載の方法。
- 第1膜厚は約25ナノメートル未満であり、かつ第2膜厚は約40ナノメートル未満である、請求項1記載の方法。
- 第1金属シリサイド層を形成する処理では、ニッケルシリサイド、コバルトシリサイド、及びチタンシリサイドから成るグループから選択される第1金属シリサイド層を形成する、請求項1記載の方法。
- 第1金属シリサイド及び第2金属シリサイドは同じ材料である、請求項6記載の方法。
- 第1金属シリサイド及び第2金属シリサイドは異なる材料である、請求項6記載の方法。
- 金属層を導電層の下に形成する工程と、
金属層をパターニングして制御電極の一部分を形成する工程とをさらに備える、請求項1記載の方法。 - 半導体基板を設ける工程と、
絶縁層を半導体基板の上に形成する工程と、
ポリシリコン層を絶縁層の上に形成する工程と、
シリコンと、コバルト及びニッケルの内の一つと、を含む第1金属シリサイド層を第1層の上に形成する工程と、
第1金属シリサイド層及びポリシリコン層をパターニングする工程と、
第2金属シリサイドをパターニング済み金属シリサイド層の上に形成する工程とを備える、半導体素子の製造方法。 - 第2金属シリサイドは第1金属シリサイドとは異なる材料である、請求項10記載の方法。
- 第2金属シリサイドは第1金属シリサイドと同じ材料である、請求項10記載の方法。
- 第1金属シリサイド層を第1層の上に形成する工程では更に、第1金属シリサイド層を、化学気相成長法(CVD)及び原子層堆積法(ALD)から成るグループから選択されるプロセスを使用して堆積させる、請求項10記載の方法。
- 第1金属シリサイド層を第1層の上に形成する工程は更に、
金属層を第1層の上にスパッタリング法により堆積させる工程と、
第1アニールを第1の温度で行う工程と、
第2アニールを第1の温度よりも高い第2の温度で行う工程とを備える、請求項10記載の方法。 - 第1金属シリサイド層を形成する工程では更に、窒素を第1金属シリサイド層にイオン注入する、請求項14記載の方法。
- 第1金属シリサイド層は第1膜厚を有し、かつ第2金属シリサイド層は第2膜厚を有し、第1膜厚は第2膜厚よりも薄い、請求項10記載の方法。
- 第1膜厚は約25ナノメートル未満であり、かつ第2膜厚は約40ナノメートル未満である、請求項16記載の方法。
- 金属層を導電層の下に形成する工程と、
金属層をパターニングして制御電極の一部分を形成する工程とをさらに備える、請求項10記載の方法。 - 半導体基板を設ける工程と、
シリコンを含む上部層を備えるゲート電極積層構造を半導体基板の上に形成する工程と、
ニッケル及びコバルトの内の一つを含む第1金属シリサイド層を上部層の上に形成する工程と、
ゲート電極積層構造をパターニングしてゲート電極を形成する工程と、
ゲート電極積層構造の上の第1金属シリサイド層をパターニングしてパターニング済み第1金属シリサイド層を形成する工程と、
ゲート電極に横方向に隣接する半導体基板に不純物をドープして活性領域を形成する工程と、
第2金属シリサイド層を第1金属シリサイド層及び活性領域の上に形成する工程とを備える、半導体素子の製造方法。 - ゲート電極積層構造は上部層を含む、請求項19記載の方法。
- ゲート電極積層構造は更に、金属を含む下部層を含む、請求項20記載の方法。
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US10/854,389 US7235471B2 (en) | 2004-05-26 | 2004-05-26 | Method for forming a semiconductor device having a silicide layer |
US10/854,389 | 2004-05-26 | ||
PCT/US2005/014324 WO2005119752A1 (en) | 2004-05-26 | 2005-04-26 | Method for forming a semiconductor device having a silicide layer |
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JP2008500728A true JP2008500728A (ja) | 2008-01-10 |
JP2008500728A5 JP2008500728A5 (ja) | 2008-05-29 |
JP5103174B2 JP5103174B2 (ja) | 2012-12-19 |
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JP (1) | JP5103174B2 (ja) |
CN (1) | CN100541738C (ja) |
TW (1) | TWI391993B (ja) |
WO (1) | WO2005119752A1 (ja) |
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KR100587686B1 (ko) * | 2004-07-15 | 2006-06-08 | 삼성전자주식회사 | 질화 티타늄막 형성방법 및 이를 이용한 커패시터 제조방법 |
US7538026B1 (en) * | 2005-04-04 | 2009-05-26 | Advanced Micro Devices, Inc. | Multilayer low reflectivity hard mask and process therefor |
JP2007048893A (ja) * | 2005-08-09 | 2007-02-22 | Fujifilm Corp | 固体撮像素子およびその製造方法 |
JP2010003742A (ja) * | 2008-06-18 | 2010-01-07 | Fujitsu Microelectronics Ltd | 半導体装置、及び薄膜キャパシタの製造方法 |
KR101037495B1 (ko) * | 2008-07-31 | 2011-05-26 | 주식회사 하이닉스반도체 | 고집적 반도체 장치의 제조 방법 및 반도체 장치 |
WO2010025124A1 (en) * | 2008-08-25 | 2010-03-04 | The Trustees Of Boston College | Methods of fabricating complex two-dimensional conductive silicides |
US8216436B2 (en) * | 2008-08-25 | 2012-07-10 | The Trustees Of Boston College | Hetero-nanostructures for solar energy conversions and methods of fabricating same |
US20170170016A1 (en) * | 2015-12-14 | 2017-06-15 | Globalfoundries Inc. | Multiple patterning method for substrate |
US11424338B2 (en) | 2020-03-31 | 2022-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal source/drain features |
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- 2005-04-26 CN CNB2005800171377A patent/CN100541738C/zh not_active Expired - Fee Related
- 2005-04-26 WO PCT/US2005/014324 patent/WO2005119752A1/en active Application Filing
- 2005-04-26 JP JP2007515098A patent/JP5103174B2/ja not_active Expired - Fee Related
- 2005-05-16 TW TW094115820A patent/TWI391993B/zh not_active IP Right Cessation
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US20050277275A1 (en) | 2005-12-15 |
US7235471B2 (en) | 2007-06-26 |
TW200618067A (en) | 2006-06-01 |
CN1961411A (zh) | 2007-05-09 |
WO2005119752A1 (en) | 2005-12-15 |
CN100541738C (zh) | 2009-09-16 |
JP5103174B2 (ja) | 2012-12-19 |
TWI391993B (zh) | 2013-04-01 |
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