JP2007234656A - 複数個取り配線基板用セラミック生成形体の製造方法、複数個取り配線基板の製造方法、電子部品収納用パッケージおよび電子装置 - Google Patents
複数個取り配線基板用セラミック生成形体の製造方法、複数個取り配線基板の製造方法、電子部品収納用パッケージおよび電子装置 Download PDFInfo
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Abstract
【解決手段】複数の配線基板領域7が縦横に配置されており、複数の配線基板領域7に凹部4を有するとともに、凹部4の周囲に少なくとも一部が配線基板領域7内に位置する穴部2が配設されたセラミック生成形体5を準備する工程と、セラミック生成形体5の穴部2上若しくは凹部4に対して穴部2よりも外方に位置するに分割溝用の切込み6を形成する工程とを有する。
【選択図】図1
Description
1a・・・凹部4の外周部となるセラミックグリーンシート
1b・・・電子部品の搭載部が形成されるセラミックグリーンシート
2・・・穴部
2a・・・穴部用の貫通穴
3・・・配線パターン
4・・・凹部
4a・・・凹部用の貫通穴
5・・・セラミック生成形体
6・・・切込み
7・・・配線基板領域
Claims (10)
- 複数の配線基板領域が縦横に配置されており、前記複数の配線基板領域に凹部を有するとともに、前記凹部の周囲に少なくとも一部が前記配線基板領域内に位置する穴部が配設されたセラミック生成形体を準備する工程と、前記セラミック生成形体の前記穴部上若しくは前記凹部に対して前記穴部よりも外方に位置する分割溝用の切込みを形成する工程とを有することを特徴とする複数個取り配線基板用セラミック生成形体の製造方法。
- 前記穴部が、前記複数の配線基板領域の外縁と前記凹部との間に配設されていることを特徴とする請求項1記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 前記穴部が、前記複数の配線基板領域の外縁に配設されていることを特徴とする請求項1記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 前記切込みの深さは、前記凹部の深さ未満であり、前記穴部の深さは、前記切込みの深さ以上であることを特徴とする請求項1乃至請求項3のいずれかに記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 前記切込みの深さは、前記凹部の深さ以上であり、前記穴部の深さは、前記凹部の深さ以上であることを特徴とする請求項1乃至請求項3のいずれかに記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 前記穴部の長さは、前記凹部の長さ以上であることを特徴とする請求項1乃至請求項5のいずれかに記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 前記穴部は、前記凹部の長さ方向に複数配設されており、前記凹部から前記配線基板領域の外縁方向において前記複数の穴部のそれぞれは重なり合うように配列されているとともに、前記複数の穴部の配列は前記凹部の長さ以上であることを特徴とする請求項1乃至請求項5のいずれかに記載の複数個取り配線基板用セラミック生成形体の製造方法。
- 請求項1乃至請求項7のいずれかに記載の製造方法により得られた前記セラミック生成形体を焼成する工程を有することを特徴とする複数個取り配線基板の製造方法。
- 請求項8記載の製造方法により得られた複数個取り配線基板が前記複数の配線基板領域ごとに分割されることにより個片化されたことを特徴とする電子部品収納用パッケージ。
- 請求項9記載の電子部品収納用パッケージと、該電子部品収納用パッケージに搭載された電子部品とを備えていることを特徴とする電子装置。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010153423A (ja) * | 2008-12-24 | 2010-07-08 | Kyocera Corp | 多数個取り配線基板および配線基板ならびに電子装置 |
CN113764288A (zh) * | 2021-08-02 | 2021-12-07 | 苏州通富超威半导体有限公司 | 一种芯片封装方法及封装结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003017816A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多数個取り配線基板 |
JP2004119889A (ja) * | 2002-09-27 | 2004-04-15 | Kyocera Corp | セラミックス基板 |
JP2004349564A (ja) * | 2003-05-23 | 2004-12-09 | Kyocera Corp | 多数個取り配線基板 |
JP2006041269A (ja) * | 2004-07-28 | 2006-02-09 | Kyocera Corp | 多数個取り配線基板 |
JP2006049551A (ja) * | 2004-08-04 | 2006-02-16 | Ngk Spark Plug Co Ltd | セラミック基板の製造方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003017816A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多数個取り配線基板 |
JP2004119889A (ja) * | 2002-09-27 | 2004-04-15 | Kyocera Corp | セラミックス基板 |
JP2004349564A (ja) * | 2003-05-23 | 2004-12-09 | Kyocera Corp | 多数個取り配線基板 |
JP2006041269A (ja) * | 2004-07-28 | 2006-02-09 | Kyocera Corp | 多数個取り配線基板 |
JP2006049551A (ja) * | 2004-08-04 | 2006-02-16 | Ngk Spark Plug Co Ltd | セラミック基板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153423A (ja) * | 2008-12-24 | 2010-07-08 | Kyocera Corp | 多数個取り配線基板および配線基板ならびに電子装置 |
CN113764288A (zh) * | 2021-08-02 | 2021-12-07 | 苏州通富超威半导体有限公司 | 一种芯片封装方法及封装结构 |
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