JP2007296533A - レーザ加工方法及び装置 - Google Patents
レーザ加工方法及び装置 Download PDFInfo
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- JP2007296533A JP2007296533A JP2006124084A JP2006124084A JP2007296533A JP 2007296533 A JP2007296533 A JP 2007296533A JP 2006124084 A JP2006124084 A JP 2006124084A JP 2006124084 A JP2006124084 A JP 2006124084A JP 2007296533 A JP2007296533 A JP 2007296533A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003754 machining Methods 0.000 title abstract 6
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 238000003672 processing method Methods 0.000 claims description 4
- 238000000059 patterning Methods 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
【解決手段】波長と強度の少なくともどちらか一方が異なるレーザビーム3a,3bを照射する第1,第2のレーザ発振器2a,2bと、被加工物1を移動させるステージ装置5と、各レーザビーム3a,3bを、被加工物1の所定位置に導く光学系4a,4bを備える。光学系4a,4bは、各レーザビーム3a,3bと被加工物1との相対移動方向に応じて、各レーザビーム3a,3bによって被加工物1の加工が可能なように、各レーザビーム3a,3bが前記の順に被加工物1の所定位置に照射すべく、可動装置6によって可動する。
【効果】各レーザビームと被加工物を相対移動方向に限定されず、余分な移動を行うことなく、効率良くレーザ加工が行える。
【選択図】図1
Description
電子回路基板におけるパターンニングで、強度や波長の異なるレーザ光を複数段階に分けて照射する場合にも、効率良く加工が行えるようにするために、
被加工物を加工すべく、波長と強度の少なくともどちらか一方が異なる複数のレーザビームを、前記異ならせた波長、強度の順に、被加工物に照射することで加工する方法において、
前記レーザビームと被加工物を相対移動しつつ前記レーザビームを被加工物に照射する際に、これらの相対移動方向に応じて、前記複数のレーザビームが前記の順に被加工物を照射するよう、レーザビームの照射位置を変更することを最も主要な特徴としている。
前記本発明のレーザ加工方法を実施する装置であって、
波長と強度の少なくともどちらか一方が異なるレーザビームを照射する複数のレーザ発振器と、
前記各レーザビームと被加工物を相対移動すべく、前記のどちらか一方を移動させるステージ装置と、
前記複数のレーザ発振器から照射された各レーザビームを、被加工物の所定位置に導く光学系を備え、
前記光学系は、前記各レーザビームと被加工物との相対移動方向に応じて、各レーザビームによって被加工物の加工が可能なように、各レーザビームが前記異ならせた波長、強度の順に被加工物の所定位置に照射すべく、可動装置によって可動するように構成されていることを最も主要な特徴としている。
図1は本発明のレーザ加工装置の一例を示す基本構成図、図2は図1に示した本発明のレーザ加工装置で、図1と逆方向に移動する場合の説明図、図3は本発明のレーザ加工装置の他の例を示す概略基本構成図である。
先ず、図1に示したように被加工物1が紙面左方向に移動する場合、第1のレーザビーム3aが紙面左側に、第2のレーザビーム3bが第1のレーザビーム3aの紙面右側に照射するように第1の反射ミラー4abの位置が設定されている。
1a 第1の金属層
1b 第2の金属層
2a 第1のレーザ発振器
2b 第2のレーザ発振器
3a 第1のレーザビーム
3b 第2のレーザビーム
4a 第1の光学系
4ab 第1の反射ミラー
4b 第2の光学系
4bb 第2の反射ミラー
5 ステージ装置
6 可動機構
7 検知器
8 制御装置
Claims (2)
- 被加工物を加工すべく、波長と強度の少なくともどちらか一方が異なる複数のレーザビームを、前記異ならせた波長、強度の順に、被加工物に照射することで加工する方法において、
前記レーザビームと被加工物を相対移動しつつ前記レーザビームを被加工物に照射する際に、これらの相対移動方向に応じて、前記複数のレーザビームが前記の順に被加工物を照射するよう、レーザビームの照射位置を変更することを特徴とするレーザ加工方法。 - 請求項1に記載のレーザ加工方法を実施する装置であって、
波長と強度の少なくともどちらか一方が異なるレーザビームを照射する複数のレーザ発振器と、
前記各レーザビームと被加工物を相対移動すべく、前記のどちらか一方を移動させるステージ装置と、
前記複数のレーザ発振器から照射された各レーザビームを、被加工物の所定位置に導く光学系を備え、
前記光学系は、前記各レーザビームと被加工物との相対移動方向に応じて、各レーザビームによって被加工物の加工が可能なように、各レーザビームが前記異ならせた波長、強度の順に被加工物の所定位置に照射すべく、可動装置によって可動するように構成されていることを特徴とするレーザ加工装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006124084A JP5025158B2 (ja) | 2006-04-27 | 2006-04-27 | レーザ加工方法及び装置 |
PCT/JP2007/058439 WO2007125799A1 (ja) | 2006-04-27 | 2007-04-18 | レーザ加工方法及び装置 |
