JP2007528129A5 - - Google Patents

Download PDF

Info

Publication number
JP2007528129A5
JP2007528129A5 JP2007502910A JP2007502910A JP2007528129A5 JP 2007528129 A5 JP2007528129 A5 JP 2007528129A5 JP 2007502910 A JP2007502910 A JP 2007502910A JP 2007502910 A JP2007502910 A JP 2007502910A JP 2007528129 A5 JP2007528129 A5 JP 2007528129A5
Authority
JP
Japan
Prior art keywords
wafer
optical
level test
test arrangement
opto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007502910A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007528129A (ja
JP4847440B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/007473 external-priority patent/WO2005086786A2/en
Publication of JP2007528129A publication Critical patent/JP2007528129A/ja
Publication of JP2007528129A5 publication Critical patent/JP2007528129A5/ja
Application granted granted Critical
Publication of JP4847440B2 publication Critical patent/JP4847440B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007502910A 2004-03-08 2005-03-08 ウエハレベルでの光−電子テスト装置および方法 Expired - Fee Related JP4847440B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US55131604P 2004-03-08 2004-03-08
US60/551,316 2004-03-08
PCT/US2005/007473 WO2005086786A2 (en) 2004-03-08 2005-03-08 Wafer-level opto-electronic testing apparatus and method
US11/075,430 US7109739B2 (en) 2004-03-08 2005-03-08 Wafer-level opto-electronic testing apparatus and method
US11/075,430 2005-03-08

Publications (3)

Publication Number Publication Date
JP2007528129A JP2007528129A (ja) 2007-10-04
JP2007528129A5 true JP2007528129A5 (enExample) 2008-04-03
JP4847440B2 JP4847440B2 (ja) 2011-12-28

Family

ID=34915232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502910A Expired - Fee Related JP4847440B2 (ja) 2004-03-08 2005-03-08 ウエハレベルでの光−電子テスト装置および方法

Country Status (5)

