JP2008014849A5 - - Google Patents
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- Publication number
- JP2008014849A5 JP2008014849A5 JP2006187351A JP2006187351A JP2008014849A5 JP 2008014849 A5 JP2008014849 A5 JP 2008014849A5 JP 2006187351 A JP2006187351 A JP 2006187351A JP 2006187351 A JP2006187351 A JP 2006187351A JP 2008014849 A5 JP2008014849 A5 JP 2008014849A5
- Authority
- JP
- Japan
- Prior art keywords
- defect
- digital data
- foreign matter
- inspection
- electrical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007547 defect Effects 0.000 claims 64
- 238000007689 inspection Methods 0.000 claims 45
- 238000001514 detection method Methods 0.000 claims 39
- 238000005286 illumination Methods 0.000 claims 34
- 239000002245 particle Substances 0.000 claims 9
- 238000005070 sampling Methods 0.000 claims 6
- 239000011159 matrix material Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006187351A JP4875936B2 (ja) | 2006-07-07 | 2006-07-07 | 異物・欠陥検出方法および異物・欠陥検査装置 |
| US11/822,330 US7456948B2 (en) | 2006-07-07 | 2007-07-05 | Method for detecting particles and defects and inspection equipment thereof |
| US12/266,079 US7619729B2 (en) | 2006-07-07 | 2008-11-06 | Method for detecting particles and defects and inspection equipment thereof |
| US12/574,185 US8094298B2 (en) | 2006-07-07 | 2009-10-06 | Method for detecting particles and defects and inspection equipment thereof |
| US13/743,315 USRE44977E1 (en) | 2006-07-07 | 2013-01-16 | Method for detecting particles and defects and inspection equipment thereof |
| US13/743,245 USRE44840E1 (en) | 2006-07-07 | 2013-01-16 | Method for detecting particles and defects and inspection equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006187351A JP4875936B2 (ja) | 2006-07-07 | 2006-07-07 | 異物・欠陥検出方法および異物・欠陥検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008014849A JP2008014849A (ja) | 2008-01-24 |
| JP2008014849A5 true JP2008014849A5 (enExample) | 2009-02-19 |
| JP4875936B2 JP4875936B2 (ja) | 2012-02-15 |
Family
ID=38918830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006187351A Expired - Fee Related JP4875936B2 (ja) | 2006-07-07 | 2006-07-07 | 異物・欠陥検出方法および異物・欠陥検査装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (5) | US7456948B2 (enExample) |
| JP (1) | JP4875936B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4699891B2 (ja) * | 2005-12-14 | 2011-06-15 | シャープ株式会社 | 半導体装置及び半導体装置の外観検査方法 |
| JP4959225B2 (ja) * | 2006-05-17 | 2012-06-20 | 株式会社日立ハイテクノロジーズ | 光学式検査方法及び光学式検査装置 |
| JP5279992B2 (ja) * | 2006-07-13 | 2013-09-04 | 株式会社日立ハイテクノロジーズ | 表面検査方法及び装置 |
| JP2008032582A (ja) * | 2006-07-31 | 2008-02-14 | Hitachi High-Technologies Corp | 異物・欠陥検査装置および異物欠陥・検査方法 |
| JP5156413B2 (ja) * | 2008-02-01 | 2013-03-06 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び欠陥検査装置 |
| JP2009194107A (ja) * | 2008-02-13 | 2009-08-27 | Canon Inc | 有効光源形状のデータベースの生成方法、光学像の算出方法、プログラム、露光方法及びデバイス製造方法 |
| JP2009236791A (ja) | 2008-03-28 | 2009-10-15 | Hitachi High-Technologies Corp | 欠陥検査方法及び欠陥検査装置 |
| JP5406677B2 (ja) * | 2009-01-26 | 2014-02-05 | 株式会社日立ハイテクノロジーズ | 暗視野欠陥検査方法及び暗視野欠陥検査装置 |
| JP5331586B2 (ja) * | 2009-06-18 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置および検査方法 |
| US8767069B2 (en) * | 2010-06-30 | 2014-07-01 | Luminex Corporation | Apparatus, system, and method for increasing measurement accuracy in a particle imaging device using light distribution |