KR1020087027599A KR101372350B1 (ko) | 2006-04-27 | 2007-04-18 | 레이저 가공 방법 및 장치 |
EP07741875A EP2011599B1 (en) | 2006-04-27 | 2007-04-18 | Laser processing method and laser processing apparatus |
CN2007800150539A CN101432094B (zh) | 2006-04-27 | 2007-04-18 | 激光加工方法及激光加工装置 |
TW096113904A TWI395629B (zh) | 2006-04-27 | 2007-04-20 | Laser processing method and device |
US12/257,760 US8097829B2 (en) | 2006-04-27 | 2008-10-24 | Laser processing method and laser processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006124084A JP5025158B2 (ja) | 2006-04-27 | 2006-04-27 | レーザ加工方法及び装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007296533A true JP2007296533A (ja) | 2007-11-15 |
JP5025158B2 JP5025158B2 (ja) | 2012-09-12 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006124084A Expired - Fee Related JP5025158B2 (ja) | 2006-04-27 | 2006-04-27 | レーザ加工方法及び装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8097829B2 (ja) |
EP (1) | EP2011599B1 (ja) |
JP (1) | JP5025158B2 (ja) |
KR (1) | KR101372350B1 (ja) |
CN (1) | CN101432094B (ja) |
TW (1) | TWI395629B (ja) |
WO (1) | WO2007125799A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100294749A1 (en) * | 2007-11-21 | 2010-11-25 | Carl Zeiss Ag | Laser beam machining |
JP2011045916A (ja) * | 2009-08-28 | 2011-03-10 | Hitachi High-Technologies Corp | レーザ処理装置、太陽電池パネルの製造装置、太陽電池パネルおよびレーザ処理方法 |
JP2014097531A (ja) * | 2012-11-15 | 2014-05-29 | Fei Co | Fibおよび/または電子顕微鏡とともに使用するデュアル・レーザ・ビーム・システム |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5377086B2 (ja) * | 2009-06-04 | 2013-12-25 | 株式会社日立ハイテクノロジーズ | レーザ加工方法、レーザ加工装置及びソーラパネル製造方法 |
US20120061356A1 (en) * | 2009-08-11 | 2012-03-15 | Hamamatsu Photonics K.K. | Laser machining device and laser machining method |
WO2011060582A1 (zh) * | 2009-11-19 | 2011-05-26 | 深圳市大族激光科技股份有限公司 | 多头激光加工方法及其装置 |
US20120160818A1 (en) * | 2010-06-14 | 2012-06-28 | Mitsubishi Electric Corporation | Laser machining apparatus and laser machining method |
KR20140062427A (ko) * | 2011-09-15 | 2014-05-23 | 니폰 덴키 가라스 가부시키가이샤 | 유리판 절단 방법 |
KR101379411B1 (ko) * | 2011-11-01 | 2014-04-01 | 주식회사 이오테크닉스 | 레이저 절단 장치 및 레이저 절단 방법 |
DE102012201194A1 (de) * | 2012-01-20 | 2013-07-25 | Rofin-Baasel Lasertech Gmbh & Co. Kg | Vorrichtung zum Laserbearbeiten eines Werkstückes |
WO2013116443A1 (en) * | 2012-02-01 | 2013-08-08 | Nscrypt, Inc. | Micro-dispensing multi-layered 3d objects with curing steps |
DE102015207279A1 (de) * | 2015-04-22 | 2016-10-27 | Ipg Laser Gmbh | Fügevorrichtung und Fügeverfahren |
AT517185B1 (de) * | 2015-05-13 | 2017-06-15 | Trotec Laser Gmbh | Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes () mit einem |