Country Link
US (1) US7109739B2 (enExample)
JP (1) JP4847440B2 (enExample)
KR (1) KR101141014B1 (enExample)
CA (1) CA2558483C (enExample)
WO (1) WO2005086786A2 (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003032021A2 (en) * 2001-10-09 2003-04-17 Infinera Corporation TRANSMITTER PHOTONIC INTEGRATED CIRCUITS (TxPIC) AND OPTICAL TRANSPORT NETWORKS EMPLOYING TxPICs
US7184626B1 (en) * 2003-04-07 2007-02-27 Luxtera, Inc Wafer-level testing of optical and optoelectronic chips
US7672558B2 (en) * 2004-01-12 2010-03-02 Honeywell International, Inc. Silicon optical device
US7217584B2 (en) * 2004-03-18 2007-05-15 Honeywell International Inc. Bonded thin-film structures for optical modulators and methods of manufacture
US7149388B2 (en) * 2004-03-18 2006-12-12 Honeywell International, Inc. Low loss contact structures for silicon based optical modulators and methods of manufacture
US7177489B2 (en) * 2004-03-18 2007-02-13 Honeywell International, Inc. Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture
US20050214989A1 (en) * 2004-03-29 2005-09-29 Honeywell International Inc. Silicon optoelectronic device
US7348786B2 (en) * 2004-08-31 2008-03-25 Georgia Tech Research Corporation Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
JP4379627B2 (ja) * 2004-09-13 2009-12-09 信越半導体株式会社 半導体ウェーハの評価方法及び半導体ウェーハの評価装置
US20060063679A1 (en) * 2004-09-17 2006-03-23 Honeywell International Inc. Semiconductor-insulator-semiconductor structure for high speed applications
JP4938782B2 (ja) * 2005-10-18 2012-05-23 ジーエスアイ・グループ・コーポレーション 光学的基準を利用する方法および装置
US20070101927A1 (en) * 2005-11-10 2007-05-10 Honeywell International Inc. Silicon based optical waveguide structures and methods of manufacture
US7362443B2 (en) * 2005-11-17 2008-04-22 Honeywell International Inc. Optical gyro with free space resonator and method for sensing inertial rotation rate
US7514285B2 (en) * 2006-01-17 2009-04-07 Honeywell International Inc. Isolation scheme for reducing film stress in a MEMS device
US7442589B2 (en) * 2006-01-17 2008-10-28 Honeywell International Inc. System and method for uniform multi-plane silicon oxide layer formation for optical applications
US7463360B2 (en) 2006-04-18 2008-12-09 Honeywell International Inc. Optical resonator gyro with integrated external cavity beam generator
US7454102B2 (en) * 2006-04-26 2008-11-18 Honeywell International Inc. Optical coupling structure
US20070274655A1 (en) * 2006-04-26 2007-11-29 Honeywell International Inc. Low-loss optical device structure
US7535576B2 (en) 2006-05-15 2009-05-19 Honeywell International, Inc. Integrated optical rotation sensor and method for sensing rotation rate
EP2009416A1 (en) * 2007-06-29 2008-12-31 Interuniversitair Microelektronica Centrum Vzw Optical probe
KR101334901B1 (ko) * 2007-07-27 2013-12-02 삼성전자주식회사 전기 신호 전달 모듈 및 방법 그리고 전기 신호 전달모듈을 갖는 전기적 검사 장치 및 신호 전달 방법
KR20090053490A (ko) * 2007-11-23 2009-05-27 삼성전자주식회사 광학 전송수단을 구비한 프루브 카드 및 메모리 테스터
DE102008011240B4 (de) * 2008-02-26 2016-11-17 Airbus Ds Electronics And Border Security Gmbh Vorrichtung zur Kontaktierung eines T/R-Moduls mit einer Testeinrichtung
KR101548176B1 (ko) * 2009-02-02 2015-08-31 삼성전자주식회사 메모리 시스템, 메모리 테스트 시스템 및 이의 테스트 방법
CN102326090B (zh) * 2009-02-20 2013-12-11 Qmc株式会社 Led芯片测试装置
US8248097B2 (en) * 2009-04-02 2012-08-21 International Business Machines Corporation Method and apparatus for probing a wafer
JP5735755B2 (ja) * 2010-05-17 2015-06-17 株式会社アドバンテスト 試験装置及び試験方法
US8654812B2 (en) * 2011-01-25 2014-02-18 Hewlett-Packard Development Company, L.P. Q-switched grating vertical-cavity surface-emitting laser system and method for fabricating the same
US8625942B2 (en) * 2011-03-30 2014-01-07 Intel Corporation Efficient silicon-on-insulator grating coupler
SG11201501341WA (en) 2012-09-12 2015-04-29 Heptagon Micro Optics Pte Ltd Testing of optical devices
US9922887B2 (en) * 2012-12-11 2018-03-20 Acacia Communications, Inc. Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters
KR20140095387A (ko) * 2013-01-24 2014-08-01 삼성전자주식회사 광 소자를 포함하는 웨이퍼의 테스트 시스템 및 웨이퍼 테스트 방법
US9234854B2 (en) 2013-03-15 2016-01-12 International Business Machines Corporation Single fiber noncritical-alignment wafer-scale optical testing
CA2873573C (en) 2013-12-10 2022-06-07 University Of Ottawa Metal-insulator-semiconductor devices based on surface plasmon polaritons
US9383516B2 (en) * 2014-09-02 2016-07-05 Huawei Technologies Co., Ltd. System and method for optical input/output arrays
US9753220B2 (en) 2014-09-02 2017-09-05 Huawei Technologies Co., Ltd. System and method for optical input/output arrays
CN104362108B (zh) * 2014-09-23 2017-05-24 华进半导体封装先导技术研发中心有限公司 光电测试装置
WO2016085473A1 (en) * 2014-11-25 2016-06-02 Hewlett Packard Enterprise Development Lp Light redirecting test fixture
WO2016201289A1 (en) * 2015-06-10 2016-12-15 Translarity, Inc. Shaping of contact structures for semiconductor test, and associated systems and methods
US10359567B2 (en) 2015-09-21 2019-07-23 Elenion Technologies, Llc Test systems and methods for chips in wafer scale photonic systems
US10132999B2 (en) 2016-06-30 2018-11-20 International Business Machines Corporation Sacrificial grating coupler for testing v-grooved integrated circuits
SG11202000822QA (en) 2017-08-07 2020-02-27 Jenoptik Optical Sys Gmbh Position-tolerance-insensitive contacting module for contacting optoelectronic chips
JP6781120B2 (ja) 2017-08-18 2020-11-04 株式会社日本マイクロニクス 検査装置
CN108152864A (zh) * 2017-12-14 2018-06-12 深圳市帝迈生物技术有限公司 样本试管类型的识别设备及样本试管类型的检测方法
