JP2006285958A5 - - Google Patents

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Publication number
JP2006285958A5
JP2006285958A5 JP2006036511A JP2006036511A JP2006285958A5 JP 2006285958 A5 JP2006285958 A5 JP 2006285958A5 JP 2006036511 A JP2006036511 A JP 2006036511A JP 2006036511 A JP2006036511 A JP 2006036511A JP 2006285958 A5 JP2006285958 A5 JP 2006285958A5
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JP
Japan
Prior art keywords
integrated circuit
patch antenna
wireless chip
electrically connected
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006036511A
Other languages
English (en)
Japanese (ja)
Other versions
JP4974541B2 (ja
JP2006285958A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006036511A priority Critical patent/JP4974541B2/ja
Priority claimed from JP2006036511A external-priority patent/JP4974541B2/ja
Publication of JP2006285958A publication Critical patent/JP2006285958A/ja
Publication of JP2006285958A5 publication Critical patent/JP2006285958A5/ja
Application granted granted Critical
Publication of JP4974541B2 publication Critical patent/JP4974541B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006036511A 2005-03-08 2006-02-14 無線チップの作製方法 Expired - Fee Related JP4974541B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006036511A JP4974541B2 (ja) 2005-03-08 2006-02-14 無線チップの作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005064271 2005-03-08
JP2005064271 2005-03-08
JP2006036511A JP4974541B2 (ja) 2005-03-08 2006-02-14 無線チップの作製方法

Publications (3)

Publication Number Publication Date
JP2006285958A JP2006285958A (ja) 2006-10-19
JP2006285958A5 true JP2006285958A5 (enrdf_load_stackoverflow) 2009-01-08
JP4974541B2 JP4974541B2 (ja) 2012-07-11

Family

ID=37407767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006036511A Expired - Fee Related JP4974541B2 (ja) 2005-03-08 2006-02-14 無線チップの作製方法

Country Status (1)

Country Link
JP (1) JP4974541B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101478810B1 (ko) 2006-07-28 2015-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 축전 장치
JP4996383B2 (ja) * 2006-07-28 2012-08-08 株式会社半導体エネルギー研究所 蓄電装置
EP1962408B1 (en) * 2006-11-16 2015-05-27 Semiconductor Energy Laboratory Co., Ltd. Radio field intensity measurement device, and radio field intensity detector and game console using the same
JP2008135446A (ja) 2006-11-27 2008-06-12 Philtech Inc Ｒｆパウダーの製造方法
JP2008134694A (ja) 2006-11-27 2008-06-12 Philtech Inc Ｒｆパウダーの付加方法およびｒｆパウダー付加基体シート
JP2008134695A (ja) 2006-11-27 2008-06-12 Philtech Inc 基体データ管理システム
JP2008135951A (ja) 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダー含有基体
JP2008134816A (ja) 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダーの励起方法
JP2008134815A (ja) 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダーの提供方法およびｒｆパウダー含有液
WO2008081699A1 (ja) 2006-12-28 2008-07-10 Philtech Inc. 基体シート
US8143721B2 (en) * 2007-06-29 2012-03-27 Intel Corporation Package substrate dynamic pressure structure
US11107781B2 (en) 2017-03-30 2021-08-31 Intel Corporation RFIC having coaxial interconnect and molded layer
CN112420686B (zh) * 2019-12-12 2024-04-05 友达光电股份有限公司 芯片装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173696A (ja) * 1987-12-26 1989-07-10 Nissha Printing Co Ltd 積層回路基板
JPH03132095A (ja) * 1989-10-18 1991-06-05 Toshiba Corp 異方性導電接着剤接続構造および異方性導電接着剤接続方法
JPH0745787A (ja) * 1993-08-02 1995-02-14 Tdk Corp 薄膜複合集積回路部品及びその製造方法
JPH08139522A (ja) * 1994-09-13 1996-05-31 Matsushita Electric Works Ltd 複合型アンテナ及びアンテナユニット
JP3481481B2 (ja) * 1998-12-24 2003-12-22 日本電気株式会社 フェーズドアレイアンテナおよびその製造方法
JP2001177314A (ja) * 1999-12-17 2001-06-29 Tdk Corp パッチアンテナ
US7160258B2 (en) * 2001-06-26 2007-01-09 Entrack, Inc. Capsule and method for treating or diagnosing the intestinal tract
JP4393859B2 (ja) * 2002-12-27 2010-01-06 株式会社半導体エネルギー研究所 記録媒体の作製方法
JP4566578B2 (ja) * 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
JP2006024087A (ja) * 2004-07-09 2006-01-26 Nec Corp 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法

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