AT519177B1 (de) * | 2016-10-06 | 2019-04-15 | Trotec Laser Gmbh | Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit |
US11064611B2 (en) * | 2018-06-29 | 2021-07-13 | Ipg Photonics Corporation | Patterning and removal of circuit board material using ultrafast lasers |
CN110076450A (zh) * | 2019-05-10 | 2019-08-02 | 华中科技大学 | 双光束激光加工光学系统 |
CN114682934B (zh) * | 2022-06-01 | 2022-09-20 | 杭州凌像科技有限公司 | 多脉宽复合的印制电路板激光加工装置 |
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2006
- 2006-04-27 JP JP2006124084A patent/JP5025158B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-18 KR KR1020087027599A patent/KR101372350B1/ko active IP Right Grant
- 2007-04-18 EP EP07741875A patent/EP2011599B1/en not_active Expired - Fee Related
- 2007-04-18 CN CN2007800150539A patent/CN101432094B/zh not_active Expired - Fee Related
- 2007-04-18 WO PCT/JP2007/058439 patent/WO2007125799A1/ja active Application Filing
- 2007-04-20 TW TW096113904A patent/TWI395629B/zh not_active IP Right Cessation
-
2008
- 2008-10-24 US US12/257,760 patent/US8097829B2/en not_active Expired - Fee Related
Patent Citations (6)
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JPH09300087A (ja) * | 1996-05-14 | 1997-11-25 | Suzuki Motor Corp | レーザ溶接方法 |
JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
JPH10277764A (ja) * | 1997-04-07 | 1998-10-20 | Nippon Steel Corp | 厚鋼板のレーザ切断方法及び装置 |
JPH10277763A (ja) * | 1997-04-07 | 1998-10-20 | Nippon Steel Corp | 鋼板のレーザ切断方法及び装置 |
JP2002219590A (ja) * | 2001-01-26 | 2002-08-06 | Nippon Steel Corp | 亜鉛めっき鋼板の重ねレーザー溶接方法 |
JP2005238291A (ja) * | 2004-02-26 | 2005-09-08 | Sumitomo Heavy Ind Ltd | レーザ加工方法及びレーザ加工装置 |
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JP2011045916A (ja) * | 2009-08-28 | 2011-03-10 | Hitachi High-Technologies Corp | レーザ処理装置、太陽電池パネルの製造装置、太陽電池パネルおよびレーザ処理方法 |
JP2014097531A (ja) * | 2012-11-15 | 2014-05-29 | Fei Co | Fibおよび/または電子顕微鏡とともに使用するデュアル・レーザ・ビーム・システム |
US9991090B2 (en) | 2012-11-15 | 2018-06-05 | Fei Company | Dual laser beam system used with an electron microscope and FIB |
Also Published As
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CN101432094A (zh) | 2009-05-13 |
WO2007125799A1 (ja) | 2007-11-08 |
CN101432094B (zh) | 2012-10-31 |
KR101372350B1 (ko) | 2014-03-12 |
TWI395629B (zh) | 2013-05-11 |
EP2011599B1 (en) | 2012-11-21 |
US20090057284A1 (en) | 2009-03-05 |
EP2011599A4 (en) | 2009-11-18 |
KR20090013785A (ko) | 2009-02-05 |
JP5025158B2 (ja) | 2012-09-12 |
EP2011599A1 (en) | 2009-01-07 |
TW200800456A (en) | 2008-01-01 |
US8097829B2 (en) | 2012-01-17 |
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