JP2008262780A - コンタクトおよびコネクタ - Google Patents
コンタクトおよびコネクタ Download PDFInfo
- Publication number
- JP2008262780A JP2008262780A JP2007103892A JP2007103892A JP2008262780A JP 2008262780 A JP2008262780 A JP 2008262780A JP 2007103892 A JP2007103892 A JP 2007103892A JP 2007103892 A JP2007103892 A JP 2007103892A JP 2008262780 A JP2008262780 A JP 2008262780A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- electroforming
- voltage application
- connector
- application direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005323 electroforming Methods 0.000 claims abstract description 38
- 239000012212 insulator Substances 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/20—Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
【解決手段】コネクタは、電気鋳造によって形成され、絶縁物によって固定される保持部8と、導電部材に導電接触する接触部10と、保持部8および接触部10を接続する弾性変形可能なばね部9とを有し、接触部10は、略電気鋳造の電圧印加方向に導電部材と摺接し、ばね部9は、電気鋳造の電圧印加方向に垂直な方向に弾性変形するコンタクト5を有する。
【選択図】図5
Description
図1に、本発明の1つの実施形態のコネクタ1を示す。コネクタ1は、ソケット(第1接続部材)2とプラグ(第2接続部材)3とからなる。
2 ソケット(第1接続部材)
3 プラグ(第2接続部材)
4 ハウジング
5 雌型コンタクト
6 ハウジング
7 雄型コンタクト
8 保持部
9 ばね部
10 当接部
11 電極部
13 当接突起
14 保持部
15 アーム部
16 電極部
17 当接面
18 段差
19 圧入部
21 母型
22 キャビティ
23 絶縁膜
Claims (8)
- 電気鋳造によって形成され、
前記電気鋳造の電圧印加方向に略垂直な方向に延伸し、
一端に前記電気鋳造の電圧印加方向に沿って導電部材に摺接する接触部を有することを特徴とするコンタクト。 - 絶縁物によって固定される保持部と、前記接触部および前記保持部を接続する弾性変形可能なばね部とを有し、
前記ばね部は、前記電気鋳造の電圧印加方向に垂直な方向に弾性変形することを特徴とする請求項1に記載のコンタクト。 - 前記ばね部は、前記電圧印加方向に湾曲していることを特徴とする請求項2に記載のコンタクト。
- 回路に接続される電極部を、前記保持部から前記ばね部と反対側に延伸して設けたことを特徴とする請求項2または3に記載のコンタクト。
- 前記接触部の先端に、その一部だけが前記電気鋳造の電圧印加方向に連続して突出してなる圧入部を設けたことを特徴とする請求項1に記載のコンタクト。
- 請求項1から5のいずれかに記載のコンタクトを、前記電気鋳造の電圧印加方向に垂直な方向に複数配列して保持することを特徴とするコネクタ。
- 請求項2から4のいずれかに記載のコンタクトを、前記電気鋳造の電圧印加方向に垂直な方向に複数配列して保持する第1接続部材と、
前記コンタクトの接触部に当接する導電部材を、前記電気鋳造の電圧印加方向に垂直な方向に複数配列して保持する第2接続部材とからなることを特徴とするコネクタ。 - 前記導電部材は、請求項5に記載のコンタクトであることを特徴とする請求項7に記載のコネクタ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007103892A JP4967771B2 (ja) | 2007-04-11 | 2007-04-11 | コンタクトおよびコネクタ |
TW097110289A TWI366959B (en) | 2007-04-11 | 2008-03-24 | Contact and connector |
US12/595,089 US8337261B2 (en) | 2007-04-11 | 2008-04-07 | Contacts formed by electroforming and extended in direction roughly perpendicular to voltage application direction in electroperforming |
KR1020097019859A KR101045172B1 (ko) | 2007-04-11 | 2008-04-07 | 콘택트 및 커넥터 |
CN2008800116373A CN101652905B (zh) | 2007-04-11 | 2008-04-07 | 触头及连接器 |
PCT/JP2008/056879 WO2008126826A1 (ja) | 2007-04-11 | 2008-04-07 | コンタクトおよびコネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007103892A JP4967771B2 (ja) | 2007-04-11 | 2007-04-11 | コンタクトおよびコネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008262780A true JP2008262780A (ja) | 2008-10-30 |
JP4967771B2 JP4967771B2 (ja) | 2012-07-04 |
Family
ID=39863923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007103892A Active JP4967771B2 (ja) | 2007-04-11 | 2007-04-11 | コンタクトおよびコネクタ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8337261B2 (ja) |
JP (1) | JP4967771B2 (ja) |
KR (1) | KR101045172B1 (ja) |
CN (1) | CN101652905B (ja) |
TW (1) | TWI366959B (ja) |
WO (1) | WO2008126826A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8785035B2 (en) | 2010-03-11 | 2014-07-22 | Omron Corporation | Composition for manufacturing contacts, and contacts and connector using same |
KR101453393B1 (ko) | 2012-06-28 | 2014-10-22 | 니혼 고꾸 덴시 고교 가부시끼가이샤 | 하우징리스 커넥터 |
US9574280B2 (en) | 2011-12-15 | 2017-02-21 | Omron Corporation | Contact and electronic component using the same |
