JP5800447B2 - 基板移送用高温抗垂下エンドエフェクター - Google Patents
基板移送用高温抗垂下エンドエフェクター Download PDFInfo
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- JP5800447B2 JP5800447B2 JP2008057723A JP2008057723A JP5800447B2 JP 5800447 B2 JP5800447 B2 JP 5800447B2 JP 2008057723 A JP2008057723 A JP 2008057723A JP 2008057723 A JP2008057723 A JP 2008057723A JP 5800447 B2 JP5800447 B2 JP 5800447B2
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- Japan
- Prior art keywords
- end effector
- substrate
- mounting plate
- substrate handler
- free end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1638—Programme controls characterised by the control loop compensation for arm bending/inertia, pay load weight/inertia
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
本発明の実施形態は通常半導体プロセシング時の半導体基板の処理と移送に関する。より詳しくは本発明の実施形態は、半導体基板処理用ロボットと共に用いるエンドエフェクターに関する。
(関連技術の説明)
Claims (9)
- 基板ハンドラーと共に用いるエンドエフェクターであって、
基板を支持するように構成された基板支持面を形成する2以上の棚を有する自由端であって、自由端は、2つの外向き縁及び1つの内向き縁によって規定され、2つの外向き縁は、砂時計形状に曲がり、次いで先細りして凹部を形成する自由端と、
基板ハンドラーに取付けるように構成された固定端を含み、固定端は上面と底面を有し、固定端の底面は基板ハンドラーに付くように構成され、底面は上面に対し傾斜しており、傾斜はエンドエフェクターの傾斜取り付けを容易にするように形成され、傾斜角は自由端上に支持された基板の重量によって引き起こる自由端の垂下を打ち消すように決められるアルミニウム製エンドエフェクター。 - 自由端が、その上の基板を基板端と接触することなしに支えるように配置した3個の棚を含む請求項1記載のエンドエフェクター。
- 固定端がエンドエフェクターの中心線近くの位置合せノッチを有し、位置合せノッチはエンドエフェクターを基板ハンドラーに位置合せするように構成された請求項1記載のエンドエフェクター。
- 基板ハンドラー取付け板とエンドエフェクター間の熱膨張差に対応可能な基板ハンドラー取付け板の取付け空洞内に位置するように固定端を構成し、エンドエフェクター中心線近くに形成した位置合せノッチと、基板ハンドラー取付け板に形成したセンター出し穴にだぼピンを挿入して固定端を基板ハンドラー取付け板に位置合せする請求項3記載のエンドエフェクター。
- 基板ハンドラーであって、
取付け板を有する動作アームと、
基板を支えるように構成されたアルミニウム製エンドエフェクターを含み、
エンドエフェクターが、基板を支えるように構成された基板支持面を形成する2以上の棚を有する自由端であって、自由端は、2つの外向き縁及び1つの内向き縁によって規定され、2つの外向き縁は、砂時計形状に曲がり、次いで先細りして凹部を形成する自由端と、
動作アームの取付け板に取付けた固定端を含み、固定端は上面と底面を有し、固定端の底面は取付け板に取り付けられ、底面は上面に対し傾斜しており、傾斜はエンドエフェクターの傾斜取り付けを容易にするように形成され、傾斜は自由端によって支持された基板の重量によって引き起こる自由端の垂下を打ち消すように決められる基板ハンドラー。 - 取付け板にエンドエフェクターを取付けるように配置したクランプ部材を含み、エンドエフェクターをクランプ部材と取付け板の間に積み重ねる請求項5記載の基板ハンドラー。
- 固定端がエンドエフェクターの中心線近くに形成した位置合せノッチを有し、位置合せノッチがエンドエフェクターと取付け板とを位置合せするように構成された請求項5記載の基板ハンドラー。
- 取付け板がエンドエフェクターの底面を受けるように構成された取付け面を有し、取付け面を水平に配置している請求項5記載の基板ハンドラー。
- 取付け板がチタン製である請求項5記載の基板ハンドラー。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89409807P | 2007-03-09 | 2007-03-09 | |
US60/894,098 | 2007-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008227491A JP2008227491A (ja) | 2008-09-25 |
JP5800447B2 true JP5800447B2 (ja) | 2015-10-28 |
Family
ID=39493366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008057723A Active JP5800447B2 (ja) | 2007-03-09 | 2008-03-07 | 基板移送用高温抗垂下エンドエフェクター |
Country Status (7)
Country | Link |
---|---|
US (1) | US9443752B2 (ja) |
EP (1) | EP1968110B1 (ja) |
JP (1) | JP5800447B2 (ja) |
KR (1) | KR100989721B1 (ja) |
CN (1) | CN101303994B (ja) |
SG (1) | SG146547A1 (ja) |
TW (1) | TWI455226B (ja) |
Families Citing this family (9)
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CN104658958B (zh) * | 2015-02-13 | 2018-04-24 | 苏州工业园区纳米产业技术研究院有限公司 | 晶片抓取手臂 |
CN106032014A (zh) * | 2015-03-13 | 2016-10-19 | 上海理想万里晖薄膜设备有限公司 | 一种机械手臂 |
CN105575865A (zh) * | 2015-12-23 | 2016-05-11 | 苏州工业园区纳米产业技术研究院有限公司 | 一种适用于深硅刻蚀后薄片的深硅机台手臂的结构改造及改造方法 |
US10090188B2 (en) * | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
US20190013215A1 (en) * | 2017-07-05 | 2019-01-10 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate holding hand and substrate conveying apparatus including the same |
CN109461693B (zh) * | 2017-09-06 | 2023-06-02 | 台湾积体电路制造股份有限公司 | 晶片传送装置、晶片处理系统及方法 |
KR102322129B1 (ko) | 2019-06-07 | 2021-11-04 | 블루테크코리아 주식회사 | 반도체 로봇용 엔드이펙터 |
US20220262662A1 (en) * | 2019-08-08 | 2022-08-18 | Lam Research Corporation | Spindle assembly for wafer transfer in a multi-station process module |
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JPH0799225A (ja) * | 1993-09-27 | 1995-04-11 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
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-
2008
- 2008-03-07 US US12/044,401 patent/US9443752B2/en active Active
- 2008-03-07 TW TW097108171A patent/TWI455226B/zh active
- 2008-03-07 CN CN2008100074550A patent/CN101303994B/zh active Active
- 2008-03-07 JP JP2008057723A patent/JP5800447B2/ja active Active
- 2008-03-07 SG SG200801902-8A patent/SG146547A1/en unknown
- 2008-03-07 KR KR1020080021358A patent/KR100989721B1/ko active IP Right Grant
- 2008-03-10 EP EP08152541.2A patent/EP1968110B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1968110B1 (en) | 2020-09-23 |
CN101303994B (zh) | 2011-05-18 |
TW200845267A (en) | 2008-11-16 |
CN101303994A (zh) | 2008-11-12 |
EP1968110A3 (en) | 2013-12-04 |
US20080219815A1 (en) | 2008-09-11 |
KR100989721B1 (ko) | 2010-10-26 |
EP1968110A2 (en) | 2008-09-10 |
JP2008227491A (ja) | 2008-09-25 |
US9443752B2 (en) | 2016-09-13 |
SG146547A1 (en) | 2008-10-30 |
KR20080082922A (ko) | 2008-09-12 |
TWI455226B (zh) | 2014-10-01 |
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