JP2008227491A - 基板移送用高温抗垂下エンドエフェクター - Google Patents
基板移送用高温抗垂下エンドエフェクター Download PDFInfo
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- JP2008227491A JP2008227491A JP2008057723A JP2008057723A JP2008227491A JP 2008227491 A JP2008227491 A JP 2008227491A JP 2008057723 A JP2008057723 A JP 2008057723A JP 2008057723 A JP2008057723 A JP 2008057723A JP 2008227491 A JP2008227491 A JP 2008227491A
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- end effector
- substrate
- mounting plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1638—Programme controls characterised by the control loop compensation for arm bending/inertia, pay load weight/inertia
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
【解決手段】エンドエフェクターは基板を支えるように配置し、その基板を水平面に対し第1角度に位置する基板支持面を有する自由端を含む。エンドエフェクターは基板ハンドラーに取付けるように配置した固定端を含み、基板が自由端上に配置されず、第1角度が第2角度と異なる場合には、基板支持面が水平面に対して第2角度になる位置でエンドエフェクターを基板ハンドラーに取付ける。
【選択図】図4
Description
本発明の実施形態は通常半導体プロセシング時の半導体基板の処理と移送に関する。より詳しくは本発明の実施形態は、半導体基板処理用ロボットと共に用いるエンドエフェクターに関する。
(関連技術の説明)
Claims (15)
- 基板ハンドラーと共に用いるエンドエフェクターであって、
基板を支持するように配置され、基板を水平面に対し第1角度に位置する基板支持面を有する自由端と、
基板ハンドラーに取付けるように配置された固定端を含み、基板が自由端に配置されず、第1角度が第2角度と異なる場合に、基板支持面が水平面に対して第2角度となる位置でエンドエフェクターを基板ハンドラーに取付けるエンドエフェクター。 - 第1角度と第2角度間の差異は、エンドエフェクターの構造、エンドエフェクターの材料、基板のサイズと重量又は操作温度により予め定められる請求項1記載のエンドエフェクター。
- 固定端が自由端の基板支持板に実質的に平行な上面を有し、底面が上面に対し傾斜している請求項1記載のエンドエフェクター。
- 傾斜角が第1角度と第2角度の差に対応する請求項3記載のエンドエフェクター。
- 自由端が、その上の基板を基板端と接触することなしに支えるように配置した3個の支持隆起体を含む請求項1記載のエンドエフェクター。
- 固定端がエンドエフェクターの中心線近くの位置合せノッチを有し、位置合せノッチはエンドエフェクターを基板ハンドラーに位置合せするように配置された請求項1記載のエンドエフェクター。
- 基板ハンドラーと共に用いるエンドエフェクターであって、
その上にある基板を支えるように配置した基板支持面を有する自由端を含み、基板支持面が第1平面に延び、
基板ハンドラーにエンドエフェクターを固定するように配置した取付け面を有する固定端を含み、取付け面が第2平面に延び、第1平面が第2平面と交差するエンドエフェクター。 - 固定端が、エンドエフェクターを基板ハンドラーと位置合わせするように配置した固定エンドエフェクター中心線近くに形成した位置合わせノッチを有する請求項7記載のエンドエフェクター。
- 取付け板とエンドエフェクター間の熱膨張差に対応可能な基板ハンドラー取付け板の取付け空洞内に位置するように固定端を配置し、エンドエフェクター中心線近くに形成した位置合せノッチと、取付け板に形成のセンター出し穴にだぼピンを挿入して固定端を取付け板に位置合せする請求項8記載のエンドエフェクター。
- 基板ハンドラーであって、
取付け板を有する動作アームと、
基板を支えるように配置されたエンドエフェクターを含み、
エンドエフェクターが、水平面に対し第1角度で基板を支えるように配置した基板支持面を有する自由端と、
動作アームの取付け板に取付けた固定端を含み、基板が自由端上に配置されず、第1角度が第2角度と異なる場合には、基板支持面が水平面に対し第2角度になる位置でエンドエフェクターを取付け板に取付ける基板ハンドラー。 - 取付け板にエンドエフェクターを取付けるように配置したクランプ部材を含み、エンドエフェクターをクランプ部材と取付け板の間に積み重ねる請求項10記載の基板ハンドラー。
- 固定端がエンドエフェクターの中心線近くに形成した位置合せノッチを有し、位置合せノッチがエンドエフェクターと取付け板と位置合せするように配置した請求項10記載の基板ハンドラー。
- 取付け板がエンドエフェクター底面を受けるように配置した取付け面を有し、取付け面を水平に配置し、底面が基板支持面に対して傾斜している請求項10記載の基板ハンドラー。
- 取付け板がエンドエフェクター底面を受けるように配置した取付け面を有し、取付け面が水平面に対し傾斜し、底面が基板支持面に平行な請求項10記載の基板ハンドラー。
- エンドエフェクターがアルミニウム製であり、取付け板がチタン製である請求項10記載の基板ハンドラー。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89409807P | 2007-03-09 | 2007-03-09 | |
US60/894,098 | 2007-03-09 |
Publications (2)
Publication Number | Publication Date |
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JP2008227491A true JP2008227491A (ja) | 2008-09-25 |