DE102018108283A1 (de) * 2018-04-09 2019-10-10 Carl Zeiss Smt Gmbh Elektro-optische Leiterplatte zur Kontaktierung von photonischen integrierten Schaltungen
US10429582B1 (en) 2018-05-02 2019-10-01 Globalfoundries Inc. Waveguide-to-waveguide couplers with multiple tapers
US10436982B1 (en) 2018-07-18 2019-10-08 Globalfoundries Inc. Waveguide bends with field confinement
JP7107094B2 (ja) 2018-08-23 2022-07-27 富士通オプティカルコンポーネンツ株式会社 光デバイスおよび光送受信モジュール
KR102594414B1 (ko) 2018-10-24 2023-10-30 삼성전자주식회사 프로브 장치 및 이를 포함하는 테스트 장치
US12072445B2 (en) * 2018-11-27 2024-08-27 Wuhan Vanjee Optoelectronic Technology Co., Ltd. Phased array LiDAR transmitting chip of multi-layer materials, manufacturing method thereof, and LiDAR device
TWI672480B (zh) 2018-12-03 2019-09-21 財團法人工業技術研究院 光學量測裝置與方法
JP7259431B2 (ja) * 2019-03-15 2023-04-18 富士通オプティカルコンポーネンツ株式会社 光デバイス、これを用いた光モジュール、及び光デバイスの試験方法
US11280959B2 (en) * 2019-04-23 2022-03-22 Ayar Labs, Inc. Photonics systems to enable top-side wafer-level optical and electrical test
JP7245721B2 (ja) 2019-05-31 2023-03-24 株式会社アドバンテスト 試験装置、試験方法およびプログラム
WO2020255191A1 (ja) * 2019-06-17 2020-12-24 日本電信電話株式会社 光回路ウェハ
EP4049048B1 (de) 2019-10-25 2025-02-12 JENOPTIK Optical Systems GmbH Wafer-level-testverfahren für opto-elektronische chips
TWI733226B (zh) * 2019-10-25 2021-07-11 台灣愛司帝科技股份有限公司 發光二極體晶圓以及發光二極體晶圓檢測裝置與方法
US11243230B2 (en) * 2019-12-30 2022-02-08 Juniper Networks, Inc. Compact opto-electric probe
US10955614B1 (en) * 2020-01-14 2021-03-23 Globalfoundries U.S. Inc. Optical fiber coupler structure having manufacturing variation-sensitive transmission blocking region
JP7374937B2 (ja) 2021-01-13 2023-11-07 株式会社アドバンテスト 試験装置、試験方法およびプログラム
JP7386190B2 (ja) 2021-01-21 2023-11-24 株式会社アドバンテスト 試験装置、試験方法およびプログラム
CN112924143B (zh) * 2021-01-29 2023-08-29 中国科学院微电子研究所 一种光子芯片晶圆级测试装置和方法
JP7355773B2 (ja) 2021-02-26 2023-10-03 株式会社アドバンテスト 試験装置、試験方法およびプログラム
WO2022218983A1 (de) * 2021-04-16 2022-10-20 Jenoptik Optical Systems Gmbh Wafer-level-testverfahren für opto-elektronische chips
JP7355789B2 (ja) 2021-09-08 2023-10-03 株式会社アドバンテスト 試験装置、試験方法およびプログラム
WO2023132785A1 (en) * 2022-01-06 2023-07-13 Compoundtek Pte. Ltd. Apparatus for wafer level testing of semicondcutor device
US20250370033A1 (en) * 2022-06-15 2025-12-04 Nippon Telegraph And Telephone Corporation Optical Semiconductor Integrated Circuit
US12078674B2 (en) * 2022-09-06 2024-09-03 Ciena Corporation Managing photonic integrated circuit optical coupling
WO2024074782A1 (fr) * 2022-10-06 2024-04-11 Aryballe Systeme de test en serie de puces destinees a l'analyse d'un analyte et elaborees sur des plaques en silicium
CN117538984B (zh) * 2024-01-09 2024-08-16 赛丽科技(苏州)有限公司 集成光子芯片、阵列及其测试方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777154A (en) * 1972-02-07 1973-12-04 R Lindsey Optical data processing system
JP2749934B2 (ja) * 1989-06-13 1998-05-13 株式会社リコー 高効率プリズム結合装置及びその作成方法
US5119452A (en) * 1989-06-13 1992-06-02 Ricoh Company, Ltd. High efficiency prism coupling device and method for producing the same
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5841544A (en) 1996-12-13 1998-11-24 Lucent Technologies, Inc. Method for positioning optical subassembly for testing
GB2332775A (en) * 1997-12-23 1999-06-30 Lsi Logic Corp Testing optical/electronic integrated circuits
US6337871B1 (en) 1999-07-15 2002-01-08 University Of Maryland Baltimore County (Umbc) Multiple edge-emitting laser components located on a single wafer and the on-wafer testing of the same
JP2002098849A (ja) * 2000-09-25 2002-04-05 Nippon Telegr & Teleph Corp <Ntt> 光プローブ
US6686993B1 (en) * 2001-03-05 2004-02-03 Analog Devices, Inc. Probe card for testing optical micro electromechanical system devices at wafer level
US6788847B2 (en) 2001-04-05 2004-09-07 Luxtera, Inc. Photonic input/output port
US6912330B2 (en) * 2001-05-17 2005-06-28 Sioptical Inc. Integrated optical/electronic circuits and associated methods of simultaneous generation thereof
US6731122B2 (en) 2001-08-14 2004-05-04 International Business Machines Corporation Wafer test apparatus including optical elements and method of using the test apparatus
WO2003020467A1 (en) * 2001-08-31 2003-03-13 Cascade Microtech, Inc. Optical testing device
US6859587B2 (en) 2001-12-28 2005-02-22 Intel Corporation Method and apparatus for wafer level testing of integrated optical waveguide circuits
US7020363B2 (en) * 2001-12-28 2006-03-28 Intel Corporation Optical probe for wafer testing
US6859031B2 (en) * 2002-02-01 2005-02-22 Credence Systems Corporation Apparatus and method for dynamic diagnostic testing of integrated circuits
US6925238B2 (en) 2002-07-16 2005-08-02 Enablence Holdings Llc Method and apparatus for on-wafer testing of an individual optical chip
US7020364B2 (en) * 2003-03-31 2006-03-28 Sioptical Inc. Permanent light coupling arrangement and method for use with thin silicon optical waveguides
US6934444B2 (en) * 2003-04-10 2005-08-23 Sioptical, Inc. Beam shaping and practical methods of reducing loss associated with mating external sources and optics to thin silicon waveguides
KR100745275B1 (ko) * 2003-04-21 2007-08-01 시옵티컬 인코포레이티드 전자 디바이스들을 갖는 실리콘-기반 광학 디바이스들의ｃｍｏｓ-호환형 집적
KR20060018827A (ko) * 2003-04-28 2006-03-02 시옵티컬 인코포레이티드 프리즘-결합된 ｓｏｉ-기반 광 시스템들의 파장 민감도를감소시키기 위한 장치들
US7058261B2 (en) * 2003-09-04 2006-06-06 Sioptical, Inc. Interfacing multiple wavelength sources to thin optical waveguides utilizing evanescent coupling

