JP2008072081A - 圧電/電歪素子の製造方法 - Google Patents
圧電/電歪素子の製造方法 Download PDFInfo
- Publication number
- JP2008072081A JP2008072081A JP2007065922A JP2007065922A JP2008072081A JP 2008072081 A JP2008072081 A JP 2008072081A JP 2007065922 A JP2007065922 A JP 2007065922A JP 2007065922 A JP2007065922 A JP 2007065922A JP 2008072081 A JP2008072081 A JP 2008072081A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- electrostrictive
- manufacturing
- electrostrictive element
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 99
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 30
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 28
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000010304 firing Methods 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 40
- 238000004140 cleaning Methods 0.000 claims description 39
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000002378 acidificating effect Effects 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 11
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 7
- 159000000000 sodium salts Chemical class 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- 239000003595 mist Substances 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 52
- 238000005406 washing Methods 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 28
- 230000008569 process Effects 0.000 description 15
- 239000011734 sodium Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000005755 formation reaction Methods 0.000 description 14
- 238000009413 insulation Methods 0.000 description 13
- 239000002002 slurry Substances 0.000 description 11
- 238000007650 screen-printing Methods 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000010287 polarization Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000003929 acidic solution Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005486 sulfidation Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005620 antiferroelectricity Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8561—Bismuth based oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Micromachines (AREA)
Abstract
【解決手段】圧電/電歪体を焼成する工程の後に、少なくとも1回、圧電/電歪体を含む圧電/電歪素子を酸性液又は純水を用いて洗浄をする工程を有する圧電/電歪素子の製造方法の提供による。
【選択図】なし
Description
2 厚肉部
3 薄肉ダイヤフラム部
4 下部電極
5 圧電/電歪体
6 上部電極
7A,7B 不完全結合部
8 補助電極
9 貫通孔
10 空洞
11 (圧電/電歪体の)張り出し部
12 圧電/電歪素子
20 圧電/電歪デバイス
Claims (12)
- アルカリ金属又はアルカリ土類金属を含有する膜状の圧電/電歪体と、その圧電/電歪体を挟んだ一対の膜状の電極と、を含む積層構造を有する圧電/電歪素子を製造する方法であって、
前記圧電/電歪体を、焼成する工程A1と、
前記圧電/電歪体を含む前記圧電/電歪素子を、酸性液又は純水を用いて洗浄をする工程B1と、を有し、
前記工程A1の後に、前記工程B1を、少なくとも1回行う圧電/電歪素子の製造方法。 - 前記工程A1の後であって、前記工程B1の前に、前記圧電/電歪素子の加熱処理を行う工程C1を有する請求項1に記載の圧電/電歪素子の製造方法。
- 前記工程C1の加熱処理における条件が、温度は60℃以上900℃以下である請求項2に記載の圧電/電歪素子の製造方法。
- 前記工程B1の洗浄が、前記酸性液又は純水の前記圧電/電歪体の表面への付着、乾燥、及びエアブロー、で構成される請求項1〜3の何れか一項に記載の圧電/電歪素子の製造方法。
- 前記工程B1の洗浄において、前記酸性液又は純水をミスト状にして使用する請求項1〜4の何れか一項に記載の圧電/電歪素子の製造方法。
- 前記工程B1の洗浄によって、前記圧電/電歪素子の表面に付着した、アルカリ金属又はアルカリ土類金属元素を含む化合物を除去する請求項1〜5の何れか一項に記載の圧電/電歪素子の製造方法。
- 前記化合物が、水酸化物、炭酸塩、炭酸水素塩、硫酸塩、硫化物のうちの少なくとも何れかである請求項6に記載の圧電/電歪素子の製造方法。
- 前記工程B1の洗浄によって、前記圧電/電歪素子の表面に付着した、前記膜状の電極の成分を含有するナトリウム塩、硫酸塩、硫化物の少なくとも何れかを除去する請求項1〜7の何れか一項に記載の圧電/電歪素子の製造方法。
- 薄肉ダイヤフラム部と、その薄肉ダイヤフラム部の周縁に一体的に架設された厚肉部と、を有し、それら薄肉ダイヤフラム部及び厚肉部によって、外部に連通した空洞が形成されたセラミック基板、及び、
そのセラミック基板の前記薄肉ダイヤフラム部の外表面上に配設された、膜状の圧電/電歪体と、その圧電/電歪体を挟んだ一対の膜状の電極と、を含む積層構造を有する圧電/電歪素子、を備え、
その圧電/電歪素子の駆動に連動して、前記セラミック基板の薄肉ダイヤフラム部が振動する圧電/電歪デバイスを製造する方法であって、
前記圧電/電歪体を、焼成する工程A2と、
前記圧電/電歪体を含む前記圧電/電歪デバイスを、酸性液又は純水を用いて洗浄をする工程B2と、を有し、
