JP2008153638A - マーカー付き基板、マーカー付き基板の作製方法、レーザ照射装置、レーザ照射方法、露光装置及び半導体装置の作製方法 - Google Patents
マーカー付き基板、マーカー付き基板の作製方法、レーザ照射装置、レーザ照射方法、露光装置及び半導体装置の作製方法 Download PDFInfo
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Abstract
【解決手段】マーカー付き基板を、赤外光透過材料で形成されたステージ上に載置し、ステージ上に載置されたマーカー付き基板に設けられたマーカーを、赤外光を検知可能なカメラによって検出して、ステージの位置を制御し、レーザ発振器からレーザビームを射出し、レーザ発振器から射出されたレーザビームを光学系によって線状に加工し、ステージに載置されたマーカー付き基板に照射する。
【選択図】図3
Description
本実施の形態では、本発明に係るマーカー付き基板について図1を参照して説明する。
本実施の形態では、実施の形態1で示したマーカー付き基板の所望の位置にレーザビームを照射し、基板表面の半導体膜を結晶化する工程について説明する。
本実施の形態では、実施の形態1で示したマーカー付き基板を、フォトリソグラフィー法を用いた露光工程に適用する場合を示す。
本実施の形態においては、図3に示したレーザ照射装置または図4に示した露光装置を用いて、薄膜トランジスタ(TFT)を作製する工程について説明する。なお、本実施の形態ではトップゲート型(順スタガ型)TFTの作製方法を記載しているが、トップゲート型TFTに限らず、ボトムゲート型(逆スタガ型)TFTなどでも同様に本発明を用いることができる。但し、本発明は多くの異なる態様で実施することが可能であり、本発明の趣旨及びその範囲から逸脱することなくその形態及び詳細を様々に変更し得ることは、当業者であれば容易に理解される。従って、本実施の形態の記載内容に限定して解釈されるものではない。
本実施の形態では、薄膜集積回路または非接触型薄膜集積回路装置(無線チップ、無線ICタグ、RFID(無線認証、Radio Frequency Identification)とも呼ばれる)を図3のレーザ照射装置または図4の露光装置を用いて作製する過程を示す。但し、本発明は多くの異なる態様で実施することが可能であり、本発明の趣旨及びその範囲から逸脱することなくその形態及び詳細を様々に変更し得ることは、当業者であれば容易に理解される。従って、本実施の形態の記載内容に限定して解釈されるものではない。
本発明により、基板上の所望の位置に精度良く光源からの光線を照射することができ、所望の位置を均一にアニールする、または所望の位置を正確にパターン化することができるため、半導体装置の生産性、集積度の向上が可能となる。本発明の半導体装置を用いることで電子機器をスループット良く、良好な品質で作製することが可能になる。その具体例を図14、図15を用いて説明する。但し、本発明は多くの異なる態様で実施することが可能であり、本発明の趣旨及びその範囲から逸脱することなくその形態及び詳細を様々に変更し得ることは、当業者であれば容易に理解される。従って、本実施の形態の記載内容に限定して解釈されるものではない。
101 表面
102 裏面
103 窒化酸化珪素膜
104 酸化窒化珪素膜
105 半導体膜
106 マーカー形成膜
107 マーカー
108 マーカー
109 マーカー
110 マーカー
111 マーカー
120 マーカー
130 マーカー
Claims (25)
- 赤外光を透過する基板の一方の面に、マーカーとして機能する複数の開口部が設けられたマーカー形成膜を有し、
前記複数の開口部は、赤外光で検出されるマーカー付き基板。 - 請求項1において、
前記マーカー形成膜は、Al、Ag、Au、Pt、Ni、W、Cr、Mo、Fe、Co、Cu、Pd、Li、Cs、Mg、Ca、Sr、Ti、Rhのいずれかのうち少なくとも1種を含む膜であるマーカー付き基板。 - 赤外光を透過する基板の内部に設けられた複数のマーカーを有し、
前記マーカーは、赤外光で検出されるマーカー付き基板。 - 赤外光を透過する基板の一方の面にマーカー形成膜を形成し、
前記マーカー形成膜にマーカーとして機能する開口部を形成するマーカー付き基板の作製方法。 - 赤外光を透過する基板にレーザビームを照射し、
前記基板内部にマーカーを形成するマーカー付き基板の作製方法。 - レーザビームを射出するレーザ発振器と、
マーカー付き基板を載置するステージと、
前記レーザ発振器から射出されるレーザビームを線状に加工して前記ステージ上のマーカー付き基板に照射する光学系と、
前記ステージ上に載置されたマーカー付き基板のマーカーを検出するための、赤外光を検知するカメラと、を有するレーザ照射装置。 - 請求項6において、
前記ステージは、赤外光透過材料で形成されているレーザ照射装置。 - レーザビームを射出するレーザ発振器と、
マーカー付き基板を固定する吸着孔と、該マーカーと重なる領域に設けられた開口部と、を有するステージと、
前記レーザ発振器から射出されるレーザビームを線状に加工して、前記ステージ上のマーカー付き基板に照射する光学系と、
前記ステージ上に載置されたマーカー付き基板のマーカーを検出するための、赤外光を検知するカメラと、を有するレーザ照射装置。 - 請求項6乃至請求項8のいずれか一項において、
前記カメラの画像信号を元に、前記ステージを移動させる手段を有するレーザ照射装置。 - 請求項6乃至請求項9のいずれか一項において、
前記レーザビームの光路上に配置され、前記レーザビームが照射されるときに開くシャッターを有するレーザ照射装置。 - 請求項6乃至請求項10のいずれか一項において、
