JP2007194172A - 光源モジュール - Google Patents
光源モジュール Download PDFInfo
- Publication number
- JP2007194172A JP2007194172A JP2006013696A JP2006013696A JP2007194172A JP 2007194172 A JP2007194172 A JP 2007194172A JP 2006013696 A JP2006013696 A JP 2006013696A JP 2006013696 A JP2006013696 A JP 2006013696A JP 2007194172 A JP2007194172 A JP 2007194172A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- light source
- source module
- power supply
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】 吸熱面13aを有する放熱体9に取り付けられ車輌用灯具24に用いられる光源モジュール1において、所定の導電パターン5a、5a、7a、7aが形成された回路基板2と、該回路基板上に実装された半導体発光素子3と、該半導体発光素子への給電用の電源コード23、23が接続されると共に回路基板の導電パターンに固定される少なくとも一対の給電端子8、8とを設け、回路基板の下面の全面を絶縁し該全面を放熱体の吸熱面に面接触させ、給電端子を回路基板から側方へ突出させた。
【選択図】図1
Description
Claims (6)
- 吸熱面を有する放熱体に取り付けられ車輌用灯具に用いられる光源モジュールであって、
所定の導電パターンが形成された回路基板と、
該回路基板上に実装された半導体発光素子と、
該半導体発光素子への給電用の電源コードが接続されると共に回路基板の上記導電パターンに固定される少なくとも一対の給電端子とを備え、
回路基板の下面の全面が絶縁され該全面が放熱体の吸熱面に面接触され、
上記給電端子が回路基板から側方へ突出された
ことを特徴とする光源モジュール。 - 上記回路基板を多層基板として形成し、
回路基板の上面を給電端子の上面より上方に位置させるようにし、
金属製のクリップによって回路基板を吸熱面に押し付けるようにした
ことを特徴とする請求項1に記載の光源モジュール。 - 上記回路基板を矩形状に形成し、
上記給電端子を回路基板の一つの側縁から側方へ突出させるようにした
ことを特徴とする請求項1又は請求項2に記載の光源モジュール。 - 回路基板の導電パターンを厚みが30μm以上に形成し、
導電パターンに対する給電端子の固定を溶接により行うようにした
ことを特徴とする請求項1、請求項2又は請求項3に記載の光源モジュール。 - 上記放熱体に対する取付を係合突部が設けられた弾性を有する金属製のクリップによって行い、
上記回路基板にクリップの係合突部が係合される係合凹部を形成した
ことを特徴とする請求項1、請求項2、請求項3又は請求項4に記載の光源モジュール。 - 少なくとも一つの係合凹部を給電端子間に形成した
ことを特徴とする請求項5に記載の光源モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006013696A JP4662361B2 (ja) | 2006-01-23 | 2006-01-23 | 光源モジュール |
FR0752817A FR2902493B1 (fr) | 2006-01-23 | 2007-01-23 | Module de source de lumiere. |
DE102007003256A DE102007003256A1 (de) | 2006-01-23 | 2007-01-23 | Lichtquellenmodul |
US11/656,525 US7535727B2 (en) | 2006-01-23 | 2007-01-23 | Light source module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006013696A JP4662361B2 (ja) | 2006-01-23 | 2006-01-23 | 光源モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007194172A true JP2007194172A (ja) | 2007-08-02 |
JP4662361B2 JP4662361B2 (ja) | 2011-03-30 |
Family
ID=38268365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006013696A Expired - Fee Related JP4662361B2 (ja) | 2006-01-23 | 2006-01-23 | 光源モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US7535727B2 (ja) |
JP (1) | JP4662361B2 (ja) |
DE (1) | DE102007003256A1 (ja) |
FR (1) | FR2902493B1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171234A (ja) * | 2009-01-23 | 2010-08-05 | Stanley Electric Co Ltd | 光半導体装置モジュール |
WO2011090196A1 (ja) * | 2010-01-25 | 2011-07-28 | 矢崎総業株式会社 | Ledランプユニット |
JP2012119260A (ja) * | 2010-12-03 | 2012-06-21 | Stanley Electric Co Ltd | 車両用灯具のレンズホルダ取付構造 |
US8212277B2 (en) | 2008-07-29 | 2012-07-03 | Stanley Electric Co., Ltd. | Optical semiconductor device module with power supply through uneven contacts |
WO2012165125A1 (ja) * | 2011-06-03 | 2012-12-06 | シャープ株式会社 | Ledランプおよびそれを備えた加熱調理器 |
JP2012251738A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
JP2012253232A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4662361B2 (ja) * | 2006-01-23 | 2011-03-30 | 株式会社小糸製作所 | 光源モジュール |
DE102008005823B4 (de) * | 2008-01-24 | 2013-12-12 | Bjb Gmbh & Co. Kg | Anschlusselement zur elektrischen Anbindung einer LED |
