JP2008145342A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008145342A5 JP2008145342A5 JP2006334679A JP2006334679A JP2008145342A5 JP 2008145342 A5 JP2008145342 A5 JP 2008145342A5 JP 2006334679 A JP2006334679 A JP 2006334679A JP 2006334679 A JP2006334679 A JP 2006334679A JP 2008145342 A5 JP2008145342 A5 JP 2008145342A5
- Authority
- JP
- Japan
- Prior art keywords
- resistance element
- external force
- base member
- strain
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006334679A JP5174343B2 (ja) | 2006-12-12 | 2006-12-12 | 力覚センサ用チップ |
| US12/000,405 US7707899B2 (en) | 2006-12-12 | 2007-12-12 | Force sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006334679A JP5174343B2 (ja) | 2006-12-12 | 2006-12-12 | 力覚センサ用チップ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008145342A JP2008145342A (ja) | 2008-06-26 |
| JP2008145342A5 true JP2008145342A5 (https=) | 2009-12-17 |
| JP5174343B2 JP5174343B2 (ja) | 2013-04-03 |
Family
ID=39582077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006334679A Expired - Fee Related JP5174343B2 (ja) | 2006-12-12 | 2006-12-12 | 力覚センサ用チップ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7707899B2 (https=) |
| JP (1) | JP5174343B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5243704B2 (ja) * | 2006-08-24 | 2013-07-24 | 本田技研工業株式会社 | 力覚センサ |
| JP5243988B2 (ja) * | 2009-02-10 | 2013-07-24 | 本田技研工業株式会社 | 多軸力覚センサおよび加速度センサ |
| US8745571B2 (en) | 2011-02-14 | 2014-06-03 | International Business Machines Corporation | Analysis of compensated layout shapes |
| US9003897B2 (en) | 2012-05-10 | 2015-04-14 | Honeywell International Inc. | Temperature compensated force sensor |
| US9581511B2 (en) * | 2013-10-15 | 2017-02-28 | Meggitt (Orange County), Inc. | Microelectromechanical pressure sensors |
| US10203254B2 (en) * | 2016-09-12 | 2019-02-12 | Apple Inc. | Strain sensor with thermally conductive element |
| JP6760575B2 (ja) * | 2016-10-07 | 2020-09-23 | ミネベアミツミ株式会社 | センサチップ、起歪体、力覚センサ装置 |
| JP7025981B2 (ja) * | 2018-04-12 | 2022-02-25 | 株式会社小野測器 | トルク計測装置 |
| JP2021071305A (ja) * | 2019-10-29 | 2021-05-06 | ミネベアミツミ株式会社 | 力覚センサ装置 |
| JP2022142118A (ja) * | 2021-03-16 | 2022-09-30 | ミネベアミツミ株式会社 | センサチップ、力覚センサ装置 |
| JP2022142116A (ja) * | 2021-03-16 | 2022-09-30 | ミネベアミツミ株式会社 | 起歪体、力覚センサ装置 |
| JP2022142117A (ja) * | 2021-03-16 | 2022-09-30 | ミネベアミツミ株式会社 | センサチップ、力覚センサ装置 |
| US12422314B2 (en) * | 2021-10-08 | 2025-09-23 | Qorvo Us, Inc. | Input structures that include slots that create a stress concentration region in a substrate for strain detection by a sensor |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3985025A (en) * | 1975-01-20 | 1976-10-12 | Ormond Alfred N | Shear measuring flexure isolated load cells |
| JPS5814751B2 (ja) * | 1977-03-17 | 1983-03-22 | 株式会社日立製作所 | ダイアフラム形ひずみゲ−ジ |
| US4221134A (en) * | 1979-08-20 | 1980-09-09 | Ekstrom Jr Regner A | Differential pressure transducer with strain gauge |
| JPS5660066A (en) * | 1979-10-19 | 1981-05-23 | Nec Corp | Semiconductor strain detector |
| JPS5780532A (en) * | 1980-11-07 | 1982-05-20 | Hitachi Ltd | Semiconductor load converter |
