JP2019083234A5 - - Google Patents
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- JP2019083234A5 JP2019083234A5 JP2017208586A JP2017208586A JP2019083234A5 JP 2019083234 A5 JP2019083234 A5 JP 2019083234A5 JP 2017208586 A JP2017208586 A JP 2017208586A JP 2017208586 A JP2017208586 A JP 2017208586A JP 2019083234 A5 JP2019083234 A5 JP 2019083234A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- barrier layer
- semiconductor device
- layer
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 22
- 230000004888 barrier function Effects 0.000 claims 17
- 239000004840 adhesive resin Substances 0.000 claims 8
- 229920006223 adhesive resin Polymers 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 230000001681 protective effect Effects 0.000 claims 5
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000011147 inorganic material Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017208586A JP7111457B2 (ja) | 2017-10-27 | 2017-10-27 | 半導体装置及びその製造方法 |
| US16/138,252 US10593621B2 (en) | 2017-10-27 | 2018-09-21 | Semiconductor device with barrier layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017208586A JP7111457B2 (ja) | 2017-10-27 | 2017-10-27 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019083234A JP2019083234A (ja) | 2019-05-30 |
| JP2019083234A5 true JP2019083234A5 (enExample) | 2020-09-10 |
| JP7111457B2 JP7111457B2 (ja) | 2022-08-02 |
Family
ID=66244266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017208586A Active JP7111457B2 (ja) | 2017-10-27 | 2017-10-27 | 半導体装置及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10593621B2 (enExample) |
| JP (1) | JP7111457B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11018272B2 (en) * | 2017-03-23 | 2021-05-25 | Imec Vzw | Methods for forming metal electrodes concurrently on silicon regions of opposite polarity |
| CN111146170A (zh) * | 2019-12-30 | 2020-05-12 | 颀中科技（苏州）有限公司 | 封装结构及其成型方法 |
| JP7548743B2 (ja) * | 2020-07-21 | 2024-09-10 | 新光電気工業株式会社 | 半導体装置 |
| JP7516230B2 (ja) * | 2020-12-03 | 2024-07-16 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN115881655A (zh) * | 2023-02-16 | 2023-03-31 | 成都频岢微电子有限公司 | 一种射频前端模组封装工艺结构 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07226421A (ja) * | 1994-02-09 | 1995-08-22 | Toshiba Corp | Ｉｃ素子実装回路装置およびｉｃ素子の実装方法 |
| JP3876953B2 (ja) * | 1998-03-27 | 2007-02-07 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| JP4123998B2 (ja) | 2003-03-24 | 2008-07-23 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
| WO2010003732A2 (de) * | 2008-07-09 | 2010-01-14 | Robert Bosch Gmbh | Magnetischer positionssensor |
| US8884159B2 (en) * | 2011-09-14 | 2014-11-11 | International Business Machines Corporation | Photovoltaic devices with metal semiconductor alloy metallization |
| JP5894092B2 (ja) | 2013-01-24 | 2016-03-23 | 日本電信電話株式会社 | 半導体装置の実装構造および半導体装置の製造方法 |
| JP6365106B2 (ja) | 2014-08-18 | 2018-08-01 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
| JPWO2016139794A1 (ja) | 2015-03-05 | 2017-12-21 | オリンパス株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6555907B2 (ja) * | 2015-03-16 | 2019-08-07 | アルパッド株式会社 | 半導体発光装置 |
-
2017
- 2017-10-27 JP JP2017208586A patent/JP7111457B2/ja active Active
-
2018
- 2018-09-21 US US16/138,252 patent/US10593621B2/en active Active
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