JP2007207810A5 - - Google Patents
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- Publication number
- JP2007207810A5 JP2007207810A5 JP2006021899A JP2006021899A JP2007207810A5 JP 2007207810 A5 JP2007207810 A5 JP 2007207810A5 JP 2006021899 A JP2006021899 A JP 2006021899A JP 2006021899 A JP2006021899 A JP 2006021899A JP 2007207810 A5 JP2007207810 A5 JP 2007207810A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- etching
- supply nozzle
- nozzle
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims 17
- 235000012431 wafers Nutrition 0.000 claims 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 239000007788 liquid Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000013078 crystal Substances 0.000 claims 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 2
- 229940048662 kwai Drugs 0.000 claims 2
- 230000003796 beauty Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006021899A JP4835175B2 (ja) | 2006-01-31 | 2006-01-31 | ウェーハの枚葉式エッチング方法 |
| KR1020070007123A KR100948286B1 (ko) | 2006-01-31 | 2007-01-23 | 매엽식 웨이퍼 식각 장치 및 매엽식 웨이퍼 식각 방법 |
| US11/669,431 US7906438B2 (en) | 2006-01-31 | 2007-01-31 | Single wafer etching method |
| KR1020090002214A KR20090012364A (ko) | 2006-01-31 | 2009-01-12 | 매엽식 웨이퍼 식각 장치 및 매엽식 웨이퍼 식각 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006021899A JP4835175B2 (ja) | 2006-01-31 | 2006-01-31 | ウェーハの枚葉式エッチング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007207810A JP2007207810A (ja) | 2007-08-16 |
| JP2007207810A5 true JP2007207810A5 (enExample) | 2010-12-09 |
| JP4835175B2 JP4835175B2 (ja) | 2011-12-14 |
Family
ID=38321003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006021899A Expired - Fee Related JP4835175B2 (ja) | 2006-01-31 | 2006-01-31 | ウェーハの枚葉式エッチング方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7906438B2 (enExample) |
| JP (1) | JP4835175B2 (enExample) |
| KR (2) | KR100948286B1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218545A (ja) * | 2007-03-01 | 2008-09-18 | Sumco Corp | ウェーハの枚葉式エッチング装置 |
| JP2010003847A (ja) * | 2008-06-19 | 2010-01-07 | Sumco Corp | 半導体ウェーハの製造方法 |
| JP5026356B2 (ja) * | 2008-06-26 | 2012-09-12 | Sumco Techxiv株式会社 | 拡散ウェーハの製造方法 |
| JP2010177541A (ja) * | 2009-01-30 | 2010-08-12 | Pre-Tech At:Kk | Siウェーハの加工ダメージ除去方法 |
| JP5389473B2 (ja) * | 2009-03-03 | 2014-01-15 | 株式会社ディスコ | スピンナ洗浄装置 |
| KR101044009B1 (ko) * | 2009-07-17 | 2011-06-24 | 세메스 주식회사 | 기판 표면을 선택적으로 에칭하기 위한 기판 처리 장치 |
| JP5490659B2 (ja) * | 2009-12-09 | 2014-05-14 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体 |
| JP2012004294A (ja) * | 2010-06-16 | 2012-01-05 | Shibaura Mechatronics Corp | 基板処理装置および基板処理方法 |
| JP5807949B2 (ja) | 2010-11-12 | 2015-11-10 | 国立大学法人東北大学 | 超高速ウェットエッチング装置 |
| KR101308352B1 (ko) | 2011-12-16 | 2013-09-17 | 주식회사 엘지실트론 | 매엽식 웨이퍼 에칭장치 |
| US9079210B2 (en) * | 2013-07-22 | 2015-07-14 | Infineon Technologies Ag | Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer readable medium |
| JP6311236B2 (ja) * | 2013-08-20 | 2018-04-18 | 東京エレクトロン株式会社 | 基板洗浄装置 |
| US9653338B2 (en) * | 2013-12-23 | 2017-05-16 | Kla-Tencor Corporation | System and method for non-contact wafer chucking |
| JP6485904B2 (ja) * | 2015-03-03 | 2019-03-20 | 株式会社Screenホールディングス | 基板処理装置 |