WO2024009971A1 (ja) * | 2022-07-08 | 2024-01-11 | 京セラ株式会社 | コネクタ及び電子機器 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5713052B2 (ja) * | 2013-06-13 | 2015-05-07 | オムロン株式会社 | 接続端子 |
JP6084133B2 (ja) * | 2013-08-08 | 2017-02-22 | 日本航空電子工業株式会社 | コネクタ |
JP6269337B2 (ja) * | 2014-06-16 | 2018-01-31 | オムロン株式会社 | プローブピン、および、これを用いた電子デバイス |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0973959A (ja) * | 1995-09-05 | 1997-03-18 | Fujitsu Takamizawa Component Kk | 低背コネクタ、その製造方法及びプリント配線板の接続方法 |
JP2003232809A (ja) * | 1996-05-17 | 2003-08-22 | Formfactor Inc | 超小型電子接触構造及びその製造方法 |
JP2006114268A (ja) * | 2004-10-13 | 2006-04-27 | Sumitomo Electric Ind Ltd | 接触子、その製造方法および接触子対 |
JP2007086025A (ja) * | 2005-09-26 | 2007-04-05 | Sumitomo Electric Ind Ltd | コンタクトプローブ、プローブユニットおよびプローブカード |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW238431B (ja) * | 1992-12-01 | 1995-01-11 | Stanford W Crane Jr | |
JP3774968B2 (ja) | 1996-01-19 | 2006-05-17 | 住友電気工業株式会社 | マイクロコネクタおよびその製造方法 |
JP3685908B2 (ja) * | 1997-05-30 | 2005-08-24 | 富士通コンポーネント株式会社 | 高速伝送用コネクタ |
KR100804924B1 (ko) * | 2001-08-22 | 2008-02-20 | 스미토모덴키고교가부시키가이샤 | 도전페이스트와 그것을 이용한 도전막, 도금방법 및미세금속부품의 제조방법 |
EP1369504A1 (en) * | 2002-06-05 | 2003-12-10 | Hille & Müller | Metal strip for the manufacture of components for electrical connectors |
JP2004055436A (ja) | 2002-07-23 | 2004-02-19 | Nissin Electric Co Ltd | 燃料電池、そのガス分離板およびその製造方法 |
US6881075B2 (en) * | 2003-07-08 | 2005-04-19 | Cheng Uei Precision Industry Co., Ltd. | Board-to-board connector |
TW200514305A (en) * | 2003-10-15 | 2005-04-16 | Comax Technology Inc | Contact terminal of connector |
JP3860823B2 (ja) * | 2004-08-19 | 2006-12-20 | 京セラエルコ株式会社 | コネクタ及びこのコネクタを備えた携帯端末 |
JP3887634B2 (ja) | 2004-08-30 | 2007-02-28 | 京セラエルコ株式会社 | コネクタ及びこのコネクタを備えた携帯端末 |
-
2007
- 2007-04-11 JP JP2007103892A patent/JP4967771B2/ja active Active
-
2008
- 2008-03-24 TW TW097110289A patent/TWI366959B/zh active
- 2008-04-07 CN CN2008800116373A patent/CN101652905B/zh active Active
- 2008-04-07 WO PCT/JP2008/056879 patent/WO2008126826A1/ja active Application Filing
- 2008-04-07 US US12/595,089 patent/US8337261B2/en active Active
- 2008-04-07 KR KR1020097019859A patent/KR101045172B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0973959A (ja) * | 1995-09-05 | 1997-03-18 | Fujitsu Takamizawa Component Kk | 低背コネクタ、その製造方法及びプリント配線板の接続方法 |
JP2003232809A (ja) * | 1996-05-17 | 2003-08-22 | Formfactor Inc | 超小型電子接触構造及びその製造方法 |
JP2006114268A (ja) * | 2004-10-13 | 2006-04-27 | Sumitomo Electric Ind Ltd | 接触子、その製造方法および接触子対 |
JP2007086025A (ja) * | 2005-09-26 | 2007-04-05 | Sumitomo Electric Ind Ltd | コンタクトプローブ、プローブユニットおよびプローブカード |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8785035B2 (en) | 2010-03-11 | 2014-07-22 | Omron Corporation | Composition for manufacturing contacts, and contacts and connector using same |
US9574280B2 (en) | 2011-12-15 | 2017-02-21 | Omron Corporation | Contact and electronic component using the same |
KR101453393B1 (ko) | 2012-06-28 | 2014-10-22 | 니혼 고꾸 덴시 고교 가부시끼가이샤 | 하우징리스 커넥터 |
WO2024009971A1 (ja) * | 2022-07-08 | 2024-01-11 | 京セラ株式会社 | コネクタ及び電子機器 |
Also Published As
Publication number | Publication date |
---|---|
US20100065430A1 (en) | 2010-03-18 |
CN101652905B (zh) | 2011-11-30 |
TWI366959B (en) | 2012-06-21 |
KR101045172B1 (ko) | 2011-06-30 |
TW200847538A (en) | 2008-12-01 |
US8337261B2 (en) | 2012-12-25 |
WO2008126826A1 (ja) | 2008-10-23 |
JP4967771B2 (ja) | 2012-07-04 |
CN101652905A (zh) | 2010-02-17 |
KR20090125129A (ko) | 2009-12-03 |
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