JP2007520081A5 - - Google Patents
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- Publication number
- JP2007520081A5 JP2007520081A5 JP2006551177A JP2006551177A JP2007520081A5 JP 2007520081 A5 JP2007520081 A5 JP 2007520081A5 JP 2006551177 A JP2006551177 A JP 2006551177A JP 2006551177 A JP2006551177 A JP 2006551177A JP 2007520081 A5 JP2007520081 A5 JP 2007520081A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric film
- conductive
- metal
- stop layer
- conductive bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53995904P | 2004-01-29 | 2004-01-29 | |
| PCT/US2005/001341 WO2005074339A1 (en) | 2004-01-29 | 2005-01-13 | Partially etched dielectric film with conductive features |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007520081A JP2007520081A (ja) | 2007-07-19 |
| JP2007520081A5 true JP2007520081A5 (enExample) | 2008-03-06 |
Family
ID=34826156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006551177A Withdrawn JP2007520081A (ja) | 2004-01-29 | 2005-01-13 | 導電性機構を有する部分的にエッチングされた誘電体膜 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7012017B2 (enExample) |
| EP (1) | EP1709848A1 (enExample) |
| JP (1) | JP2007520081A (enExample) |
| KR (1) | KR20060124730A (enExample) |
| CN (1) | CN1930928A (enExample) |
| CA (1) | CA2554750A1 (enExample) |
| WO (1) | WO2005074339A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4628154B2 (ja) * | 2005-03-22 | 2011-02-09 | 三井金属鉱業株式会社 | フレキシブルプリント配線基板、および半導体装置 |
| US7829793B2 (en) * | 2005-09-09 | 2010-11-09 | Magnecomp Corporation | Additive disk drive suspension manufacturing using tie layers for vias and product thereof |
| US7781679B1 (en) * | 2005-09-09 | 2010-08-24 | Magnecomp Corporation | Disk drive suspension via formation using a tie layer and product |
| US8395866B1 (en) | 2005-09-09 | 2013-03-12 | Magnecomp Corporation | Resilient flying lead and terminus for disk drive suspension |
| US8553364B1 (en) | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
| US8764664B2 (en) | 2005-11-28 | 2014-07-01 | Vizyontech Imaging, Inc. | Methods and apparatus for conformable medical data acquisition pad and configurable imaging system |
| US20080044623A1 (en) * | 2006-08-21 | 2008-02-21 | John Caldwell | Probe card for testing imaging devices, and methods of fabricating same |
| KR100752672B1 (ko) * | 2006-09-06 | 2007-08-29 | 삼성전자주식회사 | 신뢰성 있는 범프 접속 구조를 갖는 인쇄 회로 기판 및 그제조방법, 및 이를 이용한 반도체 패키지 |
| US20080083706A1 (en) * | 2006-10-05 | 2008-04-10 | Mu-Gahat Enterprises, Llc | Reverse side film laser circuit etching |
| US7633035B2 (en) * | 2006-10-05 | 2009-12-15 | Mu-Gahat Holdings Inc. | Reverse side film laser circuit etching |
| US7813082B2 (en) * | 2007-01-26 | 2010-10-12 | Hutchinson Technology Incorporated | Head suspension flexure with inline lead portions positioned at a level between levels of first and second surfaces of the spring metal layer |
| US7835112B2 (en) | 2007-02-12 | 2010-11-16 | Hutchinson Technology Incorporated | Integrated lead flexure with embedded traces |
| FR2914304B1 (fr) | 2007-03-28 | 2012-11-16 | Guerbet Sa | Composes pour le diagnostic de maladies liees a l'expression de vcam. |
| US20080237882A1 (en) * | 2007-03-30 | 2008-10-02 | Islam Salama | Annular via drilling (AVD) technology |
| US20090061112A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by subtractive deposition |
| US20090061251A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by additive deposition |
| EP2418479B1 (en) * | 2009-04-07 | 2013-10-23 | Panasonic Corporation | Sensor chip and measuring device and blood test device in which this sensor chip is used |
| WO2012061184A1 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device and method of making |
| WO2012061183A2 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device for thermal management and method of making |
| CA2719927C (en) | 2010-11-05 | 2014-04-29 | Ibm Canada Limited - Ibm Canada Limitee | Laser ashing of polyimide for semiconductor manufacturing |
| CN106104820B (zh) | 2014-03-25 | 2019-04-26 | 3M创新有限公司 | 具有共面导电零件的柔性电路及其制造方法 |
| US10204737B2 (en) * | 2014-06-11 | 2019-02-12 | Avx Corporation | Low noise capacitors |
| FR3030112B1 (fr) * | 2014-12-12 | 2018-02-02 | Stmicroelectronics (Crolles 2) Sas | Assemblage d'une puce de circuits integres et d'une plaque |
| US20180084635A1 (en) * | 2015-03-20 | 2018-03-22 | 3M Innovative Properties Company | Multilayer substrate for a light emitting semi-conductor device package |
| US20190181321A1 (en) | 2016-06-23 | 2019-06-13 | 3M Innovative Properties Company | Flexible thermoelectric module |
| JP2019525455A (ja) | 2016-06-23 | 2019-09-05 | スリーエム イノベイティブ プロパティズ カンパニー | フレキシブル熱電モジュール |
| KR102414392B1 (ko) | 2016-06-23 | 2022-06-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전 테이프 |