前記工程A2の後に、前記工程B2を、少なくとも1回行う圧電/電歪デバイスの製造方法。 - 前記工程B2の洗浄によって、前記圧電/電歪デバイスの表面に付着した、アルカリ金属又はアルカリ土類金属元素を含む化合物を除去する請求項9に記載の圧電/電歪デバイスの製造方法。
- 前記化合物が、水酸化物、炭酸塩、炭酸水素塩、硫酸塩、硫化物のうちの少なくとも何れかである請求項10に記載の圧電/電歪デバイスの製造方法。
- 前記工程B2の洗浄によって、前記圧電/電歪デバイスの表面に付着した、前記膜状の電極の成分を含有するナトリウム塩、硫酸塩、硫化物の少なくとも何れかを除去する請求項9〜11の何れか一項に記載の圧電/電歪デバイスの製造方法。
Priority Applications (17)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065922A JP4995603B2 (ja) | 2006-03-22 | 2007-03-14 | 圧電/電歪素子の製造方法 |
US11/725,289 US20070220724A1 (en) | 2006-03-22 | 2007-03-19 | Manufacturing method of piezoelectric/electrostrictive device |
EP07252172A EP1890345B1 (en) | 2006-08-14 | 2007-05-25 | Method for manufacturing piezoelectric/electrostrictive element |
DE602007013843T DE602007013843D1 (de) | 2006-08-14 | 2007-05-25 | Verfahren zur Herstellung eines piezoelektrischen/elektrostriktiven Elements |
CN2007800250823A CN101484790B (zh) | 2006-07-04 | 2007-07-04 | 流体特性测定装置及其再生方法 |
PCT/JP2007/063374 WO2008004582A1 (fr) | 2006-07-04 | 2007-07-04 | Capteur du type film PIéZOélectrique/éLECTROSTRICTIf |
EP07768132A EP2037251A4 (en) | 2006-07-04 | 2007-07-04 | PIEZOELECTRIC / ELECTROSTRICTIVE FILM-TYPE SENSOR |
PCT/JP2007/063765 WO2008004700A1 (fr) | 2006-07-04 | 2007-07-04 | Capteur à film piézoélectrique |
CN2007800250927A CN101484791B (zh) | 2006-07-04 | 2007-07-04 | 压电/电致伸缩膜型传感器 |
EP07768381A EP2042851A4 (en) | 2006-07-04 | 2007-07-04 | PIEZOELECTRIC FILMSENSOR |
EP07768382A EP2037252A4 (en) | 2006-07-04 | 2007-07-04 | PIEZOELECTRIC FILMSENSOR |
CN2007800250626A CN101484789B (zh) | 2006-07-04 | 2007-07-04 | 压电/电致伸缩膜式传感器 |
PCT/JP2007/063766 WO2008004701A1 (fr) | 2006-07-04 | 2007-07-04 | Capteur à film piézoélectrique |
CN200710140250.5A CN101290966B (zh) | 2006-08-14 | 2007-08-07 | 压电/电致伸缩元件的制造方法 |
US12/331,694 US7812506B2 (en) | 2006-07-04 | 2008-12-10 | Piezoelectric/electrostrictive membrane type measuring device |
US12/316,745 US7714480B2 (en) | 2006-07-04 | 2008-12-16 | Piezoelectric/electrostrictive membrane sensor |
US12/317,785 US7876023B2 (en) | 2006-07-04 | 2008-12-30 | Piezoelectric/electrostrictive membrane sensor |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006079544 | 2006-03-22 | ||
JP2006079544 | 2006-03-22 | ||
JP2006221129 | 2006-08-14 | ||
JP2006221129 | 2006-08-14 | ||
JP2007065922A JP4995603B2 (ja) | 2006-03-22 | 2007-03-14 | 圧電/電歪素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008072081A true JP2008072081A (ja) | 2008-03-27 |
JP4995603B2 JP4995603B2 (ja) | 2012-08-08 |
Family
ID=38531806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007065922A Expired - Fee Related JP4995603B2 (ja) | 2006-03-22 | 2007-03-14 | 圧電/電歪素子の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070220724A1 (ja) |
JP (1) | JP4995603B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008004701A1 (fr) * | 2006-07-04 | 2008-01-10 | Ngk Insulators, Ltd. | Capteur à film piézoélectrique |
WO2008004582A1 (fr) * | 2006-07-04 | 2008-01-10 | Ngk Insulators, Ltd. | Capteur du type film PIéZOélectrique/éLECTROSTRICTIf |
EP2042851A4 (en) * | 2006-07-04 | 2012-10-24 | Ngk Insulators Ltd | PIEZOELECTRIC FILMSENSOR |
JP2009190351A (ja) * | 2008-02-18 | 2009-08-27 | Seiko Epson Corp | 液体噴射ヘッドの製造方法及び圧電素子の製造方法 |
WO2018081439A1 (en) * | 2016-10-27 | 2018-05-03 | Cts Corporation | Transducer, transducer array, and method of making the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003198302A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 圧電振動片の製造方法及び圧電振動片を利用した圧電デバイスと、この圧電デバイスを利用した携帯電話装置及び圧電デバイスを利用した電子機器 |
