|
US7563633B2
(en)
*
|
2006-08-25 |
2009-07-21 |
Robert Bosch Gmbh |
Microelectromechanical systems encapsulation process
|
|
TWI475594B
(zh)
|
2008-05-19 |
2015-03-01 |
Entegris Inc |
靜電夾頭
|
|
US20100083762A1
(en)
*
|
2008-10-02 |
2010-04-08 |
Evoy Stephane |
Fabrication and use of submicron wide suspended structures
|
|
SG176059A1
(en)
|
2009-05-15 |
2011-12-29 |
Entegris Inc |
Electrostatic chuck with polymer protrusions
|
|
US8861170B2
(en)
|
2009-05-15 |
2014-10-14 |
Entegris, Inc. |
Electrostatic chuck with photo-patternable soft protrusion contact surface
|
|
DE102009040785A1
(de)
*
|
2009-09-09 |
2011-03-10 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Substrat aus einer Aluminium-Silizium-Legierung oder kristallinem Silizium, Metallspiegel, Verfahren zu dessen Herstellung sowie dessen Verwendung
|
|
US9373500B2
(en)
|
2014-02-21 |
2016-06-21 |
Lam Research Corporation |
Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications
|
|
US8728956B2
(en)
|
2010-04-15 |
2014-05-20 |
Novellus Systems, Inc. |
Plasma activated conformal film deposition
|
|
US9257274B2
(en)
|
2010-04-15 |
2016-02-09 |
Lam Research Corporation |
Gapfill of variable aspect ratio features with a composite PEALD and PECVD method
|
|
US9997357B2
(en)
|
2010-04-15 |
2018-06-12 |
Lam Research Corporation |
Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors
|
|
US9390909B2
(en)
|
2013-11-07 |
2016-07-12 |
Novellus Systems, Inc. |
Soft landing nanolaminates for advanced patterning
|
|
US9076646B2
(en)
|
2010-04-15 |
2015-07-07 |
Lam Research Corporation |
Plasma enhanced atomic layer deposition with pulsed plasma exposure
|
|
US9611544B2
(en)
|
2010-04-15 |
2017-04-04 |
Novellus Systems, Inc. |
Plasma activated conformal dielectric film deposition
|
|
US9287113B2
(en)
|
2012-11-08 |
2016-03-15 |
Novellus Systems, Inc. |
Methods for depositing films on sensitive substrates
|
|
US9892917B2
(en)
|
2010-04-15 |
2018-02-13 |
Lam Research Corporation |
Plasma assisted atomic layer deposition of multi-layer films for patterning applications
|
|
US8956983B2
(en)
|
2010-04-15 |
2015-02-17 |
Novellus Systems, Inc. |
Conformal doping via plasma activated atomic layer deposition and conformal film deposition
|
|
US8637411B2
(en)
|
2010-04-15 |
2014-01-28 |
Novellus Systems, Inc. |
Plasma activated conformal dielectric film deposition
|
|
WO2011149918A2
(en)
|
2010-05-28 |
2011-12-01 |
Entegris, Inc. |
High surface resistivity electrostatic chuck
|
|
US8524612B2
(en)
|
2010-09-23 |
2013-09-03 |
Novellus Systems, Inc. |
Plasma-activated deposition of conformal films
|
|
US9685320B2
(en)
|
2010-09-23 |
2017-06-20 |
Lam Research Corporation |
Methods for depositing silicon oxide
|
|
JP5817127B2
(ja)
*
|
2011-01-21 |
2015-11-18 |
株式会社Sumco |
半導体基板及びその製造方法
|
|
US8647993B2
(en)
|
2011-04-11 |
2014-02-11 |
Novellus Systems, Inc. |
Methods for UV-assisted conformal film deposition
|
|
KR102026206B1
(ko)
*
|
2011-12-26 |
2019-09-27 |
엘지이노텍 주식회사 |
증착 장치
|
|
KR101916289B1
(ko)
*
|
2011-12-29 |
2019-01-24 |
엘지이노텍 주식회사 |
탄화규소 증착 방법
|
|
US8592328B2
(en)
|
2012-01-20 |
2013-11-26 |