前記カメラとして、第1のカメラと前記第1のカメラよりも倍率の高い第2のカメラとを有するレーザ照射装置。 - 光線を射出する光源と、
マーカー付き基板を載置するステージと、
前記光源から射出される光線を前記ステージ上のマーカー付き基板に照射する光学系と、
前記ステージ上に載置されたマーカー付き基板のマーカーを検出するための、赤外光を検知するカメラと、を有する露光装置。 - 請求項12において、
前記ステージは、赤外光透過材料で形成されている露光装置。 - 光線を射出する光源と、
マーカー付き基板を固定する吸着孔と、該マーカーと重なる領域に設けられた開口部と、を有するステージと、
前記光源から射出される光線を前記ステージ上のマーカー付き基板に照射する光学系と、
前記ステージ上に載置されたマーカー付き基板のマーカーを検出するための、赤外光を検知するカメラと、を有する露光装置。 - 請求項12乃至請求項14のいずれか一項において、
前記カメラの画像信号を元に、前記ステージを移動させる手段を有する露光装置。 - 請求項12乃至請求項15のいずれか一項において、
前記光線の照射を制御するシャッターを有する露光装置。 - 請求項12乃至請求項16のいずれか一項において、
前記カメラとして、第1のカメラと前記第1のカメラよりも倍率の高い第2のカメラとを有する露光装置。 - マーカー付き基板を、赤外光透過材料で形成されたステージ上に載置し、
前記ステージ上に載置されたマーカー付き基板に設けられたマーカーを、赤外光を検知するカメラによって検出して、前記ステージの位置を制御し、
レーザ発振器からレーザビームを射出し、
前記レーザ発振器から射出されたレーザビームを光学系によって線状に加工して前記ステージに載置されたマーカー付き基板に照射するレーザ照射方法。 - マーカー付き基板を固定する吸着孔と、該マーカーと重なる領域に設けられた開口部と、を有するステージ上に、マーカー付き基板を載置し、
前記ステージ上に載置されたマーカー付き基板に設けられたマーカーを、赤外光を検知するカメラによって検出して、前記ステージの位置を制御し、
レーザ発振器からレーザビームを射出し、
前記レーザ発振器から射出されたレーザビームを光学系によって線状に加工して前記ステージに載置されたマーカー付き基板に照射するレーザ照射方法。 - 請求項18または請求項19において、
前記レーザビームを、照射時に開かれるシャッターを通過させるレーザ照射方法。 - 請求項18乃至請求項20のいずれか一項において、
前記カメラとして、第1のカメラと、前記第1のカメラよりも倍率の高い第2のカメラとを順に用いるレーザ照射方法。 - マーカー付き基板を、赤外光透過材料で形成されたステージ上に載置し、
前記ステージ上の前記マーカー付き基板に設けられたマーカーを、赤外光を検知するカメラによって検出して、前記ステージの位置を制御し、
レーザ発振器からレーザビームを射出し、
前記レーザ発振器から射出されたレーザビームを光学系によって線状に加工して前記マーカー付き基板に照射し、
前記マーカー付き基板に設けられた半導体膜を結晶化する半導体装置の作製方法。 - マーカー付き基板を固定する吸着孔と、該マーカーと重なる領域に設けられた開口部と、を有するステージ上に、マーカー付き基板を載置し、
前記ステージ上の前記マーカー付き基板に設けられたマーカーを、赤外光を検知するカメラによって検出して、前記ステージの位置を制御し、
レーザ発振器からレーザビームを射出し、
前記レーザ発振器から射出されたレーザビームを光学系によって線状に加工して前記マーカー付き基板に照射し、
前記マーカー付き基板に設けられた半導体膜を結晶化する半導体装置の作製方法。 - 請求項22または請求項23において、
前記マーカー付き基板は、マーカーを少なくとも2つ有し、
前記2つのマーカーを結ぶ線分と前記レーザビームの走査方向とが平行になるように前記ステージの位置を制御する半導体装置の作製方法。 - 請求項22乃至請求項24のいずれか一項において、
前記レーザビームの走査方向は、前記半導体膜をチャネル領域として用いたトランジスタのチャネル領域のキャリア移動方向と平行である半導体装置の作製方法。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012204485A (ja) * | 2011-03-24 | 2012-10-22 | Japan Steel Works Ltd:The | レーザアニール装置 |
US8809120B2 (en) | 2011-02-17 | 2014-08-19 | Infineon Technologies Ag | Method of dicing a wafer |
US9040389B2 (en) | 2012-10-09 | 2015-05-26 | Infineon Technologies Ag | Singulation processes |
CN106374335A (zh) * | 2016-10-31 | 2017-02-01 | 中国科学院上海光学精密机械研究所 | 集成电极电光调谐回音壁模式微腔的制备方法 |
KR20190110026A (ko) * | 2018-03-19 | 2019-09-27 | 파스포드 테크놀로지 주식회사 | 다이 본딩 장치 및 반도체 장치의 제조 방법 |
JP2021036347A (ja) * | 2020-12-04 | 2021-03-04 | キヤノン株式会社 | リソグラフィ装置、パターン形成方法及び物品の製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10171734B2 (en) * | 2012-02-27 | 2019-01-01 | Ovio Technologies, Inc. | Rotatable imaging system |