| JP2012137350A (ja) * | 2010-12-27 | 2012-07-19 | Hitachi High-Technologies Corp | 欠陥検査方法および欠陥検査装置 |
| JP5637841B2 (ja) * | 2010-12-27 | 2014-12-10 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| CN102642155B (zh) * | 2012-05-02 | 2013-12-11 | 哈尔滨工业大学 | 一种基于图像辅助的微小零件回转调心方法 |
| JP5686394B1 (ja) * | 2014-04-11 | 2015-03-18 | レーザーテック株式会社 | ペリクル検査装置 |
| CN107407552B (zh) * | 2015-03-06 | 2019-11-12 | 株式会社富士 | 识别装置及识别方法 |
| CN105203383B (zh) * | 2015-09-08 | 2018-08-28 | 西宁特殊钢股份有限公司 | 一种简单可行的发蓝断口检验方法 |
| DE102020102419A1 (de) * | 2020-01-31 | 2021-08-05 | Carl Zeiss Microscopy Gmbh | Partikelanalyse mit Lichtmikroskop und Mehrpixelpolarisationsfilter |
| US11544838B2 (en) * | 2020-03-21 | 2023-01-03 | Kla Corporation | Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging |
| DE102021205001B4 (de) * | 2021-05-18 | 2023-07-27 | Carl Zeiss Microscopy Gmbh | Verfahren zum Positionieren von Objekten in einem Teilchenstrahlmikroskop mithilfe einer flexiblen Teilchenstrahlschranke sowie Computerprogrammprodukt |
| KR102804207B1 (ko) * | 2022-10-04 | 2025-05-09 | 세메스 주식회사 | 기판 검사 장치 및 방법 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129547B (en) * | 1982-11-02 | 1986-05-21 | Cambridge Instr Ltd | Reticle inspection |
| DE3475566D1 (en) * | 1984-05-14 | 1989-01-12 | Ibm Deutschland | Method and device for the inspection of surfaces |
| US4902131A (en) * | 1985-03-28 | 1990-02-20 | Kabushiki Kaisha Toshiba | Surface inspection method and apparatus therefor |
| JPS62266444A (ja) * | 1986-05-15 | 1987-11-19 | Toshiba Corp | 表面検査装置 |
| US4952058A (en) * | 1987-04-27 | 1990-08-28 | Hitach, Ltd. | Method and apparatus for detecting abnormal patterns |
| JPH0820371B2 (ja) * | 1988-01-21 | 1996-03-04 | 株式会社ニコン | 欠陥検査装置及び欠陥検査方法 |
| US5249216B1 (en) * | 1989-10-19 | 1996-11-05 | Sumitomo Electric Industries | Total reflection x-ray fluorescence apparatus |
| JP2757545B2 (ja) * | 1990-07-27 | 1998-05-25 | 大日本スクリーン製造 株式会社 | 複数の画像読取りシステム相互の位置誤差補償方法 |
| ATE169440T1 (de) * | 1990-09-21 | 1998-08-15 | Canon Kk | Abdruckbewertungsvorrichtung |
| JPH04177111A (ja) * | 1990-11-13 | 1992-06-24 | Mitsubishi Electric Corp | 位相シフトマスク検査装置 |
| JP2671241B2 (ja) * | 1990-12-27 | 1997-10-29 | 日立電子エンジニアリング株式会社 | ガラス板の異物検出装置 |
| US5410400A (en) * | 1991-06-26 | 1995-04-25 | Hitachi, Ltd. | Foreign particle inspection apparatus |
| US5377001A (en) * | 1991-07-20 | 1994-12-27 | Tet Techno Trust Investment Settlement | Apparatus for surface inspection |
| CH685650A5 (de) * | 1991-07-20 | 1995-08-31 | Tencor Instruments | Einrichtung für Oberflächeninspektionen. |
| US5377002A (en) * | 1991-07-20 | 1994-12-27 | Tet Techno Trust Investment Settlement | Apparatus for surface inspections |
| US5436464A (en) * | 1992-04-13 | 1995-07-25 | Nikon Corporation | Foreign particle inspecting method and apparatus with correction for pellicle transmittance |
| US5486919A (en) * | 1992-04-27 | 1996-01-23 | Canon Kabushiki Kaisha | Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern |
| JPH06242012A (ja) * | 1993-02-16 | 1994-09-02 | Toshiba Corp | 異物検査装置 |
| JP3137160B2 (ja) * | 1994-04-01 | 2001-02-19 | 日立電子エンジニアリング株式会社 | ウエハの位置ズレ補正方法 |
| JPH08201308A (ja) | 1995-01-31 | 1996-08-09 | Toyota Motor Corp | 製品の表面欠陥検出方法およびその装置 |
| JPH08234413A (ja) * | 1995-02-24 | 1996-09-13 | Mitsubishi Electric Corp | フォトマスクパターン欠陥検査装置及びフォトマスクパターン欠陥検査方法 |
