CN102324412B - 无基岛预填塑封料先镀后刻引线框结构及其生产方法 - Google Patents

无基岛预填塑封料先镀后刻引线框结构及其生产方法 Download PDF

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CN102324412B
CN102324412B CN2011102683574A CN201110268357A CN102324412B CN 102324412 B CN102324412 B CN 102324412B CN 2011102683574 A CN2011102683574 A CN 2011102683574A CN 201110268357 A CN201110268357 A CN 201110268357A CN 102324412 B CN102324412 B CN 102324412B
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metal substrate
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CN102324412A (zh
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梁志忠
谢洁人
吴昊
耿丛正
夏文斌
郁科峰
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Abstract

本发明涉及一种无基岛预填塑封料先镀后刻引线框结构及其生产方法，所述结构包括引脚（2），所述引脚（2）正面镀有第一金属层（5），引脚（2）背面镀有第二金属层（6），所述引脚（2）与引脚（2）之间的蚀刻区域填充有塑封料（4），所述塑封料（4）与第一金属层（5）和第二金属层（6）齐平。本发明的有益效果是：引线框底部不需要再贴附一层昂贵的抗高温软性有机物胶膜，也没有背景中所述的装片、打线、包封会产生的各种问题，成品良率得到大大提升，而且引线框采用正背面同时蚀刻，在工序上可减少50%的复杂度，降低了成本，又可以减少因为二次对位造成的错位风险。

