JP2007214413A5 - - Google Patents

Download PDF

Info

Publication number
JP2007214413A5
JP2007214413A5 JP2006033464A JP2006033464A JP2007214413A5 JP 2007214413 A5 JP2007214413 A5 JP 2007214413A5 JP 2006033464 A JP2006033464 A JP 2006033464A JP 2006033464 A JP2006033464 A JP 2006033464A JP 2007214413 A5 JP2007214413 A5 JP 2007214413A5
Authority
JP
Japan
Prior art keywords
runner
sub
semiconductor device
lead frame
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006033464A
Other languages
English (en)
Japanese (ja)
Other versions
JP4730830B2 (ja
JP2007214413A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006033464A priority Critical patent/JP4730830B2/ja
Priority claimed from JP2006033464A external-priority patent/JP4730830B2/ja
Publication of JP2007214413A publication Critical patent/JP2007214413A/ja
Publication of JP2007214413A5 publication Critical patent/JP2007214413A5/ja
Application granted granted Critical
Publication of JP4730830B2 publication Critical patent/JP4730830B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006033464A 2006-02-10 2006-02-10 半導体デバイスの製造方法 Expired - Fee Related JP4730830B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006033464A JP4730830B2 (ja) 2006-02-10 2006-02-10 半導体デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006033464A JP4730830B2 (ja) 2006-02-10 2006-02-10 半導体デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2007214413A JP2007214413A (ja) 2007-08-23
JP2007214413A5 true JP2007214413A5 (enrdf_load_stackoverflow) 2008-11-27
JP4730830B2 JP4730830B2 (ja) 2011-07-20

Family

ID=38492566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006033464A Expired - Fee Related JP4730830B2 (ja) 2006-02-10 2006-02-10 半導体デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP4730830B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5261851B2 (ja) * 2010-04-08 2013-08-14 三菱電機株式会社 半導体装置の製造方法
CN109003957A (zh) * 2018-09-18 2018-12-14 江苏捷捷微电子股份有限公司 Sot-89/223-2l引线框架及两脚结构的制备方法
CN119238829B (zh) * 2024-10-09 2025-07-29 四川顺芯半导体科技有限公司 一种自动去毛刺装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05124069A (ja) * 1991-11-02 1993-05-21 Emutetsukusu Matsumura Kk 電子部品モールド金型
JP3722240B2 (ja) * 1996-02-13 2005-11-30 ローム株式会社 電子部品の樹脂封止装置及び製造方法
JPH10154719A (ja) * 1996-11-25 1998-06-09 Murata Mfg Co Ltd リード端子付き樹脂成形品の製造方法及び金型
JP2000299329A (ja) * 1999-04-12 2000-10-24 Mitsubishi Electric Corp 樹脂パッケージ型半導体装置の製造装置及び製造方法
JP2004111465A (ja) * 2002-09-13 2004-04-08 Toshiba Corp 半導体組立装置

Similar Documents

Publication Publication Date Title
JP4443334B2 (ja) 半導体素子の樹脂封止成形方法
CN102324413B (zh) 有基岛预填塑封料先刻后镀引线框结构及其生产方法
CN103531493A (zh) 半导体器件封装及其制作方法
CN102324412B (zh) 无基岛预填塑封料先镀后刻引线框结构及其生产方法
CN102324415A (zh) 无基岛预填塑封料先刻后镀引线框结构及其生产方法
JP2007214413A5 (enrdf_load_stackoverflow)
CN109742034A (zh) 一种封装结构、封装方法及在封装方法中使用的模板
CN109904077B (zh) 多管脚半导体产品的封装方法
TWI265617B (en) Lead-frame-based semiconductor package with lead frame and lead frame thereof
JP4421934B2 (ja) 半導体装置の製造方法
JP6034078B2 (ja) プリモールドリードフレームの製造方法、および、半導体装置の製造方法
JP2011040625A (ja) 半導体装置の製造方法
WO2008022165A3 (en) Selective removal of gold from a lead frame
CN202084532U (zh) To92型号封装盒及配套模具
JP4730830B2 (ja) 半導体デバイスの製造方法
TW202312286A (zh) 封裝導線架的製作方法
JP5923293B2 (ja) モールド金型
JP6338406B2 (ja) 半導体装置の製造方法
JP5907084B2 (ja) 半導体装置の製造方法
JP2010010634A (ja) リードフレーム及び半導体装置の製造方法
JP2009158978A5 (enrdf_load_stackoverflow)
TWI420623B (zh) 避免回包在基板條上之模封方法與模具
KR101198051B1 (ko) 얇은 포일 반도체 패키지
KR101375185B1 (ko) 리드 프레임의 제조 방법 및 이를 이용한 반도체 패키지의 제조 방법
CN202018955U (zh) 半导体封装模具