JP2007211182A - 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 - Google Patents
樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 Download PDFInfo
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- JP2007211182A JP2007211182A JP2006034212A JP2006034212A JP2007211182A JP 2007211182 A JP2007211182 A JP 2007211182A JP 2006034212 A JP2006034212 A JP 2006034212A JP 2006034212 A JP2006034212 A JP 2006034212A JP 2007211182 A JP2007211182 A JP 2007211182A
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- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009185170A (ja) * | 2008-02-06 | 2009-08-20 | Kyocera Chemical Corp | プリプレグ、金属張り積層板およびプリント配線板 |
| WO2012002434A1 (ja) * | 2010-07-01 | 2012-01-05 | 住友ベークライト株式会社 | プリプレグ、配線板および半導体装置 |
| CN102390119A (zh) * | 2011-09-08 | 2012-03-28 | 洛阳轴研科技股份有限公司 | 滚动轴承用碳-酚醛层压保持架材料的制作方法 |
| US20120305291A1 (en) * | 2011-05-31 | 2012-12-06 | Daisuke Fujimoto | Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereof |
| JP2012255552A (ja) * | 2012-07-11 | 2012-12-27 | Nsk Ltd | 転がり軸受 |
| CN103101199A (zh) * | 2012-11-07 | 2013-05-15 | 洛阳轴研科技股份有限公司 | 球轴承保持架用复合材料的制备方法 |
| JP2015205397A (ja) * | 2014-04-17 | 2015-11-19 | 日立化成株式会社 | 積層板 |
| JP2016053182A (ja) * | 2015-11-25 | 2016-04-14 | パナソニックＩｐマネジメント株式会社 | 電子回路基板材料用樹脂組成物、プリプレグ、積層板及び金属張積層板 |
| JP2016053181A (ja) * | 2015-11-25 | 2016-04-14 | パナソニックＩｐマネジメント株式会社 | 電子回路基板材料用樹脂組成物、プリプレグ、積層板及び金属張積層板 |
| JP2016065250A (ja) * | 2015-11-25 | 2016-04-28 | パナソニックＩｐマネジメント株式会社 | プリプレグ、積層板及び金属張積層板 |
| JP2018131619A (ja) * | 2017-02-14 | 2018-08-23 | 味の素株式会社 | 樹脂組成物 |
| JP2018172552A (ja) * | 2017-03-31 | 2018-11-08 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009185170A (ja) * | 2008-02-06 | 2009-08-20 | Kyocera Chemical Corp | プリプレグ、金属張り積層板およびプリント配線板 |
| WO2012002434A1 (ja) * | 2010-07-01 | 2012-01-05 | 住友ベークライト株式会社 | プリプレグ、配線板および半導体装置 |
| JPWO2012002434A1 (ja) * | 2010-07-01 | 2013-08-29 | 住友ベークライト株式会社 | プリプレグ、配線板および半導体装置 |
| US20120305291A1 (en) * | 2011-05-31 | 2012-12-06 | Daisuke Fujimoto | Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereof |
| CN102390119A (zh) * | 2011-09-08 | 2012-03-28 | 洛阳轴研科技股份有限公司 | 滚动轴承用碳-酚醛层压保持架材料的制作方法 |
| JP2012255552A (ja) * | 2012-07-11 | 2012-12-27 | Nsk Ltd | 転がり軸受 |
| CN103101199A (zh) * | 2012-11-07 | 2013-05-15 | 洛阳轴研科技股份有限公司 | 球轴承保持架用复合材料的制备方法 |
| JP2015205397A (ja) * | 2014-04-17 | 2015-11-19 | 日立化成株式会社 | 積層板 |
| JP2016053182A (ja) * | 2015-11-25 | 2016-04-14 | パナソニックＩｐマネジメント株式会社 | 電子回路基板材料用樹脂組成物、プリプレグ、積層板及び金属張積層板 |
| JP2016053181A (ja) * | 2015-11-25 | 2016-04-14 | パナソニックＩｐマネジメント株式会社 | 電子回路基板材料用樹脂組成物、プリプレグ、積層板及び金属張積層板 |
| JP2016065250A (ja) * | 2015-11-25 | 2016-04-28 | パナソニックＩｐマネジメント株式会社 | プリプレグ、積層板及び金属張積層板 |
| JP2018131619A (ja) * | 2017-02-14 | 2018-08-23 | 味の素株式会社 | 樹脂組成物 |
| JP7151092B2 (ja) | 2017-02-14 | 2022-10-12 | 味の素株式会社 | 樹脂組成物 |
| JP2018172552A (ja) * | 2017-03-31 | 2018-11-08 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
| JP7098881B2 (ja) | 2017-03-31 | 2022-07-12 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
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