Description

无基岛预填塑封料先镀后刻引线框结构及其生产方法
技术领域
本发明涉及一种引线框结构及其生产方法，属于半导体封装技术领域。
背景技术
传统的引线框结构主要有两种：
一种是四面扁平无引脚封装（QFN）引线框，这种结构的引线框为了防止引线框正面包封作业时，引线框的背面会产生塑封料的溢料，故在引线框背面贴附有一层昂贵的高温胶膜（如图14所示），这种引线框结构存在以下缺点：
1、金属引线框的底部贴附了一层抗高温胶膜，增加了至少50%的引线框成本；
2、金属引线框底部贴附的胶膜是软性有机物质，所以在后续的封装过程的装片与金属丝键合作业中，会因为高温烘烤产生了有机物的挥发性污染，会直接污染到芯片正面与引线框正面与金属丝键合的结合性，甚至会影响到芯片正面与引线框正面后续封装过程中导致与塑封料的结合能力失败（俗称分层）；
3、因为引线框底部贴附了软性有机胶膜，所以在后续的封装过程中的金属丝键合作业中，其部分键合的力量被软性的有机胶膜给吸收，增加了金属丝键合的难度，造成金属丝键合良率的不稳定，可能产生可靠性问题；
4、因为引线框底部贴附了软性有机胶膜，致使键合作业时金属丝材料也被受限在较为软性且昂贵的金丝，而不能使用硬质且成本低廉的铜质、铝质或其他低成本的金属丝或金属带；
5、因为引线框底部贴附了软性有机胶膜，所以在后续的包封作业时，会因为胶膜与金属引线框发生分离而造成在高压塑封过程中，塑封料渗入管脚或基岛与软性有机胶膜的中间（如图15、图16所示）。
6、通常情况下QFN产品必须存在金属基岛才可以装片，有时候会给线路板设计带来一些麻烦，因为必须要防止线路与金属基岛短路。
另一种双面蚀刻预包封引线框（如图17所示）的设计与制造是采用金属基板先进行背面蚀刻后，再进行背面塑封料的预包封，然后再进行引线框正面引脚的蚀刻与表面电镀。这种引线框结构存在以下缺点：
1、引线框的制作程序太过复杂，造成引线框成本增加；
2、引线框的蚀刻分成上下面各蚀刻一次，容易因为上下蚀刻位置的重复定位误差，造成错位。
发明内容
本发明的目的在于克服上述不足，提供一种无基岛预填塑封料先镀后刻引线框结构及其生产方法，它省去了背面的耐高温胶膜，当然地解决了因软性胶膜所带来的缺点，并同时的降低了封装材料、制程与生产效率等的成本，相对的提高了封装过程的可靠性，而且生产工艺步骤简单、成本低，并且可以再无金属基岛时装片，给线路板设计带来方便。
本发明的目的是这样实现的：一种无基岛预填塑封料先镀后刻引线框结构，它包括引脚，所述引脚正面镀有第一金属层，引脚背面镀有第二金属层，所述引脚与引脚之间的蚀刻区域填充有塑封料，所述塑封料与第一金属层和第二金属层齐平。
本发明无基岛预填塑封料先镀后刻引线框的生产方法，所述方法包括以下工艺步骤：
步骤一、取金属基板
步骤二、贴膜作业
利用贴膜设备在金属基板的正面及背面分别贴上可进行曝光显影的光刻胶膜，
步骤三、金属基板正面及背面去除部分光刻胶膜
利用曝光显影设备将步骤二完成贴膜作业的金属基板正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板上后续需要进行电镀的区域，
步骤四、镀金属层
在步骤三中金属基板正面去除部分光刻胶膜的区域镀上第一金属层，在步骤三中金属基板背面去除部分光刻胶膜的区域镀上第二金属层，
步骤五、金属基板正面及背面揭膜作业
将金属基板正面及背面余下的光刻胶膜揭除，
步骤六、贴膜作业
利用贴膜设备在步骤五揭除光刻胶膜后的金属基板正面及背面再次分别贴上可进行曝光显影的光刻胶膜，
步骤七、金属基板正面及背面去除部分光刻胶膜
利用曝光显影设备将步骤六完成贴膜作业的金属基板正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板上后续需要进行蚀刻的区域，
步骤八、金属基板正面及背面进行全蚀刻或半蚀刻
对步骤七中金属基板正面及背面去除部分光刻胶膜的区域同时进行全蚀刻或半蚀刻，在金属基板正面及背面形成凹陷的蚀刻区域，同时相对形引脚，
步骤九、金属基板正面及背面揭膜作业
将金属基板正面及背面余下的光刻胶膜揭除，
步骤十、金属基板蚀刻区域预填充塑封料
在步骤八形成的金属基板的蚀刻区域内，利用包封模具填充塑封料，完成引线框的预填充，
所述包封模具包括上模具和下模具，所述下模具或上模具上开设有注料孔，包封时将步骤就揭除光刻胶膜后的金属基板放置于上模具与下模具之间，待上模具和下模具合模后通过下模具上向上的注料孔或上模具上向下的注料孔往引脚与引脚之间的蚀刻区域内填充塑封料，完成引线框的预填充。
与现有技术相比，本发明的有益效果是：
本发明涉及一种无基岛预填塑封料先镀后刻引线框结构，其引脚与引脚之间的蚀刻区域内填充有塑封料，且塑封料与第一金属层和第二金属层齐平，它具有以下优点：
1、引线框底部不需要再贴附一层昂贵的抗高温软性有机物胶膜。因此也没有前面背景中所述的装片、打线、包封会产生的各种问题，材料成本、制程成本与质量成本等都得到大大降低，并且可以再无金属基岛时装片，给线路板设计带来方便。
2、引线框采用正背面同时蚀刻，对比双面蚀刻预包封引线框，在工序上可减少50%的复杂度，降低成本；又可以减少因为二次对位造成的错位风险。
附图说明
图1~图12为本发明无基岛预填塑封料先镀后刻引线框的生产方法各工序示意图。
图13为本发明无基岛预填塑封料先镀后刻引线框结构示意图。
图14为以往四面无引脚引线框背面贴上耐高温胶膜的示意图。
图15为以往背面贴上耐高温胶膜的四面无引脚引线框封装时溢料的示意图。
图16为封装时产生溢料的四面无引脚引线框封装揭下耐高温胶膜后的示意图。
图17为以往预包封双面蚀刻引线框的结构示意图。
其中：
基岛1
引脚2
耐高温胶膜3
塑封料4
第一金属层5
第二金属层6
上模具7
下模具8
金属基板9
光刻胶膜10和11
蚀刻区域12。
具体实施方式
本发明涉及一种无基岛预填塑封料先镀后刻引线框生产方法如下：
步骤一、取金属基板
参见图1，取一片厚度合适的金属基板9，金属基板9的材质可以依据芯片的功能与特性进行变换，例如：铜、铝、铁、铜合金、不锈钢或镍铁合金等。
步骤二、贴膜作业
参见图2，利用贴膜设备在镀完金属层的金属基板9正面及背面分别贴上可进行曝光显影的光刻胶膜10和11，所述光刻胶膜10和11可以是干膜，也可以是湿膜。
步骤三、金属基板正面及背面去除部分光刻胶膜
参见图3，利用曝光显影设备将步骤二完成贴膜作业的金属基板9正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板9上后续需要进行电镀的区域。
步骤四、镀金属层
参见图4，在步骤三中金属基板9正面去除部分光刻胶膜的区域镀上第一金属层5，在步骤三中金属基板9背面去除部分光刻胶膜的区域镀上第二金属层6，电镀的材料可以为金、镍金、镍钯金或银。
步骤五、金属基板正面及背面揭膜作业
参见图5，将金属基板9正面及背面余下的光刻胶膜揭除。
步骤六、贴膜作业
参见图6，利用贴膜设备在步骤五揭除光刻胶膜后的金属基板9正面及背面再次分别贴上可进行曝光显影的光刻胶膜10和11，以保护后续的蚀刻工艺作业，所述光刻胶膜10和11可以是干膜，也可以是湿膜。
步骤七、金属基板正面及背面去除部分光刻胶膜
参见图7，利用曝光显影设备将步骤六完成贴膜作业的金属基板9正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板9上后续需要进行蚀刻的区域。
步骤八、金属基板正面及背面进行全蚀刻或半蚀刻
参见图5，对步骤七中金属基板9正面及背面去除部分光刻胶膜的区域同时进行全蚀刻或半蚀刻，在金属基板9正面及背面形成凹陷的蚀刻区域12，同时相对形成引脚2。
步骤九、金属基板正面及背面揭膜作业
参见图9，将金属基板正面及背面余下的光刻胶膜揭除。
步骤十、金属基板蚀刻区域预填充塑封料
参见图10~图12，在步骤八形成的金属基板的蚀刻区域内，利用包封模具填充塑封料，完成引线框的预填充。
所述包封模具包括上模具7和下模具8，所述上模具7或下模具8上开设有注料孔，包封时将步骤九揭除光刻胶膜后的金属基板放置于上模具7与下模具8之间，待上模具7和下模具8合模后通过下模具8向上的注料孔或上模具7向下的注料孔往引脚2与引脚2之间的蚀刻区域12内填充塑封料，完成引线框的预填充。
最后成品参见图13，本发明无基岛预填塑封料先镀后刻引线框结构，它包括引脚2，所述引脚2的正面镀有第一金属层5，引脚2的背面镀有第二金属层6，所述引脚2与引脚2之间的蚀刻区域填充有塑封料4，所述塑封料4与第一金属层5和第二金属层6齐平。