| JPS57169643A (en) * | 1981-04-13 | 1982-10-19 | Yamato Scale Co Ltd | Load cell for multiple components of force |
| CA1237739A (en) * | 1982-09-21 | 1988-06-07 | Kazuo Asakawa | Supporting device |
| US5207554A (en) * | 1982-09-21 | 1993-05-04 | Fujitsu Limited | Supporting device |
| JPS62213280A (ja) * | 1986-03-14 | 1987-09-19 | Nissan Motor Co Ltd | 半導体加速度センサ |
| JPH0617834B2 (ja) * | 1987-04-24 | 1994-03-09 | 株式会社エンプラス研究所 | 力検出装置 |
| DE3852271T2 (de) * | 1987-04-24 | 1995-07-06 | Enplas Lab Inc | Kraft- und momentendetektor unter verwendung eines widerstandes. |
| US5095762A (en) * | 1988-07-14 | 1992-03-17 | University Of Hawaii | Multidimensional force sensor |
| JP2560140B2 (ja) * | 1990-08-03 | 1996-12-04 | 日産自動車株式会社 | 半導体装置 |
| US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
| JP2548347Y2 (ja) * | 1991-12-03 | 1997-09-17 | 大和製衡株式会社 | ロードセル |
| JPH05215627A (ja) * | 1992-02-04 | 1993-08-24 | Kazuhiro Okada | 多次元方向に関する力・加速度・磁気の検出装置 |
| JP4141574B2 (ja) | 1999-03-19 | 2008-08-27 | エランテック デバイシーズ コーポレイション | ポインティングスティック用厚膜回路基板 |
| JP3870895B2 (ja) * | 2002-01-10 | 2007-01-24 | 株式会社村田製作所 | 角速度センサ |
| US6823744B2 (en) * | 2002-01-11 | 2004-11-30 | Honda Giken Kogyo Kabushiki Kaisha | Six-axis force sensor |
| US7021154B2 (en) * | 2002-09-24 | 2006-04-04 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Force sensing element |
| JP4045979B2 (ja) * | 2003-02-26 | 2008-02-13 | 株式会社デンソー | 圧力検出装置 |
| JP4192084B2 (ja) * | 2003-06-17 | 2008-12-03 | ニッタ株式会社 | 多軸センサ |
| JP2005106679A (ja) * | 2003-09-30 | 2005-04-21 | Nitta Ind Corp | 多軸センサユニットおよびこれを利用した多軸センサ |
| JP4680566B2 (ja) * | 2004-10-26 | 2011-05-11 | 本田技研工業株式会社 | 多軸力センサチップとこれを用いた多軸力センサ |
| US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
| JP2006242797A (ja) * | 2005-03-04 | 2006-09-14 | Matsushita Electric Ind Co Ltd | 歪センサとその製造方法 |
-
2006
- 2006-12-12 JP JP2006334679A patent/JP5174343B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-12 US US12/000,405 patent/US7707899B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008145342A5 (https=) | ||
| JP2008058106A5 (https=) | ||
| US10199323B2 (en) | Flexible circuit substrate with temporary supports and equalized lateral expansion | |
| JPH10111312A (ja) | マイクロメカニックな構成エレメント | |
| EP2644563A3 (en) | Electronic device comprising differential MEMS sensor and substrate having through hole | |
| JP2006343350A5 (https=) | ||
| JP2008525987A5 (https=) | ||
| JP2021025846A5 (https=) | ||
| JP2019211676A5 (https=) | ||
| JP2013058663A5 (https=) | ||
| JP2010171380A5 (https=) | ||
| JP2009004648A5 (https=) | ||
| JP2010190636A5 (https=) | ||
| JP5005091B2 (ja) | 基板の保持・固定構造 | |
| USD584249S1 (en) | Grooves formed around a semiconductor device on a circuit board | |
| USD580895S1 (en) | Grooves formed around a semiconductor device on a circuit board | |
| JP2008193000A5 (https=) | ||
| TW202026231A (zh) | 微機電加熱裝置 | |
| JP2017132441A5 (https=) | ||
| JP2019512836A5 (https=) | ||
| JP2014044180A (ja) | 歪みセンサモジュール | |
| TW200943594A (en) | Semiconductor device and method for fabricating the same | |
| JP2005317912A5 (https=) | ||
| JP6044302B2 (ja) | 力学量センサおよびその製造方法 | |
| CN111386000B (zh) | 微机电加热装置 |