JP2008089575A - ガスフロー測定方法及び装置 - Google Patents

ガスフロー測定方法及び装置 Download PDF

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Publication number
JP2008089575A
JP2008089575A JP2007210558A JP2007210558A JP2008089575A JP 2008089575 A JP2008089575 A JP 2008089575A JP 2007210558 A JP2007210558 A JP 2007210558A JP 2007210558 A JP2007210558 A JP 2007210558A JP 2008089575 A JP2008089575 A JP 2008089575A
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JP
Japan
Prior art keywords
gas
flow
sensing circuit
volume
tank
Prior art date
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Pending
Application number
JP2007210558A
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English (en)
Japanese (ja)
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JP2008089575A5 (enExample
Inventor
Jared Ahmad Lee
アフマド リー ジャレッド
Ezra Robert Gold
ロバート ゴールド エズラ
Chunlei Zhang
ズハング チュンレイ
James Patrick Cruse
パトリック クルーズ ジェイムズ
Richard Charles Fovell
チャールズ フォーベル リチャード
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2008089575A publication Critical patent/JP2008089575A/ja
Publication of JP2008089575A5 publication Critical patent/JP2008089575A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • G01F1/36—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
    • G01F1/40—Details of construction of the flow constriction devices
    • G01F1/42—Orifices or nozzles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/17—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters using calibrated reservoirs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0368—By speed of fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Volume Flow (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP2007210558A 2006-08-14 2007-08-11 ガスフロー測定方法及び装置 Pending JP2008089575A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82234506P 2006-08-14 2006-08-14
US11/833,623 US7743670B2 (en) 2006-08-14 2007-08-03 Method and apparatus for gas flow measurement

Publications (2)

Publication Number Publication Date
JP2008089575A true JP2008089575A (ja) 2008-04-17
JP2008089575A5 JP2008089575A5 (enExample) 2010-09-24

Family

ID=38729030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007210558A Pending JP2008089575A (ja) 2006-08-14 2007-08-11 ガスフロー測定方法及び装置

Country Status (6)

Country Link
US (2) US7743670B2 (enExample)
EP (1) EP1890117A1 (enExample)
JP (1) JP2008089575A (enExample)
KR (3) KR20080015374A (enExample)
CN (1) CN101127296B (enExample)
TW (1) TW200820320A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531999A (ja) * 2007-06-27 2010-09-30 エム ケー エス インストルメンツ インコーポレーテッド 異なる体積を提供可能な質量流量検証装置及び関連する方法
KR101915535B1 (ko) 2017-11-24 2018-11-06 주식회사 센트리 가스측정장치

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US7743670B2 (en) * 2006-08-14 2010-06-29 Applied Materials, Inc. Method and apparatus for gas flow measurement
US8074677B2 (en) * 2007-02-26 2011-12-13 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US8205629B2 (en) * 2008-04-25 2012-06-26 Applied Materials, Inc. Real time lead-line characterization for MFC flow verification
EP2113274B1 (en) * 2008-04-30 2016-04-27 ResMed R&D Germany GmbH Apparatus for controlled delivery of a breathing gas to the respiratory tracts of a user
EP3597251B1 (en) 2008-06-05 2023-04-26 ResMed Pty Ltd Treatment of respiratory conditions
DE102009004363B4 (de) * 2009-01-08 2022-08-25 Inficon Gmbh Leckdetektionsverfahren
DE102009018401A1 (de) * 2009-04-22 2010-10-28 Airbus Deutschland Gmbh System und Verfahren zum Kühlen eines Raums in einem Fahrzeug
CN101872729B (zh) * 2010-05-28 2012-02-29 日月光封装测试(上海)有限公司 打线设备及其保护气体自动切换系统与方法
CN102288262A (zh) * 2011-05-04 2011-12-21 中国航空工业集团公司西安飞机设计研究所 一种散热器冷边风量现场校验方法
US9772629B2 (en) 2011-09-29 2017-09-26 Applied Materials, Inc. Methods for monitoring a flow controller coupled to a process chamber
US9644796B2 (en) * 2011-09-29 2017-05-09 Applied Materials, Inc. Methods for in-situ calibration of a flow controller
JP5433660B2 (ja) * 2011-10-12 2014-03-05 Ｃｋｄ株式会社 ガス流量監視システム
JP5809012B2 (ja) * 2011-10-14 2015-11-10 株式会社堀場エステック 流量制御装置、流量測定機構、又は、当該流量測定機構を備えた流量制御装置に用いられる診断装置及び診断用プログラム
JP6094277B2 (ja) * 2013-03-13 2017-03-15 三浦工業株式会社 ボイラ負荷分析装置
US9429247B2 (en) 2013-03-13 2016-08-30 Applied Materials, Inc. Acoustically-monitored semiconductor substrate processing systems and methods
US9910448B2 (en) 2013-03-14 2018-03-06 Christopher Max Horwitz Pressure-based gas flow controller with dynamic self-calibration
CN104750125B (zh) * 2013-12-31 2017-10-24 北京北方华创微电子装备有限公司 一种质量流量控制器的校准方法及装置
GB2557670B (en) * 2016-12-15 2020-04-15 Thermo Fisher Scient Bremen Gmbh Improved gas flow control
US10031004B2 (en) 2016-12-15 2018-07-24 Mks Instruments, Inc. Methods and apparatus for wide range mass flow verification
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
CN107958838B (zh) * 2017-11-08 2020-08-04 上海华力微电子有限公司 一种根据射频时数改善一体化刻蚀工艺面内均匀性的方法
US11718912B2 (en) 2019-07-30 2023-08-08 Applied Materials, Inc. Methods and apparatus for calibrating concentration sensors for precursor delivery
CN112563105B (zh) * 2019-09-10 2023-11-03 中微半导体设备(上海)股份有限公司 等离子体处理装置中实现气体流量验证的系统及方法
US11761083B2 (en) 2019-09-19 2023-09-19 Applied Materials, Inc. Methods for controlling a flow pulse shape
EP3940288A1 (en) * 2020-06-25 2022-01-19 Romet Limited A method and system of monitoring a meter set using a sensor
CN114623904B (zh) * 2022-03-14 2023-07-25 中公高远(北京)汽车检测技术有限公司 一种气体流量计的校准装置和方法
US12264950B2 (en) * 2022-03-23 2025-04-01 Mks Instruments, Inc. Method and apparatus for mass flow verification
CN116293468A (zh) * 2022-12-27 2023-06-23 四川芙蓉川南建设工程有限公司 煤层气产量的风险量化评估和收益最大化计算评价方法
WO2025128720A1 (en) * 2023-12-15 2025-06-19 Lam Research Corporation Active divert pressure tuning