Similar Documents

Publication Publication Date Title
JP5852040B2 (ja) 光学的アセンブリ
KR101333418B1 (ko) 광학 디바이스, 광학 디바이스 사용 방법 및 광학 디바이스 제조 방법
KR100977235B1 (ko) 도파관 사이의 자유공간 광 전파를 위한 광 컴포넌트
JP4847440B2 (ja) ウエハレベルでの光−電子テスト装置および方法
CN105229512B (zh) 使用LCoS装置并且具有减少的串扰的波长选择开关
JP2002022982A (ja) 反射入力結合を有するアレー導波路型回折格子
KR20050002806A (ko) 광출력의 횡단전달을 이용하는 광접합 장치 및 방법
JP3490745B2 (ja) 複合光導波路型光デバイス
CN106461895A (zh) 自由空间光耦合系统和装置
WO2022266760A1 (en) Printed photonic component based photonic device probing and testing
CN120176993A (zh) 光学探针及相关方法
US7111993B2 (en) Optical monitor module
JP2001215371A (ja) モニタ付光導波路型素子
JP3661036B2 (ja) 導波路型光機能素子
US20210373244A1 (en) Optical Interconnect Structure
US6915031B2 (en) Switch using electrooptic polarization splitter and combiner
JP3690646B2 (ja) 光導波路回路基板と光ファイバアレイとの接続構造
US12111504B2 (en) Alignment method for optical waveguide element
JP3670654B2 (ja) 光回路部品
JP3803776B2 (ja) 導波路型光機能素子
JP5908369B2 (ja) 受光デバイス
WO2003083535A1 (en) Optical waveguide and optical multiplexer/demultiplexer
JP2003005103A (ja) 光電子集積装置
Liu et al. Design and fabrication of a coherent array of single-mode optical fibers for the nulling coronagraph
JP2003043294A5 (enExample)