KR20080015374A - 가스 유동 측정을 위한 기기 및 방법 - Google Patents

가스 유동 측정을 위한 기기 및 방법 Download PDF

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Publication number
KR20080015374A
KR20080015374A KR1020070081657A KR20070081657A KR20080015374A KR 20080015374 A KR20080015374 A KR 20080015374A KR 1020070081657 A KR1020070081657 A KR 1020070081657A KR 20070081657 A KR20070081657 A KR 20070081657A KR 20080015374 A KR20080015374 A KR 20080015374A
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KR
South Korea
Prior art keywords
gas
flow
sensing circuit
gas flow
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020070081657A
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English (en)
Korean (ko)
Inventor
제레드 아메드 르
에즈라 로버트 골드
츈레이 죵
제임스 파트릭 크루즈
리챠드 챨스 포벨
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20080015374A publication Critical patent/KR20080015374A/ko
Ceased legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • G01F1/36Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
    • G01F1/40Details of construction of the flow constriction devices
    • G01F1/42Orifices or nozzles
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/15Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/17Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters using calibrated reservoirs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • Y10T137/0368By speed of fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7761Electrically actuated valve

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Volume Flow (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020070081657A 2006-08-14 2007-08-14 가스 유동 측정을 위한 기기 및 방법 Ceased KR20080015374A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82234506P 2006-08-14 2006-08-14
US60/822,345 2006-08-14
US11/833,623 2007-08-03
US11/833,623 US7743670B2 (en) 2006-08-14 2007-08-03 Method and apparatus for gas flow measurement

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100062945A Division KR101434869B1 (ko) 2006-08-14 2010-06-30 가스 유동 측정을 위한 방법 및 장치

Publications (1)

Publication Number Publication Date
KR20080015374A true KR20080015374A (ko) 2008-02-19

Family

ID=38729030

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020070081657A Ceased KR20080015374A (ko) 2006-08-14 2007-08-14 가스 유동 측정을 위한 기기 및 방법
KR1020100062945A Active KR101434869B1 (ko) 2006-08-14 2010-06-30 가스 유동 측정을 위한 방법 및 장치
KR1020130097764A Withdrawn KR20130100085A (ko) 2006-08-14 2013-08-19 가스 유동 측정을 위한 방법 및 장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020100062945A Active KR101434869B1 (ko) 2006-08-14 2010-06-30 가스 유동 측정을 위한 방법 및 장치
KR1020130097764A Withdrawn KR20130100085A (ko) 2006-08-14 2013-08-19 가스 유동 측정을 위한 방법 및 장치

Country Status (6)

Country Link
US (2) US7743670B2 (enExample)
EP (1) EP1890117A1 (enExample)
JP (1) JP2008089575A (enExample)
KR (3) KR20080015374A (enExample)
CN (1) CN101127296B (enExample)
TW (1) TW200820320A (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7461549B1 (en) * 2007-06-27 2008-12-09 Mks Instruments, Inc. Mass flow verifiers capable of providing different volumes, and related methods
US7743670B2 (en) * 2006-08-14 2010-06-29 Applied Materials, Inc. Method and apparatus for gas flow measurement
US8074677B2 (en) * 2007-02-26 2011-12-13 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US8205629B2 (en) * 2008-04-25 2012-06-26 Applied Materials, Inc. Real time lead-line characterization for MFC flow verification
EP2113274B1 (en) * 2008-04-30 2016-04-27 ResMed R&D Germany GmbH Apparatus for controlled delivery of a breathing gas to the respiratory tracts of a user
NZ708912A (en) 2008-06-05 2016-12-23 Resmed Ltd Treatment of respiratory conditions
DE102009004363B4 (de) * 2009-01-08 2022-08-25 Inficon Gmbh Leckdetektionsverfahren
DE102009018401A1 (de) * 2009-04-22 2010-10-28 Airbus Deutschland Gmbh System und Verfahren zum Kühlen eines Raums in einem Fahrzeug
CN101872729B (zh) * 2010-05-28 2012-02-29 日月光封装测试(上海)有限公司 打线设备及其保护气体自动切换系统与方法
CN102288262A (zh) * 2011-05-04 2011-12-21 中国航空工业集团公司西安飞机设计研究所 一种散热器冷边风量现场校验方法
US9772629B2 (en) 2011-09-29 2017-09-26 Applied Materials, Inc. Methods for monitoring a flow controller coupled to a process chamber
US9644796B2 (en) * 2011-09-29 2017-05-09 Applied Materials, Inc. Methods for in-situ calibration of a flow controller
JP5433660B2 (ja) * 2011-10-12 2014-03-05 Ckd株式会社 ガス流量監視システム
JP5809012B2 (ja) * 2011-10-14 2015-11-10 株式会社堀場エステック 流量制御装置、流量測定機構、又は、当該流量測定機構を備えた流量制御装置に用いられる診断装置及び診断用プログラム
JP6094277B2 (ja) * 2013-03-13 2017-03-15 三浦工業株式会社 ボイラ負荷分析装置
US9429247B2 (en) 2013-03-13 2016-08-30 Applied Materials, Inc. Acoustically-monitored semiconductor substrate processing systems and methods
WO2014152755A2 (en) 2013-03-14 2014-09-25 Christopher Max Horwitz Pressure-based gas flow controller with dynamic self-calibration
CN104750125B (zh) * 2013-12-31 2017-10-24 北京北方华创微电子装备有限公司 一种质量流量控制器的校准方法及装置
GB2557670B (en) 2016-12-15 2020-04-15 Thermo Fisher Scient Bremen Gmbh Improved gas flow control
US10031004B2 (en) 2016-12-15 2018-07-24 Mks Instruments, Inc. Methods and apparatus for wide range mass flow verification
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
CN107958838B (zh) * 2017-11-08 2020-08-04 上海华力微电子有限公司 一种根据射频时数改善一体化刻蚀工艺面内均匀性的方法
KR101915535B1 (ko) 2017-11-24 2018-11-06 주식회사 센트리 가스측정장치
US11718912B2 (en) 2019-07-30 2023-08-08 Applied Materials, Inc. Methods and apparatus for calibrating concentration sensors for precursor delivery
CN112563105B (zh) * 2019-09-10 2023-11-03 中微半导体设备(上海)股份有限公司 等离子体处理装置中实现气体流量验证的系统及方法
TWI888410B (zh) 2019-09-19 2025-07-01 美商應用材料股份有限公司 用於在ald程序中控制脈衝形狀的方法
EP3940288A1 (en) * 2020-06-25 2022-01-19 Romet Limited A method and system of monitoring a meter set using a sensor
CN114623904B (zh) * 2022-03-14 2023-07-25 中公高远(北京)汽车检测技术有限公司 一种气体流量计的校准装置和方法
US12264950B2 (en) * 2022-03-23 2025-04-01 Mks Instruments, Inc. Method and apparatus for mass flow verification
CN116293468A (zh) * 2022-12-27 2023-06-23 四川芙蓉川南建设工程有限公司 煤层气产量的风险量化评估和收益最大化计算评价方法
WO2025128720A1 (en) * 2023-12-15 2025-06-19 Lam Research Corporation Active divert pressure tuning

