JP2008112147A5 - - Google Patents
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- Publication number
- JP2008112147A5 JP2008112147A5 JP2007248825A JP2007248825A JP2008112147A5 JP 2008112147 A5 JP2008112147 A5 JP 2008112147A5 JP 2007248825 A JP2007248825 A JP 2007248825A JP 2007248825 A JP2007248825 A JP 2007248825A JP 2008112147 A5 JP2008112147 A5 JP 2008112147A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- photosensitive resin
- resin composition
- inorganic particles
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 7
- 125000000962 organic group Chemical group 0.000 claims 6
- 239000011324 bead Substances 0.000 claims 5
- 239000010954 inorganic particle Substances 0.000 claims 5
- 239000013078 crystal Substances 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 3
- 239000006185 dispersion Substances 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 239000003960 organic solvent Substances 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 3
- -1 phosphoric acid compound Chemical class 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 125000000542 sulfonic acid group Chemical group 0.000 claims 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 239000002612 dispersion medium Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007248825A JP5109553B2 (ja) | 2006-09-27 | 2007-09-26 | 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006261940 | 2006-09-27 | ||
| JP2006261940 | 2006-09-27 | ||
| JP2007248825A JP5109553B2 (ja) | 2006-09-27 | 2007-09-26 | 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008112147A JP2008112147A (ja) | 2008-05-15 |
| JP2008112147A5 true JP2008112147A5 (enExample) | 2010-10-07 |
| JP5109553B2 JP5109553B2 (ja) | 2012-12-26 |
Family
ID=39444667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007248825A Expired - Fee Related JP5109553B2 (ja) | 2006-09-27 | 2007-09-26 | 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5109553B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5113701B2 (ja) * | 2008-09-25 | 2013-01-09 | 富士フイルム株式会社 | 平版印刷版原版の製造方法 |
| MY163409A (en) * | 2009-12-04 | 2017-09-15 | Toray Industries | Photosensitive resin composition,laminate utilizing same and solid-state imaging device |
| JP6232997B2 (ja) * | 2013-12-18 | 2017-11-22 | 東レ株式会社 | 感光性樹脂組成物、それからなる感光性樹脂フィルム、それから形成された絶縁膜およびそれを有する多層配線基板 |
| JP6249852B2 (ja) * | 2014-03-27 | 2017-12-20 | 住友理工株式会社 | 誘電膜の製造方法 |
| JP6274039B2 (ja) * | 2014-06-12 | 2018-02-07 | Jsr株式会社 | 感放射線性樹脂組成物、絶縁膜および表示素子 |
| KR102633008B1 (ko) * | 2014-12-23 | 2024-02-01 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 패터닝 프로세스 및 해당 프로세스에서 사용되는 레지스트 |
| US10636866B2 (en) | 2015-10-21 | 2020-04-28 | Toray Industries, Inc. | Capacitor, method for manufacturing same, and wireless communication device using same |
| KR20180088414A (ko) | 2015-11-25 | 2018-08-03 | 도레이 카부시키가이샤 | 강유전체 기억 소자, 그의 제조 방법, 및 그것을 사용한 메모리 셀 및 그것을 사용한 무선 통신 장치 |
| JP7193306B2 (ja) * | 2018-10-31 | 2022-12-20 | 住友化学株式会社 | 硬化性組成物、膜、積層体及び表示装置 |
| US20220399166A1 (en) * | 2019-11-14 | 2022-12-15 | Panasonic Intellectual Property Management Co., Ltd. | Dielectric composition, dielectric film, and capacitor |
| CN119630749A (zh) * | 2022-05-27 | 2025-03-14 | 深圳市星源材质科技股份有限公司 | 涂覆浆料、隔膜、隔膜的制备方法及电池 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3785012B2 (ja) * | 1999-03-24 | 2006-06-14 | 富士通株式会社 | 感光性高誘電体組成物、その組成物からなる感光性高誘電体膜のパターン形成方法、及びその組成物を用いて製造したコンデンサ内蔵型多層回路基板 |
| JP4565212B2 (ja) * | 2001-06-05 | 2010-10-20 | Ｊｓｒ株式会社 | 感光性転写フィルム、誘電体および電子部品 |
| JP4565211B2 (ja) * | 2001-06-05 | 2010-10-20 | Ｊｓｒ株式会社 | 感光性誘電体形成用組成物、誘電体および電子部品 |
| JP4100165B2 (ja) * | 2002-01-28 | 2008-06-11 | Ｊｓｒ株式会社 | 感光性誘電体形成用組成物、誘電体および電子部品 |
| JP4106972B2 (ja) * | 2002-06-06 | 2008-06-25 | Ｊｓｒ株式会社 | 感光性誘電体形成用組成物、誘電体および電子部品 |
| JP3680854B2 (ja) * | 2003-04-04 | 2005-08-10 | 東レ株式会社 | ペースト組成物およびこれを用いた誘電体組成物 |
| JP2006309202A (ja) * | 2005-03-29 | 2006-11-09 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた半導体装置 |
-
2007
- 2007-09-26 JP JP2007248825A patent/JP5109553B2/ja not_active Expired - Fee Related
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