Novellus Systems, Inc. |
Method for depositing a chlorine-free conformal sin film
|
|
US8728955B2
(en)
|
2012-02-14 |
2014-05-20 |
Novellus Systems, Inc. |
Method of plasma activated deposition of a conformal film on a substrate surface
|
|
JP5906318B2
(ja)
*
|
2012-08-17 |
2016-04-20 |
株式会社Ihi |
耐熱複合材料の製造方法及び製造装置
|
|
US9546420B1
(en)
*
|
2012-10-08 |
2017-01-17 |
Sandia Corporation |
Methods of depositing an alpha-silicon-carbide-containing film at low temperature
|
|
KR102207992B1
(ko)
|
2012-10-23 |
2021-01-26 |
램 리써치 코포레이션 |
서브-포화된 원자층 증착 및 등각막 증착
|
|
SG2013083241A
(en)
|
2012-11-08 |
2014-06-27 |
Novellus Systems Inc |
Conformal film deposition for gapfill
|
|
KR101469713B1
(ko)
*
|
2012-12-06 |
2014-12-05 |
연세대학교 산학협력단 |
경사형 C/SiC 코팅막 형성 방법 및 장치
|
|
JP6249815B2
(ja)
*
|
2014-02-17 |
2017-12-20 |
株式会社Ihi |
耐熱複合材料の製造方法及び製造装置
|
|
US9214334B2
(en)
|
2014-02-18 |
2015-12-15 |
Lam Research Corporation |
High growth rate process for conformal aluminum nitride
|
|
US9478411B2
(en)
|
2014-08-20 |
2016-10-25 |
Lam Research Corporation |
Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS
|
|
US9478438B2
(en)
|
2014-08-20 |
2016-10-25 |
Lam Research Corporation |
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor
|
|
US9564312B2
(en)
|
2014-11-24 |
2017-02-07 |
Lam Research Corporation |
Selective inhibition in atomic layer deposition of silicon-containing films
|
|
CN104681413A
(zh)
*
|
2015-02-25 |
2015-06-03 |
苏州工业园区纳米产业技术研究院有限公司 |
低应力多晶硅薄膜的制作方法
|
|
WO2016141579A1
(en)
*
|
2015-03-12 |
2016-09-15 |
Ibiden Co., Ltd. |
Method for manufacturing cvd-sic material
|
|
US10566187B2
(en)
|
2015-03-20 |
2020-02-18 |
Lam Research Corporation |
Ultrathin atomic layer deposition film accuracy thickness control
|
|
US9502238B2
(en)
|
2015-04-03 |
2016-11-22 |
Lam Research Corporation |
Deposition of conformal films by atomic layer deposition and atomic layer etch
|
|
US10526701B2
(en)
|
2015-07-09 |
2020-01-07 |
Lam Research Corporation |
Multi-cycle ALD process for film uniformity and thickness profile modulation
|
|
JP6571276B2
(ja)
|
2015-08-31 |
2019-09-04 |
イー インク コーポレイション |
描画デバイスの電子的な消去
|
|
US9773643B1
(en)
|
2016-06-30 |
2017-09-26 |
Lam Research Corporation |
Apparatus and method for deposition and etch in gap fill
|
|
US10062563B2
(en)
|
2016-07-01 |
2018-08-28 |
Lam Research Corporation |
Selective atomic layer deposition with post-dose treatment
|
|
US10037884B2
(en)
|
2016-08-31 |
2018-07-31 |
Lam Research Corporation |
Selective atomic layer deposition for gapfill using sacrificial underlayer
|
|
US10269559B2
(en)
|
2017-09-13 |
2019-04-23 |
Lam Research Corporation |
Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer
|
|
JP7049883B2
(ja)
*
|
2018-03-28 |
2022-04-07 |
東京エレクトロン株式会社 |
ボロン系膜の成膜方法および成膜装置
|
|
CN110345031B
(zh)
*
|
2018-04-03 |
2020-12-11 |
中国科学院理化技术研究所 |
一种舰艇发电系统
|
|
US12040181B2
(en)
|
2019-05-01 |
2024-07-16 |
Lam Research Corporation |
Modulated atomic layer deposition
|
|
US12431349B2
(en)
|
2019-06-07 |
2025-09-30 |
Lam Research Corporation |
In-situ control of film properties during atomic layer deposition
|