JP2008133528A - 溶射用粉末、溶射皮膜の形成方法、及び耐プラズマ性部材 - Google Patents
溶射用粉末、溶射皮膜の形成方法、及び耐プラズマ性部材 Download PDFInfo
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Abstract
【解決手段】本発明の溶射用粉末は、原子番号60〜70のいずれかの希土類元素の酸化物からなる造粒−焼結粒子を含有する。造粒−焼結粒子を構成する一次粒子の平均粒子径は2〜10μm、造粒−焼結粒子の圧壊強度は7〜50MPaである。溶射用粉末の真比重に対する嵩比重の比は0.10〜0.30が好ましい。造粒−焼結粒子中の細孔の直径についての頻度分布は1μm以上に極大を有することが好ましい。溶射用粉末は、好ましくはプラズマ溶射で溶射皮膜を形成する用途で用いられる。本発明の耐プラズマ性部材11は、上記溶射用粉末を溶射して形成される溶射皮膜13を備える。
【選択図】図1
Description
請求項3に記載の発明は、前記造粒−焼結粒子中の細孔の直径についての頻度分布が1μm以上に極大を有する請求項1又は2に記載の溶射用粉末を提供する。
請求項5に記載の発明は、被処理体をプラズマにより処理するためのプラズマ処理チャンバー内に設置して使用される耐プラズマ性部材であって、該耐プラズマ性部材は、基材と、該基材の少なくとも前記プラズマに曝される面の上に設けられた溶射皮膜とを備え、前記溶射皮膜は、原子番号60〜70のいずれかの希土類元素の酸化物からなる造粒−焼結粒子を含有する溶射用粉末を溶射して形成されるものであり、前記造粒−焼結粒子を構成する一次粒子の平均粒子径が2〜10μmであり、前記造粒−焼結粒子の圧壊強度が7〜50MPaである耐プラズマ性部材を提供する。
本実施形態の溶射用粉末は、原子番号60〜70のいずれかの希土類元素の酸化物で形成された造粒−焼結粒子から実質的になる。原子番号60〜70の希土類元素とは、具体的には、ネオジム(元素記号Nd、原子番号60)、プロメチウム(元素記号Pm、原子番号61)、サマリウム(元素記号Sm、原子番号62)、ユロピウム(元素記号Eu、原子番号63)、ガドリニウム(元素記号Gd、原子番号64)、テルビウム(元素記号Tb、原子番号65)、ジスプロシウム(元素記号Dy、原子番号66)、ホルミウム(元素記号Ho、原子番号67)、エルビウム(元素記号Er、原子番号68)、ツリウム(元素記号Tm、原子番号69)、及びイッテルビウム(元素記号Yb、原子番号70)である。
・ 本実施形態の溶射用粉末では、溶射用粉末中の造粒−焼結粒子が原子番号60〜70のいずれかの希土類元素の酸化物からなり、造粒−焼結粒子を構成する一次粒子の平均粒子径が2〜10μmであり、造粒−焼結粒子の圧壊強度が7〜50MPaである。そのため、本実施形態の溶射用粉末から形成される溶射皮膜は、実用に足る耐プラズマエロージョン性を備える。しかも、この溶射皮膜がプラズマエロージョンを受けたときに発生するパーティクルのサイズは比較的小さいものである。これは、溶射用粉末が適度な溶融又は軟化しやすさを有するため、得られる溶射皮膜が緻密かつ均一であることが理由と考えられる。従って、本実施形態の溶射用粉末から形成される溶射皮膜は、半導体デバイス製造装置や液晶デバイス製造装置などのプラズマエロージョンを防止する目的において有用である。換言すれば、本実施形態の溶射用粉末は、半導体デバイス製造装置や液晶デバイス製造装置などのプラズマエロージョンを防止する目的において有用な溶射皮膜の形成に適している。
・ 溶射用粉末は、原子番号60〜70のいずれかの希土類元素の酸化物からなる造粒−焼結粒子を希土類元素の種類が異なる2種類以上含有してもよい。
希土類酸化物の造粒−焼結粒子からなる実施例1〜18及び比較例1〜13の溶射用粉末を用意した。各溶射用粉末の詳細は表1に示すとおりである。
表1の“一次粒子の平均粒子径”欄には、各溶射用粉末中の造粒−焼結粒子を構成する一次粒子の平均粒子径を、電界放射型走査電子顕微鏡(FE−SEM)を用いて測定した結果を示す。
表1の“嵩比重/真比重”欄には、各溶射用粉末で測定される嵩比重及び真比重を用いて真比重に対する嵩比重の比を計算した結果を示す。
表1の“細孔の累積容積”欄には、各溶射用粉末の単位重量当たりの造粒−焼結粒子中の細孔の累積容積を、(株)島津製作所製の水銀圧入式ポロシメーター“ポアサイザー9320”を用いて測定した結果を示す。
Claims (7)
- 原子番号60〜70のいずれかの希土類元素の酸化物からなる造粒−焼結粒子を含有する溶射用粉末であって、
前記造粒−焼結粒子を構成する一次粒子の平均粒子径が2〜10μmであり、
前記造粒−焼結粒子の圧壊強度が7〜50MPaであることを特徴とする溶射用粉末。 - 溶射用粉末の真比重に対する嵩比重の比が0.10〜0.30である請求項1に記載の溶射用粉末。
- 前記造粒−焼結粒子中の細孔の直径についての頻度分布が1μm以上に極大を有する請求項1又は2に記載の溶射用粉末。
- 請求項1〜3のいずれか一項に記載の溶射用粉末をプラズマ溶射して溶射皮膜を形成する溶射皮膜の形成方法。
- 被処理体をプラズマにより処理するためのプラズマ処理チャンバー内に設置して使用される耐プラズマ性部材であって、該耐プラズマ性部材は、
基材と、
該基材の少なくとも前記プラズマに曝される面の上に設けられた溶射皮膜とを備え、