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5063965A (enExample) * 1973-10-06 1975-05-30
JPH01215367A (ja) * 1987-12-31 1989-08-29 Nomix Mfg Co Ltd 流体散布装置
JPH07263350A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体製造方法
JPH11502026A (ja) * 1995-11-17 1999-02-16 エムケイエス・インストゥルメンツ・インコーポレーテッド 気体マス・フロー測定システム
JPH1187318A (ja) * 1997-09-08 1999-03-30 Nec Kyushu Ltd ドライエッチング装置およびガス流量制御の検査方法
JP2006012872A (ja) * 2004-06-22 2006-01-12 Tokyo Electron Ltd 基板処理装置

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US6119710A (en) * 1999-05-26 2000-09-19 Cyber Instrument Technologies Llc Method for wide range gas flow system with real time flow measurement and correction
US6299753B1 (en) * 1999-09-01 2001-10-09 Applied Materials, Inc. Double pressure vessel chemical dispenser unit
US6333272B1 (en) * 2000-10-06 2001-12-25 Lam Research Corporation Gas distribution apparatus for semiconductor processing
JP4148346B2 (ja) * 2002-02-07 2008-09-10 東京エレクトロン株式会社 熱処理装置
US6875271B2 (en) * 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
JP4078982B2 (ja) 2002-04-22 2008-04-23 東京エレクトロン株式会社 処理システム及び流量測定方法
US6704667B2 (en) * 2002-05-13 2004-03-09 Taiwan Semiconductor Manufacturing Co., Ltd Real time mass flow control system with interlock
JP2005537464A (ja) * 2002-07-19 2005-12-08 マイクロリス コーポレイション 流体フロー測定および比例流体フロー制御デバイス
US6813943B2 (en) 2003-03-19 2004-11-09 Mks Instruments, Inc. Method and apparatus for conditioning a gas flow to improve a rate of pressure change measurement
US6955072B2 (en) 2003-06-25 2005-10-18 Mks Instruments, Inc. System and method for in-situ flow verification and calibration
US7150201B2 (en) 2004-12-15 2006-12-19 Celerity, Inc. System and method for measuring flow
KR100706243B1 (ko) * 2005-02-22 2007-04-11 삼성전자주식회사 질화 텅스텐 증착 장치 및 증착 방법
KR101501426B1 (ko) * 2006-06-02 2015-03-11 어플라이드 머티어리얼스, 인코포레이티드 차압 측정들에 의한 가스 유동 제어
US7743670B2 (en) 2006-08-14 2010-06-29 Applied Materials, Inc. Method and apparatus for gas flow measurement
US7846497B2 (en) * 2007-02-26 2010-12-07 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US7775236B2 (en) * 2007-02-26 2010-08-17 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US8205629B2 (en) * 2008-04-25 2012-06-26 Applied Materials, Inc. Real time lead-line characterization for MFC flow verification

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5063965A (enExample) * 1973-10-06 1975-05-30
JPH01215367A (ja) * 1987-12-31 1989-08-29 Nomix Mfg Co Ltd 流体散布装置
JPH07263350A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体製造方法
JPH11502026A (ja) * 1995-11-17 1999-02-16 エムケイエス・インストゥルメンツ・インコーポレーテッド 気体マス・フロー測定システム
JPH1187318A (ja) * 1997-09-08 1999-03-30 Nec Kyushu Ltd ドライエッチング装置およびガス流量制御の検査方法
JP2006012872A (ja) * 2004-06-22 2006-01-12 Tokyo Electron Ltd 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531999A (ja) * 2007-06-27 2010-09-30 エム ケー エス インストルメンツ インコーポレーテッド 異なる体積を提供可能な質量流量検証装置及び関連する方法
KR101915535B1 (ko) 2017-11-24 2018-11-06 주식회사 센트리 가스측정장치

Also Published As

Publication number Publication date
CN101127296B (zh) 2010-06-09
KR20130100085A (ko) 2013-09-09
US7743670B2 (en) 2010-06-29
US20080035202A1 (en) 2008-02-14
KR20100091931A (ko) 2010-08-19
US7975558B2 (en) 2011-07-12
KR20080015374A (ko) 2008-02-19
US20100251828A1 (en) 2010-10-07
TW200820320A (en) 2008-05-01
CN101127296A (zh) 2008-02-20
KR101434869B1 (ko) 2014-09-02
EP1890117A1 (en) 2008-02-20

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