Claims (2)

1.一种无基岛预填塑封料先镀后刻引线框结构，它包括引脚（2），所述引脚（2）正面镀有第一金属层（5），引脚（2）背面镀有第二金属层（6），其特征在于：所述引脚（2）与引脚（2）之间的蚀刻区域填充有塑封料（4），所述塑封料（4）与第一金属层（5）的正面和第二金属层（6）的背面齐平。
2.一种如权利要求1所述的无基岛预填塑封料先镀后刻引线框结构的生产方法，其特征在于所述方法包括以下工艺步骤：
步骤一、取金属基板，
步骤二、贴膜作业，
利用贴膜设备在金属基板的正面及背面分别贴上可进行曝光显影的光刻胶膜，
步骤三、金属基板正面及背面去除部分光刻胶膜，
利用曝光显影设备将步骤二完成贴膜作业的金属基板正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板上后续需要进行电镀的区域，
步骤四、镀金属层，
在步骤三中金属基板正面去除部分光刻胶膜的区域镀上第一金属层，在步骤三中金属基板背面去除部分光刻胶膜的区域镀上第二金属层，
步骤五、金属基板正面及背面揭膜作业，
将金属基板正面及背面余下的光刻胶膜揭除，
步骤六、贴膜作业，
利用贴膜设备在步骤五揭除光刻胶膜后的金属基板正面及背面再次分别贴上可进行曝光显影的光刻胶膜，
步骤七、金属基板正面及背面去除部分光刻胶膜，
利用曝光显影设备将步骤六完成贴膜作业的金属基板正面及背面进行曝光、显影与去除部分光刻胶膜，以露出金属基板上后续需要进行蚀刻的区域，
步骤八、金属基板正面及背面进行全蚀刻或半蚀刻，
对步骤七中金属基板正面及背面去除部分光刻胶膜的区域同时进行全蚀刻或半蚀刻，在金属基板正面及背面形成凹陷的蚀刻区域，同时相对形成引脚，
步骤九、金属基板正面及背面揭膜作业，
将金属基板正面及背面余下的光刻胶膜揭除，
步骤十、金属基板蚀刻区域预填充塑封料，
在步骤八形成的金属基板的蚀刻区域内，利用包封模具填充塑封料，完成引线框的预填充，
所述包封模具包括上模具和下模具，所述下模具或上模具上开设有注料孔，包封时将步骤九揭除光刻胶膜后的金属基板放置于上模具与下模具之间，待上模具和下模具合模后通过下模具上向上的注料孔或上模具上向下的注料孔往引脚与引脚之间的蚀刻区域内填充塑封料，完成引线框的预填充。
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