前記溶射皮膜は、原子番号60〜70のいずれかの希土類元素の酸化物からなる造粒−焼結を含有する溶射用粉末を溶射して形成されるものであり、前記造粒−焼結粒子を構成する一次粒子の平均粒子径が2〜10μmであり、前記造粒−焼結粒子の圧壊強度が7〜50MPaであることを特徴とする耐プラズマ性部材。 - 前記基材は、アルミニウム、アルミニウム合金、アルミニウム含有セラミックス、及び炭素含有セラミックスから選ばれる少なくともいずれか一つの物質から形成される請求項5に記載の耐プラズマ性部材。
- 前記溶射皮膜は、前記溶射用粉末をプラズマ溶射して形成される請求項5又は6に記載の耐プラズマ性部材。
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JP2007204523A JP5159204B2 (ja) | 2006-10-31 | 2007-08-06 | 溶射用粉末、溶射皮膜の形成方法、耐プラズマ性部材、及びプラズマ処理チャンバー |
KR1020070110165A KR101422152B1 (ko) | 2006-10-31 | 2007-10-31 | 용사용 분말, 용사코팅의 형성방법 및 플라즈마 저항성부재 |
US11/931,675 US8349450B2 (en) | 2006-10-31 | 2007-10-31 | Thermal spray powder, method for forming thermal spray coating, and plasma resistant member |
CN200710167281XA CN101173345B (zh) | 2006-10-31 | 2007-10-31 | 热喷涂粉末、形成热喷涂涂层的方法以及抗等离子体构件 |
CN201110462982.2A CN102965610B (zh) | 2006-10-31 | 2007-10-31 | 热喷涂粉末、形成热喷涂涂层的方法以及抗等离子体构件 |
TW096140939A TWI427188B (zh) | 2006-10-31 | 2007-10-31 | 熱噴塗粉末、形成熱噴塗塗層之方法、以及耐電漿侵蝕之構件 |
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JP2010126776A (ja) * | 2008-11-28 | 2010-06-10 | Nihon Ceratec Co Ltd | 耐食性部材およびその製造方法 |
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JP2010106317A (ja) * | 2008-10-30 | 2010-05-13 | Nihon Ceratec Co Ltd | 耐食性部材 |
JP2010126776A (ja) * | 2008-11-28 | 2010-06-10 | Nihon Ceratec Co Ltd | 耐食性部材およびその製造方法 |
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US9670099B2 (en) | 2011-09-26 | 2017-06-06 | Fujimi Incorporated | Thermal spray powder and film that contain rare-earth element, and member provided with film |
US9528176B2 (en) | 2011-09-26 | 2016-12-27 | Fujimi Incorporated | Thermal spray powder and film that contain rare-earth element, and member provided with film |
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JPWO2013176058A1 (ja) * | 2012-05-21 | 2016-01-12 | 株式会社フジミインコーポレーテッド | サーメット粉体物 |
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Also Published As
Publication number | Publication date |
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US8349450B2 (en) | 2013-01-08 |
CN102965610A (zh) | 2013-03-13 |
US20080115725A1 (en) | 2008-05-22 |
CN102965610B (zh) | 2015-07-15 |
TWI427188B (zh) | 2014-02-21 |
KR101422152B1 (ko) | 2014-07-22 |
JP5159204B2 (ja) | 2013-03-06 |
CN101173345A (zh) | 2008-05-07 |
CN101173345B (zh) | 2012-02-29 |
TW200829719A (en) | 2008-07-16 |
KR20080039317A (ko) | 2008-05-07 |
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