JP5479751B2 (ja) * | 2009-02-16 | 2014-04-23 | 株式会社小糸製作所 | 光源モジュール及び車輌用灯具 |
US20100314983A1 (en) * | 2009-06-11 | 2010-12-16 | Shih-Ming Chen | Light emitting diode lamp with enhanced heat-conducting performance |
FR2950673B1 (fr) * | 2009-09-30 | 2011-12-09 | Valeo Vision | Support pour source lumineuse de module d'eclairage |
CN102537686B (zh) * | 2010-12-13 | 2015-03-25 | 海洋王照明科技股份有限公司 | 一种led灯具 |
CN102537687B (zh) * | 2010-12-13 | 2015-03-25 | 海洋王照明科技股份有限公司 | Led灯具 |
US8840291B2 (en) * | 2011-10-26 | 2014-09-23 | Federal-Mogul Ignition Company | LED lamp assembly with heat sink |
JP5939418B2 (ja) * | 2012-01-24 | 2016-06-22 | スタンレー電気株式会社 | 車両用灯具ユニット |
US9052095B2 (en) * | 2012-10-01 | 2015-06-09 | Valeo North America, Inc. | Light guide fixture system |
DE102012219007B4 (de) | 2012-10-18 | 2018-06-07 | Automotive Lighting Reutlingen Gmbh | Beleuchtungseinrichtung für ein Kraftfahrzeug |
AT513915B1 (de) | 2013-02-14 | 2015-11-15 | Zizala Lichtsysteme Gmbh | Lichtmodul sowie Beleuchtungsvorrichtung mit Lichtmodul für einen Fahrzeugscheinwerfer |
US9791121B2 (en) * | 2013-09-10 | 2017-10-17 | Sl Corporation | Vehicle lamp |
CN105570819A (zh) * | 2014-10-15 | 2016-05-11 | 富泰华工业(深圳)有限公司 | 背光源 |
CN106338043B (zh) * | 2015-07-06 | 2020-11-03 | 松下知识产权经营株式会社 | 光源单元、照明装置和车辆 |
TWM526777U (zh) * | 2015-08-21 | 2016-08-01 | 高準精密工業股份有限公司 | 具有卡扣部件之結構光模組 |
US10914962B2 (en) * | 2015-08-21 | 2021-02-09 | Everready Precision Ind. Corp | Structured light module with fastening element |
DE102019104792A1 (de) * | 2018-03-01 | 2019-09-05 | Nichia Corporation | Lichtemittierendes modul |
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-
2006
- 2006-01-23 JP JP2006013696A patent/JP4662361B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-23 DE DE102007003256A patent/DE102007003256A1/de not_active Withdrawn
- 2007-01-23 FR FR0752817A patent/FR2902493B1/fr not_active Expired - Fee Related
- 2007-01-23 US US11/656,525 patent/US7535727B2/en not_active Expired - Fee Related
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8212277B2 (en) | 2008-07-29 | 2012-07-03 | Stanley Electric Co., Ltd. | Optical semiconductor device module with power supply through uneven contacts |
JP2010171234A (ja) * | 2009-01-23 | 2010-08-05 | Stanley Electric Co Ltd | 光半導体装置モジュール |
WO2011090196A1 (ja) * | 2010-01-25 | 2011-07-28 | 矢崎総業株式会社 | Ledランプユニット |
JP2011148461A (ja) * | 2010-01-25 | 2011-08-04 | Yazaki Corp | Ledランプユニット |
US8876336B2 (en) | 2010-01-25 | 2014-11-04 | Yazaki Corporation | LED lamp unit |
JP2012119260A (ja) * | 2010-12-03 | 2012-06-21 | Stanley Electric Co Ltd | 車両用灯具のレンズホルダ取付構造 |
WO2012165125A1 (ja) * | 2011-06-03 | 2012-12-06 | シャープ株式会社 | Ledランプおよびそれを備えた加熱調理器 |
JP2012251738A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
JP2012253232A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
Also Published As
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FR2902493B1 (fr) | 2016-02-05 |
DE102007003256A1 (de) | 2007-08-02 |
FR2902493A1 (fr) | 2007-12-21 |
US7535727B2 (en) | 2009-05-19 |
JP4662361B2 (ja) | 2011-03-30 |
US20070171662A1 (en) | 2007-07-26 |
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