JP5800447B2 JP5800447B2 (ja) | 2015-10-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008057723A Active JP5800447B2 (ja) | 2007-03-09 | 2008-03-07 | 基板移送用高温抗垂下エンドエフェクター |
Country Status (7)
Country | Link |
---|---|
US (1) | US9443752B2 (ja) |
EP (1) | EP1968110B1 (ja) |
JP (1) | JP5800447B2 (ja) |
KR (1) | KR100989721B1 (ja) |
CN (1) | CN101303994B (ja) |
SG (1) | SG146547A1 (ja) |
TW (1) | TWI455226B (ja) |
Cited By (2)
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---|---|---|---|---|
KR20180133532A (ko) * | 2016-05-05 | 2018-12-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 로봇 서브어셈블리들, 엔드 이펙터 어셈블리들, 및 감소된 균열을 갖는 방법들 |
KR20220043201A (ko) * | 2019-08-08 | 2022-04-05 | 램 리써치 코포레이션 | 멀티-스테이션 프로세스 모듈에서 웨이퍼 이송을 위한 스핀들 어셈블리 (spindle assembly) |
Families Citing this family (7)
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CN104658958B (zh) * | 2015-02-13 | 2018-04-24 | 苏州工业园区纳米产业技术研究院有限公司 | 晶片抓取手臂 |
CN106032014A (zh) * | 2015-03-13 | 2016-10-19 | 上海理想万里晖薄膜设备有限公司 | 一种机械手臂 |
CN105575865A (zh) * | 2015-12-23 | 2016-05-11 | 苏州工业园区纳米产业技术研究院有限公司 | 一种适用于深硅刻蚀后薄片的深硅机台手臂的结构改造及改造方法 |
US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
US20190013215A1 (en) * | 2017-07-05 | 2019-01-10 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying apparatus including the same |
CN109461693B (zh) | 2017-09-06 | 2023-06-02 | 台湾积体电路制造股份有限公司 | 晶片传送装置、晶片处理系统及方法 |
KR102322129B1 (ko) | 2019-06-07 | 2021-11-04 | 블루테크코리아 주식회사 | 반도체 로봇용 엔드이펙터 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20180133532A (ko) * | 2016-05-05 | 2018-12-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 로봇 서브어셈블리들, 엔드 이펙터 어셈블리들, 및 감소된 균열을 갖는 방법들 |
JP2019519913A (ja) * | 2016-05-05 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 亀裂が低減されたロボットサブアセンブリ、エンドエフェクタアセンブリ、及び方法 |
KR102195800B1 (ko) * | 2016-05-05 | 2020-12-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 로봇 서브어셈블리들, 엔드 이펙터 어셈블리들, 및 감소된 균열을 갖는 방법들 |
TWI736607B (zh) * | 2016-05-05 | 2021-08-21 | 美商應用材料股份有限公司 | 機械手臂次組件、端效器組件,及具有減少斷裂的方法 |
KR20220043201A (ko) * | 2019-08-08 | 2022-04-05 | 램 리써치 코포레이션 | 멀티-스테이션 프로세스 모듈에서 웨이퍼 이송을 위한 스핀들 어셈블리 (spindle assembly) |
KR102631418B1 (ko) | 2019-08-08 | 2024-01-29 | 램 리써치 코포레이션 | 멀티-스테이션 프로세스 모듈에서 웨이퍼 이송을 위한 스핀들 어셈블리 (spindle assembly) |
Also Published As
Publication number | Publication date |
---|---|
CN101303994A (zh) | 2008-11-12 |
KR20080082922A (ko) | 2008-09-12 |
EP1968110A3 (en) | 2013-12-04 |
CN101303994B (zh) | 2011-05-18 |
TW200845267A (en) | 2008-11-16 |
EP1968110A2 (en) | 2008-09-10 |
US9443752B2 (en) | 2016-09-13 |
SG146547A1 (en) | 2008-10-30 |
US20080219815A1 (en) | 2008-09-11 |
KR100989721B1 (ko) | 2010-10-26 |
TWI455226B (zh) | 2014-10-01 |
JP5800447B2 (ja) | 2015-10-28 |
EP1968110B1 (en) | 2020-09-23 |
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