| JP7140686B2 (ja) | 2017-09-11 | 2022-09-21 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 誘電フィルム形成用組成物 |
| US11018024B2 (en) * | 2018-08-02 | 2021-05-25 | Nxp Usa, Inc. | Method of fabricating embedded traces |
| KR102882272B1 (ko) * | 2022-04-29 | 2025-11-06 | 주식회사 아모그린텍 | 세라믹 기판 제조방법 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5134460A (en) * | 1986-08-11 | 1992-07-28 | International Business Machines Corporation | Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding |
| US5248446A (en) * | 1988-08-26 | 1993-09-28 | Idemitsu Kosan Co., Ltd. | Liquid-crystalline copolymer |
| EP0388312A3 (en) | 1989-03-17 | 1991-04-24 | Furukawa Denki Kogyo Kabushiki Kaisha | Chip carrier with improved flexing characteristic |
| US5208066A (en) * | 1989-03-18 | 1993-05-04 | Hitachi, Ltd. | Process of forming a patterned polyimide film and articles including such a film |
| JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
| US5227008A (en) * | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| JP2939477B2 (ja) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
| US5747358A (en) * | 1996-05-29 | 1998-05-05 | W. L. Gore & Associates, Inc. | Method of forming raised metallic contacts on electrical circuits |
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
| JPH1064956A (ja) * | 1996-08-20 | 1998-03-06 | Fujitsu Ltd | フェースダウンボンディング半導体装置 |
| US6882030B2 (en) * | 1996-10-29 | 2005-04-19 | Tru-Si Technologies, Inc. | Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate |
| EP0902048B1 (en) * | 1997-09-11 | 2005-11-23 | E.I. Du Pont De Nemours And Company | High dielectric constant flexible polyimide film and process of preparation |
| US6313402B1 (en) * | 1997-10-29 | 2001-11-06 | Packard Hughes Interconnect Company | Stress relief bend useful in an integrated circuit redistribution patch |
| JP3080047B2 (ja) * | 1997-11-07 | 2000-08-21 | 日本電気株式会社 | バンプ構造体及びバンプ構造体形成方法 |
| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| US6077560A (en) * | 1997-12-29 | 2000-06-20 | 3M Innovative Properties Company | Method for continuous and maskless patterning of structured substrates |
| JP2000106482A (ja) * | 1998-07-29 | 2000-04-11 | Sony Chem Corp | フレキシブル基板製造方法 |
| JP3502776B2 (ja) | 1998-11-26 | 2004-03-02 | 新光電気工業株式会社 | バンプ付き金属箔及び回路基板及びこれを用いた半導体装置 |
| US6537854B1 (en) * | 1999-05-24 | 2003-03-25 | Industrial Technology Research Institute | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed |
| US6322903B1 (en) * | 1999-12-06 | 2001-11-27 | Tru-Si Technologies, Inc. | Package of integrated circuits and vertical integration |
| US7087181B2 (en) | 2000-01-31 | 2006-08-08 | Diagnoswiss S.A. | Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching |
| US6555908B1 (en) * | 2000-02-10 | 2003-04-29 | Epic Technologies, Inc. | Compliant, solderable input/output bump structures |
| WO2002003767A1 (en) | 2000-06-29 | 2002-01-10 | 3M Innovative Properties Company | Multi-metal layer circuit |
| US6923919B2 (en) * | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US7348045B2 (en) * | 2002-09-05 | 2008-03-25 | 3M Innovative Properties Company | Controlled depth etched dielectric film |
| US6696163B2 (en) * | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US6403211B1 (en) * | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
| US6391932B1 (en) * | 2000-08-08 | 2002-05-21 | Shipley Company, L.L.C. | Porous materials |
| US6375062B1 (en) * | 2000-11-06 | 2002-04-23 | Delphi Technologies, Inc. | Surface bumping method and structure formed thereby |
| WO2002067641A1 (en) * | 2001-02-21 | 2002-08-29 | Kaneka Corporation | Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process |
| US6498381B2 (en) * | 2001-02-22 | 2002-12-24 | Tru-Si Technologies, Inc. | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
| US6611046B2 (en) * | 2001-06-05 | 2003-08-26 | 3M Innovative Properties Company | Flexible polyimide circuits having predetermined via angles |
| US7202556B2 (en) * | 2001-12-20 | 2007-04-10 | Micron Technology, Inc. | Semiconductor package having substrate with multi-layer metal bumps |
| US7267883B2 (en) * | 2002-09-25 | 2007-09-11 | Kaneka Corporation | Polyimide film and laminate having metal layer and same |
-
2004
- 2004-03-03 US US10/791,966 patent/US7012017B2/en not_active Expired - Fee Related
-
2005
- 2005-01-13 WO PCT/US2005/001341 patent/WO2005074339A1/en not_active Ceased
- 2005-01-13 KR KR1020067017314A patent/KR20060124730A/ko not_active Withdrawn
- 2005-01-13 CN CNA2005800081012A patent/CN1930928A/zh active Pending
- 2005-01-13 CA CA002554750A patent/CA2554750A1/en not_active Abandoned
- 2005-01-13 EP EP05705770A patent/EP1709848A1/en not_active Withdrawn
- 2005-01-13 JP JP2006551177A patent/JP2007520081A/ja not_active Withdrawn
-
2006
- 2006-01-05 US US11/326,140 patent/US20060118830A1/en not_active Abandoned