JP2007241999A5 - - Google Patents
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- Publication number
- JP2007241999A5 JP2007241999A5 JP2007019143A JP2007019143A JP2007241999A5 JP 2007241999 A5 JP2007241999 A5 JP 2007241999A5 JP 2007019143 A JP2007019143 A JP 2007019143A JP 2007019143 A JP2007019143 A JP 2007019143A JP 2007241999 A5 JP2007241999 A5 JP 2007241999A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- antenna
- conductive
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007019143A JP2007241999A (ja) | 2006-02-08 | 2007-01-30 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006031720 | 2006-02-08 | ||
| JP2007019143A JP2007241999A (ja) | 2006-02-08 | 2007-01-30 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007241999A JP2007241999A (ja) | 2007-09-20 |
| JP2007241999A5 true JP2007241999A5 (enrdf_load_stackoverflow) | 2010-03-11 |
Family
ID=38587424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007019143A Withdrawn JP2007241999A (ja) | 2006-02-08 | 2007-01-30 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007241999A (enrdf_load_stackoverflow) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101582503B1 (ko) | 2008-05-12 | 2016-01-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| JP5306705B2 (ja) * | 2008-05-23 | 2013-10-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5415713B2 (ja) * | 2008-05-23 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2009142310A1 (en) | 2008-05-23 | 2009-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| EP2297778A1 (en) | 2008-05-23 | 2011-03-23 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
| US8053253B2 (en) | 2008-06-06 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR20110027760A (ko) * | 2008-06-06 | 2011-03-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| JP5248412B2 (ja) | 2008-06-06 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI475282B (zh) | 2008-07-10 | 2015-03-01 | Semiconductor Energy Lab | 液晶顯示裝置和其製造方法 |
| KR101753574B1 (ko) | 2008-07-10 | 2017-07-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
| JP5216716B2 (ja) | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| WO2010032602A1 (en) * | 2008-09-18 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010032611A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2010035625A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semi conductor device |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101611643B1 (ko) * | 2008-10-01 | 2016-04-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101022493B1 (ko) * | 2008-11-28 | 2011-03-16 | 고려대학교 산학협력단 | Ｃｎｔ 박막트랜지스터 및 이를 적용하는 디스플레이 |
| KR101737053B1 (ko) * | 2010-12-31 | 2017-05-18 | 삼성전자주식회사 | 반도체 패키지 |
| JP5877814B2 (ja) * | 2013-05-07 | 2016-03-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2996103B2 (ja) * | 1994-09-05 | 1999-12-27 | アキレス株式会社 | 導電紙 |
| JP3520490B2 (ja) * | 1996-10-04 | 2004-04-19 | 北越製紙株式会社 | Ｉｃカード |
| JPH10198778A (ja) * | 1997-01-14 | 1998-07-31 | Rohm Co Ltd | Ｉｃカード |
| JP3933778B2 (ja) * | 1997-12-22 | 2007-06-20 | 三菱レイヨン株式会社 | 導電性被覆用水性樹脂組成物 |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| JP2000006523A (ja) * | 1998-06-24 | 2000-01-11 | Dainippon Printing Co Ltd | 熱転写シート及びそれを用いたｉｃカード |
| JP2000299411A (ja) * | 1999-02-10 | 2000-10-24 | Hitachi Maxell Ltd | チップ実装体及びその製造方法 |
| US6852790B2 (en) * | 2001-04-06 | 2005-02-08 | Cabot Corporation | Conductive polymer compositions and articles containing same |
| JP3925101B2 (ja) * | 2001-04-19 | 2007-06-06 | 特種製紙株式会社 | 偽造防止用シート状物の製造方法 |
| JP2003099744A (ja) * | 2001-09-25 | 2003-04-04 | Nec Tokin Corp | Ｉｃモジュール及びｉｃカード |
| JP2003283120A (ja) * | 2002-03-25 | 2003-10-03 | Toppan Forms Co Ltd | 導電接続部同士の接続方法 |
| US6937153B2 (en) * | 2002-06-28 | 2005-08-30 | Appleton Papers Inc. | Thermal imaging paper laminate |
| KR20060126481A (ko) * | 2003-10-29 | 2006-12-07 | 컨덕티브 잉크젯 테크놀로지 리미티드 | 컴퍼넌트들의 전기적 접속 |
| JP2005174220A (ja) * | 2003-12-15 | 2005-06-30 | Konica Minolta Photo Imaging Inc | Ｉｃカード及びｉｃカードの製造方法 |
| JP4494003B2 (ja) * | 2003-12-19 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP4836465B2 (ja) * | 2004-02-06 | 2011-12-14 | 株式会社半導体エネルギー研究所 | 薄膜集積回路の作製方法及び薄膜集積回路用素子基板 |
| JP2005268271A (ja) * | 2004-03-16 | 2005-09-29 | Shimadzu Corp | 光または放射線用二次元検出器 |
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2007
- 2007-01-30 JP JP2007019143A patent/JP2007241999A/ja not_active Withdrawn