JP2008192740A5 - - Google Patents

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Publication number
JP2008192740A5
JP2008192740A5 JP2007024228A JP2007024228A JP2008192740A5 JP 2008192740 A5 JP2008192740 A5 JP 2008192740A5 JP 2007024228 A JP2007024228 A JP 2007024228A JP 2007024228 A JP2007024228 A JP 2007024228A JP 2008192740 A5 JP2008192740 A5 JP 2008192740A5
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JP
Japan
Prior art keywords
wiring board
unit
substrate
unit wiring
wiring pattern
Prior art date
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Application number
JP2007024228A
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English (en)
Japanese (ja)
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JP2008192740A (ja
JP5174355B2 (ja
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Priority to JP2007024228A priority Critical patent/JP5174355B2/ja
Priority claimed from JP2007024228A external-priority patent/JP5174355B2/ja
Publication of JP2008192740A publication Critical patent/JP2008192740A/ja
Publication of JP2008192740A5 publication Critical patent/JP2008192740A5/ja
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Publication of JP5174355B2 publication Critical patent/JP5174355B2/ja
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JP2007024228A 2007-02-02 2007-02-02 配線基板及びその製造方法と半導体装置 Active JP5174355B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007024228A JP5174355B2 (ja) 2007-02-02 2007-02-02 配線基板及びその製造方法と半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007024228A JP5174355B2 (ja) 2007-02-02 2007-02-02 配線基板及びその製造方法と半導体装置

Publications (3)

Publication Number Publication Date
JP2008192740A JP2008192740A (ja) 2008-08-21
JP2008192740A5 true JP2008192740A5 (enExample) 2010-02-12
JP5174355B2 JP5174355B2 (ja) 2013-04-03

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ID=39752576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007024228A Active JP5174355B2 (ja) 2007-02-02 2007-02-02 配線基板及びその製造方法と半導体装置

Country Status (1)

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JP (1) JP5174355B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5577760B2 (ja) * 2009-03-09 2014-08-27 新光電気工業株式会社 パッケージ基板および半導体装置の製造方法
KR102471813B1 (ko) * 2018-03-16 2022-11-28 미쓰비시덴키 가부시키가이샤 기판 본딩 구조 및 기판 본딩 방법
JP2023006236A (ja) * 2021-06-30 2023-01-18 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383396A (ja) * 1989-08-28 1991-04-09 Fujitsu Ltd 多層プリント配線板
JPH08181417A (ja) * 1994-12-26 1996-07-12 Furukawa Electric Co Ltd:The 回路材の製造方法
JP3553043B2 (ja) * 2001-01-19 2004-08-11 松下電器産業株式会社 部品内蔵モジュールとその製造方法
JP2004014679A (ja) * 2002-06-05 2004-01-15 Fcm Kk 積層用回路基板および積層回路

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