JP2008098449A - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

Info

Publication number
JP2008098449A
JP2008098449A JP2006279240A JP2006279240A JP2008098449A JP 2008098449 A JP2008098449 A JP 2008098449A JP 2006279240 A JP2006279240 A JP 2006279240A JP 2006279240 A JP2006279240 A JP 2006279240A JP 2008098449 A JP2008098449 A JP 2008098449A
Authority
JP
Japan
Prior art keywords
substrate
electrolytic
ruthenium film
film
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006279240A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008098449A5 (cg-RX-API-DMAC7.html
Inventor
Hiroyuki Kanda
裕之 神田
Akira Suzaki
明 須崎
Akira Yamamoto
暁 山本
Tsutomu Nakada
勉 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2006279240A priority Critical patent/JP2008098449A/ja
Priority to US11/907,187 priority patent/US7947156B2/en
Publication of JP2008098449A publication Critical patent/JP2008098449A/ja
Publication of JP2008098449A5 publication Critical patent/JP2008098449A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2006279240A 2006-10-12 2006-10-12 基板処理装置及び基板処理方法 Pending JP2008098449A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006279240A JP2008098449A (ja) 2006-10-12 2006-10-12 基板処理装置及び基板処理方法
US11/907,187 US7947156B2 (en) 2006-10-12 2007-10-10 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006279240A JP2008098449A (ja) 2006-10-12 2006-10-12 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
JP2008098449A true JP2008098449A (ja) 2008-04-24
JP2008098449A5 JP2008098449A5 (cg-RX-API-DMAC7.html) 2009-06-18

Family

ID=39328821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006279240A Pending JP2008098449A (ja) 2006-10-12 2006-10-12 基板処理装置及び基板処理方法

Country Status (2)

Country Link
US (1) US7947156B2 (cg-RX-API-DMAC7.html)
JP (1) JP2008098449A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011090770A (ja) * 2009-10-26 2011-05-06 Headway Technologies Inc 記録磁極の形成方法およびルテニウムシード層の回復方法
US8476161B2 (en) 2008-07-18 2013-07-02 Ulvac, Inc. Method for forming Cu electrical interconnection film
JP2013533381A (ja) * 2010-06-11 2013-08-22 ファラデイ テクノロジー，インコーポレイティド 強不動態化金属の電解システム及び加工方法
JP2015528059A (ja) * 2012-07-11 2015-09-24 ファラデイ テクノロジー，インコーポレイティド 超伝導高周波空洞の電気化学システム及び電解研磨方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US7901550B2 (en) * 2007-10-15 2011-03-08 Ebara Corporation Plating apparatus
JP4458496B2 (ja) * 2008-04-16 2010-04-28 株式会社豊田中央研究所 筒内噴射式内燃機関、筒内噴射式内燃機関用ピストン、筒内噴射式内燃機関用ピストンの製造方法
JP2010037637A (ja) * 2008-08-08 2010-02-18 Ebara Corp 電解処理装置及び電解処理方法
US20140134351A1 (en) * 2012-11-09 2014-05-15 Applied Materials, Inc. Method to deposit cvd ruthenium
US10847463B2 (en) * 2017-08-22 2020-11-24 Applied Materials, Inc. Seed layers for copper interconnects

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124214A (ja) * 2001-10-15 2003-04-25 Ebara Corp 配線形成方法及びその装置
US20050145499A1 (en) * 2000-06-05 2005-07-07 Applied Materials, Inc. Plating of a thin metal seed layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3462970B2 (ja) * 1997-04-28 2003-11-05 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
JP3343342B2 (ja) * 2000-04-28 2002-11-11 ティーディーケイ株式会社 めっき方法及び装置、及びそれを用いた薄膜磁気ヘッドの製造方法
US6746589B2 (en) * 2000-09-20 2004-06-08 Ebara Corporation Plating method and plating apparatus
WO2003060959A2 (en) * 2002-01-10 2003-07-24 Semitool, Inc. Method for applying metal features onto barrier layers using electrochemical deposition
JP3819840B2 (ja) * 2002-07-17 2006-09-13 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
US6974531B2 (en) * 2002-10-15 2005-12-13 International Business Machines Corporation Method for electroplating on resistive substrates
US20050274622A1 (en) * 2004-06-10 2005-12-15 Zhi-Wen Sun Plating chemistry and method of single-step electroplating of copper on a barrier metal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050145499A1 (en) * 2000-06-05 2005-07-07 Applied Materials, Inc. Plating of a thin metal seed layer
JP2003124214A (ja) * 2001-10-15 2003-04-25 Ebara Corp 配線形成方法及びその装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8476161B2 (en) 2008-07-18 2013-07-02 Ulvac, Inc. Method for forming Cu electrical interconnection film
JP5377489B2 (ja) * 2008-07-18 2013-12-25 株式会社アルバック Ｃｕ配線膜の形成方法
JP2011090770A (ja) * 2009-10-26 2011-05-06 Headway Technologies Inc 記録磁極の形成方法およびルテニウムシード層の回復方法
JP2013533381A (ja) * 2010-06-11 2013-08-22 ファラデイ テクノロジー，インコーポレイティド 強不動態化金属の電解システム及び加工方法
JP2015528059A (ja) * 2012-07-11 2015-09-24 ファラデイ テクノロジー，インコーポレイティド 超伝導高周波空洞の電気化学システム及び電解研磨方法

Also Published As

Publication number Publication date
US20080099340A1 (en) 2008-05-01
US7947156B2 (en) 2011-05-24

Similar Documents

Publication Publication Date Title
US7947156B2 (en) Substrate processing apparatus and substrate processing method
TW567580B (en) Semiconductor manufacturing device and manufacturing method for semiconductor device
US7387717B2 (en) Method of performing electrolytic treatment on a conductive layer of a substrate
US20040149584A1 (en) Plating method
US20070238265A1 (en) Plating apparatus and plating method
US8029653B2 (en) Electroplating apparatus and electroplating method
US10472726B2 (en) Electrolyte and process for electroplating copper onto a barrier layer
JP4540981B2 (ja) めっき方法
US20120145552A1 (en) Electroplating method
US7901550B2 (en) Plating apparatus
JP4423359B2 (ja) めっき方法
JP2004218080A (ja) めっき方法
US20060086618A1 (en) Method and apparatus for forming interconnects
US20040248405A1 (en) Method of and apparatus for manufacturing semiconductor device
JP3907432B2 (ja) 電解研磨用電解液及び電解研磨方法
JP2010007153A (ja) めっき装置及びめっき方法
JP5564171B2 (ja) めっき装置及びめっき方法
US20090134036A1 (en) Electrolytic Processing Method and Electrolytic Processing Apparatus
JP2007254882A (ja) 電解めっき装置及び電解めっき方法
JP2003306793A (ja) めっき装置及び方法
JP2009030167A (ja) 基板処理方法及び基板処理装置
US20100032315A1 (en) Electrolytic processing apparatus and electrolytic processing method
JP2006152421A (ja) 電解めっき装置及び電解めっき方法
JP2005264281A (ja) めっき装置及びめっき方法
WO2010133550A1 (en) Method for coating a semiconductor substrate by electrodeposition

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090428

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090428

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111101

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120207

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121106