KR20140017086A (ko) * | 2012-07-30 | 2014-02-11 | 삼성디스플레이 주식회사 | 집적회로 및 이를 포함하는 표시 장치 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58197816A (ja) * | 1982-05-14 | 1983-11-17 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜結晶の製造方法 |
JPH02260419A (ja) * | 1989-03-30 | 1990-10-23 | Matsushita Electric Ind Co Ltd | レーザ照射方法 |
JPH04186725A (ja) * | 1990-11-21 | 1992-07-03 | Hitachi Ltd | レーザアニール装置及びアライメント法 |
JPH10163136A (ja) * | 1996-12-04 | 1998-06-19 | Unisia Jecs Corp | シリコンウエハの加工方法 |
JPH11121517A (ja) * | 1997-10-09 | 1999-04-30 | Hitachi Ltd | 半導体素子搭載装置および搭載方法 |
JP2000276233A (ja) * | 1999-03-24 | 2000-10-06 | Moritex Corp | 位置ずれ検出装置及びそれを用いた位置決め装置 |
JP2001274086A (ja) * | 2000-03-27 | 2001-10-05 | Matsushita Electric Ind Co Ltd | 多結晶シリコン薄膜の製造方法 |
JP2003100653A (ja) * | 2001-09-26 | 2003-04-04 | Sharp Corp | 加工装置および加工方法 |
JP2004221560A (ja) * | 2002-12-25 | 2004-08-05 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07109573A (ja) * | 1993-10-12 | 1995-04-25 | Semiconductor Energy Lab Co Ltd | ガラス基板および加熱処理方法 |
US6423585B1 (en) * | 1997-03-11 | 2002-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Heating treatment device, heating treatment method and fabrication method of semiconductor device |
JP2001007342A (ja) * | 1999-04-20 | 2001-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2001148600A (ja) | 1999-11-22 | 2001-05-29 | Matsushita Electric Ind Co Ltd | マーク認識方法及び位置合わせ装置 |
WO2002071470A1 (en) * | 2001-03-02 | 2002-09-12 | Toray Engineering Co., Ltd. | Chip mounting method and apparatus therefor |
JP2002350800A (ja) | 2001-05-30 | 2002-12-04 | Matsushita Electric Ind Co Ltd | 液晶パネルの製造方法 |
JP3903761B2 (ja) * | 2001-10-10 | 2007-04-11 | 株式会社日立製作所 | レ−ザアニ−ル方法およびレ−ザアニ−ル装置 |
US6700096B2 (en) | 2001-10-30 | 2004-03-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment |
JP3980465B2 (ja) | 2001-11-09 | 2007-09-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2003224084A (ja) | 2001-11-22 | 2003-08-08 | Semiconductor Energy Lab Co Ltd | 半導体製造装置 |
TWI291729B (en) | 2001-11-22 | 2007-12-21 | Semiconductor Energy Lab | A semiconductor fabricating apparatus |
CN1248287C (zh) | 2001-11-30 | 2006-03-29 | 株式会社半导体能源研究所 | 半导体设备的制造方法 |
US7133737B2 (en) | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
EP1329946A3 (en) | 2001-12-11 | 2005-04-06 | Sel Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device including a laser crystallization step |
