JP2007285923A - 反射モードのx線回折を用いた限界寸法の測定 - Google Patents
反射モードのx線回折を用いた限界寸法の測定 Download PDFInfo
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- JP2007285923A JP2007285923A JP2006114489A JP2006114489A JP2007285923A JP 2007285923 A JP2007285923 A JP 2007285923A JP 2006114489 A JP2006114489 A JP 2006114489A JP 2006114489 A JP2006114489 A JP 2006114489A JP 2007285923 A JP2007285923 A JP 2007285923A
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- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006114489A JP2007285923A (ja) | 2006-04-18 | 2006-04-18 | 反射モードのx線回折を用いた限界寸法の測定 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006114489A JP2007285923A (ja) | 2006-04-18 | 2006-04-18 | 反射モードのx線回折を用いた限界寸法の測定 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007285923A true JP2007285923A (ja) | 2007-11-01 |
| JP2007285923A5 JP2007285923A5 (enExample) | 2011-11-24 |
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| JP2006114489A Pending JP2007285923A (ja) | 2006-04-18 | 2006-04-18 | 反射モードのx線回折を用いた限界寸法の測定 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010119844A1 (ja) * | 2009-04-14 | 2010-10-21 | 株式会社リガク | 表面微細構造計測方法、表面微細構造計測データ解析方法およびx線散乱測定装置 |
| JP2011203061A (ja) * | 2010-03-25 | 2011-10-13 | Toshiba Corp | パターン計測方法およびパターン計測装置 |
| US8243880B2 (en) | 2009-12-07 | 2012-08-14 | Kabushiki Kaisha Toshiba | Substrate measuring method and apparatus |
| JP2015191088A (ja) * | 2014-03-28 | 2015-11-02 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク及び表示装置の製造方法 |
| US9863764B2 (en) | 2015-09-11 | 2018-01-09 | Toshiba Memory Corporation | Storage medium, shape calculation device, and shape measurement method |
| JP2019505766A (ja) * | 2015-12-11 | 2019-02-28 | ケーエルエー−テンカー コーポレイション | 高アスペクト比構造向けx線スキャタロメトリ計量 |
| US10222709B2 (en) | 2015-02-04 | 2019-03-05 | Asml Netherlands B.V. | Metrology method, metrology apparatus and device manufacturing method |
| KR20200003256A (ko) * | 2017-05-30 | 2020-01-08 | 케이엘에이 코포레이션 | X-선 산란계측을 이용한 깊은 구조체들에 대한 프로세스 모니터링 |
| JP2022038389A (ja) * | 2020-08-26 | 2022-03-10 | キオクシア株式会社 | 計測装置、及び、計測方法、並びに、半導体記憶装置 |
| JP2023080920A (ja) * | 2021-11-30 | 2023-06-09 | 国立研究開発法人産業技術総合研究所 | ピッチ測定システム、ピッチ測定装置、ピッチ測定方法、ピッチ測定プログラム |
| CN118159836A (zh) * | 2021-10-24 | 2024-06-07 | 诺威量测设备公司 | 在多个测量情况下使用xps在小盒中进行特征化和测量 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09210663A (ja) * | 1995-11-30 | 1997-08-12 | Fujitsu Ltd | 膜厚測定方法及び膜の製造方法 |
| JPH11304728A (ja) * | 1998-04-23 | 1999-11-05 | Hitachi Ltd | X線計測装置 |
| JP2005172830A (ja) * | 2003-12-12 | 2005-06-30 | Timbre Technologies Inc | 集積回路構造のプロファイルを決定する方法及びシステム又はコンピュータ読取可能な記録媒体 |
| JP2005214712A (ja) * | 2004-01-28 | 2005-08-11 | Rigaku Corp | 膜厚測定方法及び装置 |
| JP2005265841A (ja) * | 2004-02-17 | 2005-09-29 | Omron Corp | 光学式測定装置および光学式測定方法 |
| JP2005315742A (ja) * | 2004-04-28 | 2005-11-10 | Sony Corp | 測定装置および測定方法 |
| JP2005326261A (ja) * | 2004-05-14 | 2005-11-24 | Japan Synchrotron Radiation Research Inst | 超微細構造体のx線迅速構造解析方法 |
-
2006
- 2006-04-18 JP JP2006114489A patent/JP2007285923A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09210663A (ja) * | 1995-11-30 | 1997-08-12 | Fujitsu Ltd | 膜厚測定方法及び膜の製造方法 |
| JPH11304728A (ja) * | 1998-04-23 | 1999-11-05 | Hitachi Ltd | X線計測装置 |
| JP2005172830A (ja) * | 2003-12-12 | 2005-06-30 | Timbre Technologies Inc | 集積回路構造のプロファイルを決定する方法及びシステム又はコンピュータ読取可能な記録媒体 |