| US5903342A (en) * | 1995-04-10 | 1999-05-11 | Hitachi Electronics Engineering, Co., Ltd. | Inspection method and device of wafer surface |
| JP3545517B2 (ja) * | 1995-10-11 | 2004-07-21 | コニカミノルタホールディングス株式会社 | 放射線画像情報読取装置 |
| US5798829A (en) * | 1996-03-05 | 1998-08-25 | Kla-Tencor Corporation | Single laser bright field and dark field system for detecting anomalies of a sample |
| AU3376597A (en) * | 1996-06-04 | 1998-01-05 | Tencor Instruments | Optical scanning system for surface inspection |
| US5883714A (en) * | 1996-10-07 | 1999-03-16 | Phase Metrics | Method and apparatus for detecting defects on a disk using interferometric analysis on reflected light |
| US5963726A (en) * | 1998-03-20 | 1999-10-05 | National Instruments Corporation | Instrumentation system and method including an improved driver software architecture |
| JP4089798B2 (ja) * | 1998-04-13 | 2008-05-28 | 株式会社トプコン | 表面検査装置 |
| US6618136B1 (en) * | 1998-09-07 | 2003-09-09 | Minolta Co., Ltd. | Method and apparatus for visually inspecting transparent body and translucent body |
| US6122047A (en) * | 1999-01-14 | 2000-09-19 | Ade Optical Systems Corporation | Methods and apparatus for identifying the material of a particle occurring on the surface of a substrate |
| US6529270B1 (en) * | 1999-03-31 | 2003-03-04 | Ade Optical Systems Corporation | Apparatus and method for detecting defects in the surface of a workpiece |
| JP2001004347A (ja) * | 1999-06-22 | 2001-01-12 | Mitsubishi Electric Corp | 欠陥検査装置 |
| US6590645B1 (en) * | 2000-05-04 | 2003-07-08 | Kla-Tencor Corporation | System and methods for classifying anomalies of sample surfaces |
| JP3671822B2 (ja) * | 2000-07-26 | 2005-07-13 | 株式会社日立製作所 | 欠陥検査方法および欠陥検査システム |
| JP2003098111A (ja) * | 2000-09-21 | 2003-04-03 | Hitachi Ltd | 欠陥検査方法およびその装置 |
| JP2002098645A (ja) * | 2000-09-26 | 2002-04-05 | Hitachi Electronics Eng Co Ltd | 基板の表面検査装置及び表面検査方法 |
| JP2002181725A (ja) * | 2000-12-11 | 2002-06-26 | Mitsubishi Electric Corp | 微小異物解析方法、分析装置、半導体装置の製造方法および液晶表示装置の製造方法 |
| JP3881530B2 (ja) * | 2000-12-27 | 2007-02-14 | 株式会社日立ハイテクノロジーズ | 表面欠陥検査装置 |
| JP2002228596A (ja) * | 2001-01-31 | 2002-08-14 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの測定方法及び半導体ウェーハの製造方法 |
| JP2002228428A (ja) * | 2001-02-02 | 2002-08-14 | Nikon Corp | 異物検出装置及び露光装置 |
| JP2004271421A (ja) * | 2003-03-11 | 2004-09-30 | Nikon Corp | 異物検査装置及び方法並びに露光装置 |
| US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
| US7433031B2 (en) * | 2003-10-29 | 2008-10-07 | Core Tech Optical, Inc. | Defect review system with 2D scanning and a ring detector |
| JP4908925B2 (ja) * | 2006-02-08 | 2012-04-04 | 株式会社日立ハイテクノロジーズ | ウェハ表面欠陥検査装置およびその方法 |
| JP5147202B2 (ja) * | 2006-06-30 | 2013-02-20 | 株式会社日立ハイテクノロジーズ | 光学式欠陥検査装置 |
| JP4755054B2 (ja) * | 2006-09-01 | 2011-08-24 | 株式会社日立ハイテクノロジーズ | 表面検査方法、及び表面検査装置 |
-
2006
- 2006-07-07 JP JP2006187351A patent/JP4875936B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-05 US US11/822,330 patent/US7456948B2/en not_active Expired - Fee Related
-
2008
- 2008-11-06 US US12/266,079 patent/US7619729B2/en not_active Expired - Fee Related
-
2009
- 2009-10-06 US US12/574,185 patent/US8094298B2/en not_active Ceased
-
2013
- 2013-01-16 US US13/743,315 patent/USRE44977E1/en not_active Expired - Fee Related
- 2013-01-16 US US13/743,245 patent/USRE44840E1/en active Active
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