DE10353901A1 (de) * | 2002-11-25 | 2004-06-09 | Advanced LCD Technologies Development Center Co., Ltd., Yokohama | Verfahren und Vorrichtung zur Bildung eines Substrats für Halbleiter oder dergleichen |
US7223674B2 (en) * | 2004-05-06 | 2007-05-29 | Micron Technology, Inc. | Methods for forming backside alignment markers useable in semiconductor lithography |
KR101248964B1 (ko) * | 2005-03-29 | 2013-03-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 레이저 조사 장치 및 반도체 소자의 제조 방법 |
TWI498626B (zh) | 2005-11-15 | 2015-09-01 | Semiconductor Energy Lab | 液晶顯示裝置 |
KR101351474B1 (ko) * | 2005-12-20 | 2014-01-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 레이저 조사장치, 레이저 조사방법, 및 반도체장치제조방법 |
-
2007
- 2007-11-19 US US11/942,133 patent/US8138058B2/en not_active Expired - Fee Related
- 2007-11-20 JP JP2007300218A patent/JP5395348B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58197816A (ja) * | 1982-05-14 | 1983-11-17 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜結晶の製造方法 |
JPH02260419A (ja) * | 1989-03-30 | 1990-10-23 | Matsushita Electric Ind Co Ltd | レーザ照射方法 |
JPH04186725A (ja) * | 1990-11-21 | 1992-07-03 | Hitachi Ltd | レーザアニール装置及びアライメント法 |
JPH10163136A (ja) * | 1996-12-04 | 1998-06-19 | Unisia Jecs Corp | シリコンウエハの加工方法 |
JPH11121517A (ja) * | 1997-10-09 | 1999-04-30 | Hitachi Ltd | 半導体素子搭載装置および搭載方法 |
JP2000276233A (ja) * | 1999-03-24 | 2000-10-06 | Moritex Corp | 位置ずれ検出装置及びそれを用いた位置決め装置 |
JP2001274086A (ja) * | 2000-03-27 | 2001-10-05 | Matsushita Electric Ind Co Ltd | 多結晶シリコン薄膜の製造方法 |
JP2003100653A (ja) * | 2001-09-26 | 2003-04-04 | Sharp Corp | 加工装置および加工方法 |
JP2004221560A (ja) * | 2002-12-25 | 2004-08-05 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8809120B2 (en) | 2011-02-17 | 2014-08-19 | Infineon Technologies Ag | Method of dicing a wafer |
JP2012204485A (ja) * | 2011-03-24 | 2012-10-22 | Japan Steel Works Ltd:The | レーザアニール装置 |
US9040389B2 (en) | 2012-10-09 | 2015-05-26 | Infineon Technologies Ag | Singulation processes |
CN106374335A (zh) * | 2016-10-31 | 2017-02-01 | 中国科学院上海光学精密机械研究所 | 集成电极电光调谐回音壁模式微腔的制备方法 |
KR20190110026A (ko) * | 2018-03-19 | 2019-09-27 | 파스포드 테크놀로지 주식회사 | 다이 본딩 장치 및 반도체 장치의 제조 방법 |
KR102186384B1 (ko) | 2018-03-19 | 2020-12-03 | 파스포드 테크놀로지 주식회사 | 다이 본딩 장치 및 반도체 장치의 제조 방법 |
JP2021036347A (ja) * | 2020-12-04 | 2021-03-04 | キヤノン株式会社 | リソグラフィ装置、パターン形成方法及び物品の製造方法 |
JP7071483B2 (ja) | 2020-12-04 | 2022-05-19 | キヤノン株式会社 | リソグラフィ装置、パターン形成方法及び物品の製造方法 |
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