| JP2005214712A (ja) * | 2004-01-28 | 2005-08-11 | Rigaku Corp | 膜厚測定方法及び装置 |
| JP2005265841A (ja) * | 2004-02-17 | 2005-09-29 | Omron Corp | 光学式測定装置および光学式測定方法 |
| JP2005315742A (ja) * | 2004-04-28 | 2005-11-10 | Sony Corp | 測定装置および測定方法 |
| JP2005326261A (ja) * | 2004-05-14 | 2005-11-24 | Japan Synchrotron Radiation Research Inst | 超微細構造体のx線迅速構造解析方法 |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010119844A1 (ja) * | 2009-04-14 | 2010-10-21 | 株式会社リガク | 表面微細構造計測方法、表面微細構造計測データ解析方法およびx線散乱測定装置 |
| GB2481950A (en) * | 2009-04-14 | 2012-01-11 | Rigaku Denki Co Ltd | Surface microstructure measuring method, surface microstructure measurement data analyzing method, and x-ray scattering measuring device |
| US8908830B2 (en) | 2009-04-14 | 2014-12-09 | Rigaku Corporation | Surface microstructure measurement method, surface microstructure measurement data analysis method and X-ray scattering measurement device |
| JP5700685B2 (ja) * | 2009-04-14 | 2015-04-15 | 株式会社リガク | 表面微細構造計測方法、表面微細構造計測データ解析方法およびx線散乱測定装置 |
| KR101741191B1 (ko) * | 2009-04-14 | 2017-05-29 | 가부시키가이샤 리가쿠 | 표면미세구조 계측방법, 표면미세구조 계측데이터 해석방법 및 x선 산란 측정장치 |
| GB2481950B (en) * | 2009-04-14 | 2017-08-23 | Rigaku Denki Co Ltd | Surface microstructure measurement method, surface microstructure measurement data analysis method and surface microstructure measurement system. |
| US8243880B2 (en) | 2009-12-07 | 2012-08-14 | Kabushiki Kaisha Toshiba | Substrate measuring method and apparatus |
| JP2011203061A (ja) * | 2010-03-25 | 2011-10-13 | Toshiba Corp | パターン計測方法およびパターン計測装置 |
| JP2015191088A (ja) * | 2014-03-28 | 2015-11-02 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク及び表示装置の製造方法 |
| US10222709B2 (en) | 2015-02-04 | 2019-03-05 | Asml Netherlands B.V. | Metrology method, metrology apparatus and device manufacturing method |
| US9863764B2 (en) | 2015-09-11 | 2018-01-09 | Toshiba Memory Corporation | Storage medium, shape calculation device, and shape measurement method |
| JP2019505766A (ja) * | 2015-12-11 | 2019-02-28 | ケーエルエー−テンカー コーポレイション | 高アスペクト比構造向けx線スキャタロメトリ計量 |
| KR20200003256A (ko) * | 2017-05-30 | 2020-01-08 | 케이엘에이 코포레이션 | X-선 산란계측을 이용한 깊은 구조체들에 대한 프로세스 모니터링 |
| JP2020522883A (ja) * | 2017-05-30 | 2020-07-30 | ケーエルエー コーポレイション | X線スキャトロメトリでの深層構造のプロセスモニタリング |
| JP7250705B2 (ja) | 2017-05-30 | 2023-04-03 | ケーエルエー コーポレイション | X線スキャトロメトリでの深層構造のプロセスモニタリング |
| KR102550482B1 (ko) | 2017-05-30 | 2023-06-30 | 케이엘에이 코포레이션 | X-선 산란계측을 이용한 깊은 구조체들에 대한 프로세스 모니터링 |
| KR20230098728A (ko) * | 2017-05-30 | 2023-07-04 | 케이엘에이 코포레이션 | X-선 산란계측을 이용한 깊은 구조체들에 대한 프로세스모니터링 |
| US11955391B2 (en) | 2017-05-30 | 2024-04-09 | Kla-Tencor Corporation | Process monitoring of deep structures with X-ray scatterometry |
| KR102722474B1 (ko) | 2017-05-30 | 2024-10-25 | 케이엘에이 코포레이션 | X-선 산란계측을 이용한 깊은 구조체들에 대한 프로세스 모니터링 |
| JP2022038389A (ja) * | 2020-08-26 | 2022-03-10 | キオクシア株式会社 | 計測装置、及び、計測方法、並びに、半導体記憶装置 |
| JP7458935B2 (ja) | 2020-08-26 | 2024-04-01 | キオクシア株式会社 | 計測装置、及び、計測方法 |
| CN118159836A (zh) * | 2021-10-24 | 2024-06-07 | 诺威量测设备公司 | 在多个测量情况下使用xps在小盒中进行特征化和测量 |
| JP2023080920A (ja) * | 2021-11-30 | 2023-06-09 | 国立研究開発法人産業技術総合研究所 | ピッチ測定システム、ピッチ測定装置、ピッチ測定方法、ピッチ測定プログラム |
| JP7659821B2 (ja) | 2021-11-30 | 2025-04-10 | 国立研究開発法人産業技術総合研究所 | ピッチ測定システム、ピッチ測定装置、ピッチ測定方法、ピッチ測定プログラム |
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