JP2003289161A (ja) * | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | 圧電素子、インクジェット式ヘッドおよび吐出装置 |
JP2004282053A (ja) * | 2003-02-26 | 2004-10-07 | Kyocera Corp | 積層型電子部品及びその製法並びに噴射装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3856380B2 (ja) * | 2002-04-26 | 2006-12-13 | テイカ株式会社 | コンポジット圧電振動子およびその製造方法 |
EP1988586B1 (en) * | 2003-09-25 | 2010-11-10 | Kyocera Corporation | Multi-layer piezoelectric device |
JP4878111B2 (ja) * | 2003-10-30 | 2012-02-15 | 日本碍子株式会社 | セル駆動型圧電/電歪アクチュエータ及びその製造方法 |
US7082655B2 (en) * | 2003-12-18 | 2006-08-01 | Ge Inspection Technologies, Lp | Process for plating a piezoelectric composite |
WO2005092796A2 (en) * | 2004-03-25 | 2005-10-06 | Showa Denko K.K. | Titanium-containing perovskite compound and production method thereof |
JP4943043B2 (ja) * | 2006-03-31 | 2012-05-30 | 富士フイルム株式会社 | 圧電セラミックスの製造方法 |
WO2008004582A1 (fr) * | 2006-07-04 | 2008-01-10 | Ngk Insulators, Ltd. | Capteur du type film PIéZOélectrique/éLECTROSTRICTIf |
JP4724728B2 (ja) * | 2008-03-31 | 2011-07-13 | 株式会社デンソー | 積層型圧電素子の製造方法 |
-
2007
- 2007-03-14 JP JP2007065922A patent/JP4995603B2/ja not_active Expired - Fee Related
- 2007-03-19 US US11/725,289 patent/US20070220724A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003198302A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 圧電振動片の製造方法及び圧電振動片を利用した圧電デバイスと、この圧電デバイスを利用した携帯電話装置及び圧電デバイスを利用した電子機器 |
JP2003289161A (ja) * | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | 圧電素子、インクジェット式ヘッドおよび吐出装置 |
JP2004282053A (ja) * | 2003-02-26 | 2004-10-07 | Kyocera Corp | 積層型電子部品及びその製法並びに噴射装置 |
Also Published As
Publication number | Publication date |
---|---|
US20070220724A1 (en) | 2007-09-27 |
JP4995603B2 (ja) | 2012-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4995603B2 (ja) | 圧電/電歪素子の製造方法 | |
JPH06260694A (ja) | 圧電/電歪膜型素子 | |
US20070205700A1 (en) | Multi-Layer Piezoeletric Element | |
US9246081B2 (en) | Method for manufacturing piezoelectric element | |
EP1901362B1 (en) | Piezoelectric/electrostriction element manufacturing method | |
JP2009194146A (ja) | 圧電/電歪素子及び圧電/電歪素子の製造方法 | |
JP2009124791A (ja) | 振動体及び振動波アクチュエータ | |
US7812506B2 (en) | Piezoelectric/electrostrictive membrane type measuring device | |
JP2010030818A (ja) | 圧電/電歪磁器組成物の製造方法 | |
JP5031737B2 (ja) | 圧電/電歪膜型素子 | |
JP2019522902A (ja) | 優先電界駆動方向における圧電薄膜素子の分極 | |
JP2005072370A (ja) | 積層セラミックス電子部品及び製造方法 | |
JP5878130B2 (ja) | 積層型圧電素子の製造方法および積層型圧電素子 | |
JP5572703B2 (ja) | 圧電素子の製造方法 | |
JP2008098655A (ja) | 積層型圧電素子 | |
JP2009267114A (ja) | 積層型圧電セラミックス素子およびその製造方法 | |
EP1890345B1 (en) | Method for manufacturing piezoelectric/electrostrictive element | |
JP6562322B2 (ja) | 圧電デバイス、及び圧電デバイスの製造方法 | |
JP4611251B2 (ja) | 流体特性測定装置 | |
JP2014143219A (ja) | セラミックスデバイス、及び圧電デバイス | |
JP2008079499A (ja) | 位置決め装置 | |
JP2013247221A (ja) | 圧電アクチュエータおよびそれを備えたインクジェットヘッド | |
JPH1086366A (ja) | セラミックス素子の製造方法 | |
JP5526704B2 (ja) | 圧電アクチュエータ | |
JP5934540B2 (ja) | 圧電/電歪アクチュエータ及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120409 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120508 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120510 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150518 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4995603 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |