JP2007300173A - 電子デバイス用パッケージ、及び電子デバイス - Google Patents
電子デバイス用パッケージ、及び電子デバイス Download PDFInfo
- Publication number
- JP2007300173A JP2007300173A JP2006123958A JP2006123958A JP2007300173A JP 2007300173 A JP2007300173 A JP 2007300173A JP 2006123958 A JP2006123958 A JP 2006123958A JP 2006123958 A JP2006123958 A JP 2006123958A JP 2007300173 A JP2007300173 A JP 2007300173A
- Authority
- JP
- Japan
- Prior art keywords
- package
- electronic device
- lid
- wiring pattern
- layer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【解決手段】電子部品を収容するための凹部を備えたパッケージベース12と、前記凹部を封止する導電性のリッド14、及び前記パッケージベース12と前記リッド14とを接合するシームリング32とから構成され、前記凹部内にIC50を実装するために配設されたボンディング電極20fと前記リッド14とが電気的に接続された電子デバイス用パッケージであって、前記パッケージ12に配設された各電極同士を接続する配線パターンのうち、前記シームリング32の直下を通過する配線パターン26が、前記凹部内に配設されたいずれの電極よりも下側に位置するように構成したこをと特徴とする。
【選択図】図1
Description
その他の構成、作用、効果については、上述した第1の実施形態に係る電子デバイス用パッケージ、及び電子デバイスと同様である。
Claims (5)
- 電子部品を収容するための凹部を備えたパッケージベースと、前記凹部を封止する導電性を有する蓋体、及び前記パッケージベースと前記蓋体とを接合する接合部材とから構成され、前記凹部内に電子部品を実装するために配設された電極と前記蓋体とが電気的に接続された電子デバイス用パッケージであって、
前記パッケージに配設された各電極同士を接続する配線パターンのうち、前記接合部材の直下を通過する部分が、前記凹部内に配設されたいずれの電極よりも下側に位置するように構成したこをと特徴とする電子デバイス用パッケージ。 - 前記配線パターンのうち、前記接合部材の直下を通過する部分の線幅を、他の部分の線幅よりも狭めたことを特徴とする請求項1に記載の電子デバイス用パッケージ。
- 前記配線パターンのうち、前記接合部材の直下を通過する部分をパッケージベースの外部底面に配設した実装端子としたことを特徴とする請求項1に記載の電子デバイス用パッケージ。
- 請求項1乃至請求項3のいずれかに記載の電子デバイス用パッケージに、電子部品を搭載したことを特徴とする電子デバイス。
- 前記電子部品は、圧電振動片と、当該圧電振動片の発振を制御するためのICとしたことを特徴とする請求項4に記載の電子デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006123958A JP2007300173A (ja) | 2006-04-27 | 2006-04-27 | 電子デバイス用パッケージ、及び電子デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006123958A JP2007300173A (ja) | 2006-04-27 | 2006-04-27 | 電子デバイス用パッケージ、及び電子デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007300173A true JP2007300173A (ja) | 2007-11-15 |
JP2007300173A5 JP2007300173A5 (ja) | 2009-06-18 |
Family
ID=38769330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006123958A Pending JP2007300173A (ja) | 2006-04-27 | 2006-04-27 | 電子デバイス用パッケージ、及び電子デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007300173A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177543A (ja) * | 2008-01-25 | 2009-08-06 | Daishinku Corp | 表面実装型圧電発振器 |
JP2012109832A (ja) * | 2010-11-18 | 2012-06-07 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11145728A (ja) * | 1997-11-04 | 1999-05-28 | Nec Corp | 圧電振動子発振器 |
JPH11195720A (ja) * | 1998-01-06 | 1999-07-21 | Nec Corp | 半導体装置 |
WO2001033631A1 (en) * | 1999-10-29 | 2001-05-10 | Nikko Company | Package for high-frequency device |
JP2003188514A (ja) * | 2001-12-21 | 2003-07-04 | Murata Mfg Co Ltd | 混載型電子回路装置の製造方法 |
-
2006
- 2006-04-27 JP JP2006123958A patent/JP2007300173A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11145728A (ja) * | 1997-11-04 | 1999-05-28 | Nec Corp | 圧電振動子発振器 |
JPH11195720A (ja) * | 1998-01-06 | 1999-07-21 | Nec Corp | 半導体装置 |
WO2001033631A1 (en) * | 1999-10-29 | 2001-05-10 | Nikko Company | Package for high-frequency device |
JP2003188514A (ja) * | 2001-12-21 | 2003-07-04 | Murata Mfg Co Ltd | 混載型電子回路装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177543A (ja) * | 2008-01-25 | 2009-08-06 | Daishinku Corp | 表面実装型圧電発振器 |
JP2012109832A (ja) * | 2010-11-18 | 2012-06-07 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2010050778A (ja) | 圧電デバイス | |
JP4724519B2 (ja) | 圧電発振器 | |
JP2008263564A (ja) | 温度補償型圧電発振器 | |
JP4724518B2 (ja) | 圧電発振器 | |
JP2005094514A (ja) | 表面実装型パッケージ及びこれを用いた圧電デバイス | |
JP4890914B2 (ja) | 水晶振動片の支持部構造 | |
JP2007300173A (ja) | 電子デバイス用パッケージ、及び電子デバイス | |
JP2007324933A (ja) | 圧電発振器とその製造方法 | |
JP2018033062A (ja) | 圧電デバイス | |
JP4587726B2 (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP2003318653A (ja) | 圧電振動デバイス | |
JP2007103994A (ja) | 圧電発振器 | |
JP2007180700A (ja) | 圧電デバイス | |
JP4587728B2 (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP2007103995A (ja) | 圧電デバイス | |
KR100506734B1 (ko) | 다중모드 수정진동자 | |
JP4587730B2 (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP4587727B2 (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP4916805B2 (ja) | 圧電発振器 | |
JP4721101B2 (ja) | 圧電デバイス並びに圧電デバイスの製造方法、及び電子機器 | |
JP4587729B2 (ja) | 圧電振動子収納用パッケージおよび圧電装置 | |
JP2006013681A (ja) | 圧電発振器および圧電発振器用パッケージ | |
JP2008017091A (ja) | 圧電振動子及び圧電発振器 | |
JP2007036808A (ja) | 圧電発振器 | |
JP2008141417A (ja) | 圧電発振器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090420 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090420 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20110729 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20110729 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110819 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110915 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111007 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111109 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120125 |