JP2008047618A5 - - Google Patents

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Publication number
JP2008047618A5
JP2008047618A5 JP2006219791A JP2006219791A JP2008047618A5 JP 2008047618 A5 JP2008047618 A5 JP 2008047618A5 JP 2006219791 A JP2006219791 A JP 2006219791A JP 2006219791 A JP2006219791 A JP 2006219791A JP 2008047618 A5 JP2008047618 A5 JP 2008047618A5
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JP
Japan
Prior art keywords
light emitting
emitting element
light
layer
emitting elements
Prior art date
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Granted
Application number
JP2006219791A
Other languages
English (en)
Japanese (ja)
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JP2008047618A (ja
JP4960665B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006219791A external-priority patent/JP4960665B2/ja
Priority to JP2006219791A priority Critical patent/JP4960665B2/ja
Priority to US11/782,935 priority patent/US7491976B2/en
Priority to EP07015267A priority patent/EP1887627A3/en
Priority to KR1020070079934A priority patent/KR100954051B1/ko
Priority to CNA2007101408925A priority patent/CN101123264A/zh
Publication of JP2008047618A publication Critical patent/JP2008047618A/ja
Priority to US12/259,420 priority patent/US7786495B2/en
Publication of JP2008047618A5 publication Critical patent/JP2008047618A5/ja
Publication of JP4960665B2 publication Critical patent/JP4960665B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006219791A 2000-11-16 2006-08-11 発光素子アレイ及び画像形成装置 Expired - Fee Related JP4960665B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006219791A JP4960665B2 (ja) 2006-08-11 2006-08-11 発光素子アレイ及び画像形成装置
US11/782,935 US7491976B2 (en) 2000-11-16 2007-07-25 Light-emitting element array and image forming apparatus
EP07015267A EP1887627A3 (en) 2006-08-11 2007-08-03 Semiconductor light emitting element array and image forming apparatus
KR1020070079934A KR100954051B1 (ko) 2006-08-11 2007-08-09 발광 소자 어레이 및 화상형성장치
CNA2007101408925A CN101123264A (zh) 2006-08-11 2007-08-10 发光元件阵列和成像装置
US12/259,420 US7786495B2 (en) 2006-08-11 2008-10-28 Light-emitting element array and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006219791A JP4960665B2 (ja) 2006-08-11 2006-08-11 発光素子アレイ及び画像形成装置

Publications (3)

Publication Number Publication Date
JP2008047618A JP2008047618A (ja) 2008-02-28
JP2008047618A5 true JP2008047618A5 (enExample) 2009-09-24
JP4960665B2 JP4960665B2 (ja) 2012-06-27

Family

ID=38616352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006219791A Expired - Fee Related JP4960665B2 (ja) 2000-11-16 2006-08-11 発光素子アレイ及び画像形成装置

Country Status (5)

Country Link
US (1) US7786495B2 (enExample)
EP (1) EP1887627A3 (enExample)
JP (1) JP4960665B2 (enExample)
KR (1) KR100954051B1 (enExample)
CN (1) CN101123264A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008011848A1 (de) 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
WO2009106063A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen
WO2010028146A2 (en) * 2008-09-08 2010-03-11 3M Innovative Properties Company Electrically pixelated luminescent device
WO2010056596A2 (en) 2008-11-13 2010-05-20 3M Innovative Properties Company Electrically pixelated luminescent device incorporating optical elements
KR101055003B1 (ko) * 2010-03-09 2011-08-05 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지, 조명 시스템, 및 발광 소자 제조방법
FR3011388B1 (fr) * 2013-09-30 2016-11-25 Aledia Dispositif optoelectronique a diodes electroluminescentes
CN103639314A (zh) * 2013-11-15 2014-03-19 四川银河钢结构工程有限公司 钢卷送料机构
DE102014101896A1 (de) * 2014-02-14 2015-08-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils sowie optoelektronisches Halbleiterbauteil
US9502625B2 (en) 2014-06-06 2016-11-22 Rohinni, LLC Electrophotographic deposition of unpackaged semiconductor device
KR102480220B1 (ko) 2016-04-08 2022-12-26 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널
CN105817548B (zh) * 2016-05-31 2017-11-21 蒙城县弘文信息科技有限公司 一种钢片输送冲压机构
US10566507B2 (en) 2017-01-12 2020-02-18 Rohinini, LLC Apparatus for high speed printing of semiconductor devices
KR102381562B1 (ko) * 2017-03-10 2022-04-04 주식회사 루멘스 마이크로 엘이디 모듈 및 그 제조방법
JP7305970B2 (ja) * 2019-01-28 2023-07-11 市光工業株式会社 車両用前照灯
US20210151649A1 (en) * 2019-11-18 2021-05-20 Facebook Technologies, Llc Bonding of light emitting diode arrays
FR3103634B1 (fr) * 2019-11-21 2021-12-03 Commissariat Energie Atomique Procede de formation d’une electrode commune d’une pluralite de dispositifs optoelectroniques
US12021173B2 (en) 2020-11-06 2024-06-25 Boe Technology Group Co., Ltd. Light-emitting diode chip having a gap between epitaxial structures and method for manufacturing the same, and display device

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
DE69024856T2 (de) 1989-06-16 1996-06-05 Canon Kk Aufzeichnungsbogen für Bildaufzeichnungsgeräte sowie Verfahren und Apparat zur Bildherstellung
EP0403310B1 (en) 1989-06-16 1995-11-02 Canon Kabushiki Kaisha Output sheet for image forming device and image forming device by use of the sheet
JPH07114311A (ja) 1993-10-15 1995-05-02 Fujitsu Ltd 画像形成装置
US5955747A (en) 1996-07-25 1999-09-21 Oki Electric Industry Co., Ltd. High-density light-emitting-diode array utilizing a plurality of isolation channels
JP3340626B2 (ja) * 1996-07-25 2002-11-05 沖電気工業株式会社 発光ダイオードアレイ及びその製造方法
JP3185049B2 (ja) 1996-11-12 2001-07-09 沖電気工業株式会社 発光素子アレイ及びその製造方法
US6504180B1 (en) * 1998-07-28 2003-01-07 Imec Vzw And Vrije Universiteit Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom
JP2001088345A (ja) 1999-09-20 2001-04-03 Sanyo Electric Co Ltd 光プリントヘッド
JP2001307506A (ja) * 2000-04-17 2001-11-02 Hitachi Ltd 白色発光装置および照明器具
US7287678B2 (en) 2001-11-16 2007-10-30 Vamco International Inc. Method and apparatus for determining and setting material release mechanism timing for a material feed mechanism
JP3824497B2 (ja) 2001-04-18 2006-09-20 株式会社沖データ 発光素子アレイ
JP2004207325A (ja) 2002-12-24 2004-07-22 Oki Data Corp 半導体装置
JP2005197296A (ja) 2003-12-26 2005-07-21 Shin Etsu Handotai Co Ltd 発光素子及びその製造方法
JP2005277372A (ja) * 2004-02-25 2005-10-06 Sanken Electric Co Ltd 半導体発光素子及びその製造方法
JP4799975B2 (ja) 2005-09-16 2011-10-26 昭和電工株式会社 窒化物系半導体発光素子及びその製造方法
JP4908837B2 (ja) * 2005-12-13 2012-04-04 キヤノン株式会社 発光素子アレイ及び画像形成装置

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