| US10403517B2 (en) | 2015-02-18 | 2019-09-03 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| US10332761B2 (en) | 2015-02-18 | 2019-06-25 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
| JP6504540B2 (ja) * | 2015-02-25 | 2019-04-24 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6509583B2 (ja) * | 2015-02-25 | 2019-05-08 | 株式会社Screenホールディングス | 基板処理装置 |
| KR102356217B1 (ko) * | 2015-05-14 | 2022-01-27 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 베벨 및 이면 보호를 위한 장치 |
| JP2018147908A (ja) * | 2015-07-27 | 2018-09-20 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| TWI629720B (zh) * | 2015-09-30 | 2018-07-11 | 東京威力科創股份有限公司 | 用於濕蝕刻製程之溫度的動態控制之方法及設備 |
| US10269758B2 (en) * | 2015-12-24 | 2019-04-23 | Intel Corporation | Systems and processes for measuring thickness values of semiconductor substrates |
| JP6845696B2 (ja) * | 2016-02-25 | 2021-03-24 | 芝浦メカトロニクス株式会社 | 基板処理装置、基板処理方法及び基板の製造方法 |
| WO2017192994A1 (en) * | 2016-05-06 | 2017-11-09 | Applied Materials, Inc. | Wafer profiling for etching system |
| DE102017212887A1 (de) | 2017-07-26 | 2019-01-31 | Gebr. Schmid Gmbh | Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung |
| KR101985756B1 (ko) * | 2017-08-09 | 2019-06-04 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
| JP2020123676A (ja) * | 2019-01-30 | 2020-08-13 | 信越半導体株式会社 | エッチング方法 |
| KR102826393B1 (ko) * | 2024-07-31 | 2025-06-27 | 에프엔에스테크 주식회사 | 미세회로 패턴 형성용 에칭 장치 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0322428A (ja) * | 1989-06-19 | 1991-01-30 | Nec Kyushu Ltd | 半導体装置の製造装置 |
| US5127984A (en) * | 1991-05-02 | 1992-07-07 | Avantek, Inc. | Rapid wafer thinning process |
| DE59406900D1 (de) * | 1993-02-08 | 1998-10-22 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
| JP3194037B2 (ja) * | 1996-09-24 | 2001-07-30 | 東京エレクトロン株式会社 | 枚葉回転処理方法及びその装置 |
| TW346649B (en) * | 1996-09-24 | 1998-12-01 | Tokyo Electron Co Ltd | Method for wet etching a film |
| JP2983480B2 (ja) | 1996-11-27 | 1999-11-29 | 株式会社東芝 | スピン処理装置 |
| JPH1145872A (ja) * | 1997-07-25 | 1999-02-16 | Shin Etsu Handotai Co Ltd | 半導体基板の平坦化方法および平坦化装置 |
| JPH11135464A (ja) | 1997-10-30 | 1999-05-21 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法 |
| MY120464A (en) * | 1997-12-09 | 2005-10-31 | Shinetsu Handotai Kk | Semiconductor wafer processing method and semiconductor wafers produced by the same |
| JPH11354489A (ja) * | 1998-06-05 | 1999-12-24 | Toshiba Corp | 半導体製造装置及び半導体装置のエッチング方法 |
| KR100452918B1 (ko) * | 2002-04-12 | 2004-10-14 | 한국디엔에스 주식회사 | 두께측정시스템이 구비된 회전식각장치 |
| JP2004140196A (ja) | 2002-10-17 | 2004-05-13 | Nec Electronics Corp | 半導体装置の製造方法および基板洗浄装置 |
| KR100577911B1 (ko) * | 2004-06-07 | 2006-05-10 | 동부일렉트로닉스 주식회사 | 현상액 분사 장치 |
| JP5134774B2 (ja) * | 2006-01-16 | 2013-01-30 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2006
- 2006-01-31 JP JP2006021899A patent/JP4835175B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-23 KR KR1020070007123A patent/KR100948286B1/ko not_active Expired - Fee Related
- 2007-01-31 US US11/669,431 patent/US7906438B2/en not_active Expired - Fee Related
-
2009
- 2009-01-12 KR KR1020090002214A patent/KR20090012364A/ko not_active Withdrawn
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