JP2008182512A5 - - Google Patents

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Publication number
JP2008182512A5
JP2008182512A5 JP2007014669A JP2007014669A JP2008182512A5 JP 2008182512 A5 JP2008182512 A5 JP 2008182512A5 JP 2007014669 A JP2007014669 A JP 2007014669A JP 2007014669 A JP2007014669 A JP 2007014669A JP 2008182512 A5 JP2008182512 A5 JP 2008182512A5
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JP
Japan
Prior art keywords
electrode
temperature compensation
compensation layer
layer
forming
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JP2007014669A
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English (en)
Japanese (ja)
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JP2008182512A (ja
JP4978210B2 (ja
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Priority to JP2007014669A priority Critical patent/JP4978210B2/ja
Priority claimed from JP2007014669A external-priority patent/JP4978210B2/ja
Publication of JP2008182512A publication Critical patent/JP2008182512A/ja
Publication of JP2008182512A5 publication Critical patent/JP2008182512A5/ja
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Publication of JP4978210B2 publication Critical patent/JP4978210B2/ja
Expired - Fee Related legal-status Critical Current
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JP2007014669A 2007-01-25 2007-01-25 バルク音響振動子の製造方法 Expired - Fee Related JP4978210B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007014669A JP4978210B2 (ja) 2007-01-25 2007-01-25 バルク音響振動子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007014669A JP4978210B2 (ja) 2007-01-25 2007-01-25 バルク音響振動子の製造方法

Publications (3)

Publication Number Publication Date
JP2008182512A JP2008182512A (ja) 2008-08-07
JP2008182512A5 true JP2008182512A5 (enExample) 2010-02-25
JP4978210B2 JP4978210B2 (ja) 2012-07-18

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Family Applications (1)

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JP2007014669A Expired - Fee Related JP4978210B2 (ja) 2007-01-25 2007-01-25 バルク音響振動子の製造方法

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JP (1) JP4978210B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9240767B2 (en) * 2012-05-31 2016-01-19 Texas Instruments Incorporated Temperature-controlled integrated piezoelectric resonator apparatus
CN102904546B (zh) 2012-08-30 2016-04-13 中兴通讯股份有限公司 一种温度补偿能力可调节的压电声波谐振器
JP6885533B2 (ja) * 2017-01-27 2021-06-16 新日本無線株式会社 バルク弾性波共振器の製造方法
CN109831175B (zh) * 2018-12-26 2023-10-20 天津大学 一种薄膜体声波谐振器
CN115865037A (zh) * 2022-12-17 2023-03-28 河源市艾佛光通科技有限公司 温度补偿型薄膜体声波滤波器及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829211A (ja) * 1981-08-13 1983-02-21 Nec Corp 薄膜圧電振動子
JPS58137317A (ja) * 1982-02-09 1983-08-15 Nec Corp 圧電薄膜複合振動子
JP3514222B2 (ja) * 1999-11-17 2004-03-31 株式会社村田製作所 圧電共振子、電子部品及び電子機器
JP3498682B2 (ja) * 2000-06-23 2004-02-16 株式会社村田製作所 圧電共振子およびそれを用いた圧電フィルタ
DE10162580A1 (de) * 2001-12-19 2003-07-17 Infineon Technologies Ag Piezoelektrischer Schwingkreis, Verfahren zu dessen Herstellung und Filteranordnung
JP2005051685A (ja) * 2003-07-31 2005-02-24 Matsushita Electric Works Ltd 超音波センサの共振周波数調整方法及び装置
US7332985B2 (en) * 2003-10-30 2008-02-19 Avago Technologies Wireless Ip (Singapore) Pte Ltd. Cavity-less film bulk acoustic resonator (FBAR) devices
JP2005184491A (ja) * 2003-12-19 2005-07-07 Mitsubishi Electric Corp 圧電体薄膜素子ならびにその周波数調整方法および周波数調整装置
JP2007006542A (ja) * 2006-10-13 2007-01-11 Matsushita Electric Ind Co Ltd 圧電薄膜振動子及びその共振周波数調整方法

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