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313296B2 (enExample) * 1973-10-06 1978-05-09
NZ227406A (en) * 1987-12-31 1990-04-26 Nomix Mfg Co Ltd Spraying apparatus with calibration of sprayer pump; reversing pump returns calibrating liquid to source
JPH07263350A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体製造方法
US5684245A (en) 1995-11-17 1997-11-04 Mks Instruments, Inc. Apparatus for mass flow measurement of a gas
JP3372840B2 (ja) * 1997-09-08 2003-02-04 九州日本電気株式会社 ドライエッチング装置およびガス流量制御の検査方法
US6119710A (en) * 1999-05-26 2000-09-19 Cyber Instrument Technologies Llc Method for wide range gas flow system with real time flow measurement and correction
US6299753B1 (en) * 1999-09-01 2001-10-09 Applied Materials, Inc. Double pressure vessel chemical dispenser unit
US6333272B1 (en) * 2000-10-06 2001-12-25 Lam Research Corporation Gas distribution apparatus for semiconductor processing
JP4148346B2 (ja) * 2002-02-07 2008-09-10 東京エレクトロン株式会社 熱処理装置
US6875271B2 (en) * 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
JP4078982B2 (ja) 2002-04-22 2008-04-23 東京エレクトロン株式会社 処理システム及び流量測定方法
US6704667B2 (en) * 2002-05-13 2004-03-09 Taiwan Semiconductor Manufacturing Co., Ltd Real time mass flow control system with interlock
KR20100105906A (ko) * 2002-07-19 2010-09-30 엔테그리스, 아이엔씨. 유체유동측정 및 비례유체유동 제어장치
US6813943B2 (en) 2003-03-19 2004-11-09 Mks Instruments, Inc. Method and apparatus for conditioning a gas flow to improve a rate of pressure change measurement
US6955072B2 (en) 2003-06-25 2005-10-18 Mks Instruments, Inc. System and method for in-situ flow verification and calibration
JP4421393B2 (ja) 2004-06-22 2010-02-24 東京エレクトロン株式会社 基板処理装置
US7150201B2 (en) 2004-12-15 2006-12-19 Celerity, Inc. System and method for measuring flow
KR100706243B1 (ko) * 2005-02-22 2007-04-11 삼성전자주식회사 질화 텅스텐 증착 장치 및 증착 방법
CN101460659B (zh) * 2006-06-02 2011-12-07 应用材料股份有限公司 利用压差测量的气流控制
US7743670B2 (en) * 2006-08-14 2010-06-29 Applied Materials, Inc. Method and apparatus for gas flow measurement
US7775236B2 (en) * 2007-02-26 2010-08-17 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US7846497B2 (en) * 2007-02-26 2010-12-07 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US8205629B2 (en) * 2008-04-25 2012-06-26 Applied Materials, Inc. Real time lead-line characterization for MFC flow verification

Also Published As

Publication number Publication date
CN101127296B (zh) 2010-06-09
US7743670B2 (en) 2010-06-29
KR101434869B1 (ko) 2014-09-02
CN101127296A (zh) 2008-02-20
EP1890117A1 (en) 2008-02-20
TW200820320A (en) 2008-05-01
US20080035202A1 (en) 2008-02-14
US20100251828A1 (en) 2010-10-07
US7975558B2 (en) 2011-07-12
JP2008089575A (ja) 2008-04-17
KR20130100085A (ko) 2013-09-09
KR20100091931A (ko) 2010-08-19

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