FR2902493B1 - Module de source de lumiere. - Google Patents
Module de source de lumiere.Info
- Publication number
- FR2902493B1 FR2902493B1 FR0752817A FR0752817A FR2902493B1 FR 2902493 B1 FR2902493 B1 FR 2902493B1 FR 0752817 A FR0752817 A FR 0752817A FR 0752817 A FR0752817 A FR 0752817A FR 2902493 B1 FR2902493 B1 FR 2902493B1
- Authority
- FR
- France
- Prior art keywords
- light source
- source module
- module
- light
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006013696A JP4662361B2 (ja) | 2006-01-23 | 2006-01-23 | 光源モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2902493A1 FR2902493A1 (fr) | 2007-12-21 |
FR2902493B1 true FR2902493B1 (fr) | 2016-02-05 |
Family
ID=38268365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0752817A Expired - Fee Related FR2902493B1 (fr) | 2006-01-23 | 2007-01-23 | Module de source de lumiere. |
Country Status (4)
Country | Link |
---|---|
US (1) | US7535727B2 (fr) |
JP (1) | JP4662361B2 (fr) |
DE (1) | DE102007003256A1 (fr) |
FR (1) | FR2902493B1 (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4662361B2 (ja) * | 2006-01-23 | 2011-03-30 | 株式会社小糸製作所 | 光源モジュール |
DE102008005823B4 (de) * | 2008-01-24 | 2013-12-12 | Bjb Gmbh & Co. Kg | Anschlusselement zur elektrischen Anbindung einer LED |
US8212277B2 (en) | 2008-07-29 | 2012-07-03 | Stanley Electric Co., Ltd. | Optical semiconductor device module with power supply through uneven contacts |
JP5276455B2 (ja) * | 2009-01-23 | 2013-08-28 | スタンレー電気株式会社 | 光半導体装置モジュール |
JP5479751B2 (ja) * | 2009-02-16 | 2014-04-23 | 株式会社小糸製作所 | 光源モジュール及び車輌用灯具 |
US20100314983A1 (en) * | 2009-06-11 | 2010-12-16 | Shih-Ming Chen | Light emitting diode lamp with enhanced heat-conducting performance |
FR2950673B1 (fr) * | 2009-09-30 | 2011-12-09 | Valeo Vision | Support pour source lumineuse de module d'eclairage |
JP5351065B2 (ja) * | 2010-01-25 | 2013-11-27 | 矢崎総業株式会社 | Ledランプユニット |
JP5680947B2 (ja) * | 2010-12-03 | 2015-03-04 | スタンレー電気株式会社 | 車両用灯具のレンズホルダ取付構造 |
CN102537687B (zh) * | 2010-12-13 | 2015-03-25 | 海洋王照明科技股份有限公司 | Led灯具 |
CN102537686B (zh) * | 2010-12-13 | 2015-03-25 | 海洋王照明科技股份有限公司 | 一种led灯具 |
JP2012253232A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
WO2012165125A1 (fr) * | 2011-06-03 | 2012-12-06 | シャープ株式会社 | Lampe à diodes électroluminescentes (led) et cuiseur la comportant |
JP2012251738A (ja) * | 2011-06-03 | 2012-12-20 | Sharp Corp | 加熱調理器 |
US8840291B2 (en) * | 2011-10-26 | 2014-09-23 | Federal-Mogul Ignition Company | LED lamp assembly with heat sink |
JP5939418B2 (ja) * | 2012-01-24 | 2016-06-22 | スタンレー電気株式会社 | 車両用灯具ユニット |
US9052095B2 (en) * | 2012-10-01 | 2015-06-09 | Valeo North America, Inc. | Light guide fixture system |
DE102012219007B4 (de) | 2012-10-18 | 2018-06-07 | Automotive Lighting Reutlingen Gmbh | Beleuchtungseinrichtung für ein Kraftfahrzeug |
AT513915B1 (de) | 2013-02-14 | 2015-11-15 | Zizala Lichtsysteme Gmbh | Lichtmodul sowie Beleuchtungsvorrichtung mit Lichtmodul für einen Fahrzeugscheinwerfer |
US20150070921A1 (en) * | 2013-09-10 | 2015-03-12 | Sl Corporation | Vehicle lamp |
CN105570819A (zh) * | 2014-10-15 | 2016-05-11 | 富泰华工业(深圳)有限公司 | 背光源 |
US10041645B2 (en) * | 2015-07-06 | 2018-08-07 | Panasonic Intellectual Property Management Co., Ltd. | Light source unit, lighting device, and vehicle |
TWM526777U (zh) * | 2015-08-21 | 2016-08-01 | 高準精密工業股份有限公司 | 具有卡扣部件之結構光模組 |
US10914962B2 (en) * | 2015-08-21 | 2021-02-09 | Everready Precision Ind. Corp | Structured light module with fastening element |
DE102019104792A1 (de) * | 2018-03-01 | 2019-09-05 | Nichia Corporation | Lichtemittierendes modul |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5606358A (en) * | 1991-12-23 | 1997-02-25 | Eastman Kodak Company | Light-emitting diode printhead |
JP2567710Y2 (ja) * | 1992-05-21 | 1998-04-02 | スタンレー電気株式会社 | ハイマウントストップランプの給電構造 |
US5269694A (en) * | 1992-10-23 | 1993-12-14 | Molex Incorporated | Surface mount electrical connector |
EP0833103A3 (fr) * | 1996-09-30 | 1999-12-01 | Toshiba Lighting & Technology Corporation | Lampe et dispositif d'affichage le comprenant |
US6282352B1 (en) * | 1997-04-08 | 2001-08-28 | Hitachi, Ltd. | Optical module, method for manufacturing optical module and optical communication apparatus |
US6011233A (en) * | 1997-07-23 | 2000-01-04 | Narae Corporation | Welding method of a connection terminal piece for a deflection yoke coil and the structure thereof |
US5917701A (en) * | 1997-11-05 | 1999-06-29 | Artesyn Technologies, Inc. | Heat sink hold-down clip |
TW451535B (en) * | 1998-09-04 | 2001-08-21 | Sony Corp | Semiconductor device and package, and fabrication method thereof |
US6420937B1 (en) * | 2000-08-29 | 2002-07-16 | Matsushita Electric Industrial Co., Ltd. | Voltage controlled oscillator with power amplifier |
US6871981B2 (en) * | 2001-09-13 | 2005-03-29 | Heads Up Technologies, Inc. | LED lighting device and system |
TW527068U (en) * | 2002-03-20 | 2003-04-01 | Hon Hai Prec Ind Co Ltd | Clip for heat dissipation device |
US7380961B2 (en) * | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
TW584218U (en) * | 2002-06-06 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Mounting device for heat sink |
US6867978B2 (en) * | 2002-10-08 | 2005-03-15 | Intel Corporation | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making |
JP2004304111A (ja) * | 2003-04-01 | 2004-10-28 | Sharp Corp | 多波長レーザ装置 |
WO2004114736A2 (fr) * | 2003-06-20 | 2004-12-29 | Yazaki Corporation | Dispositif d'eclairage a diodes electroluminescentes |
US7211835B2 (en) * | 2003-07-09 | 2007-05-01 | Nichia Corporation | Light emitting device, method of manufacturing the same and lighting equipment |
JP4274032B2 (ja) * | 2003-07-09 | 2009-06-03 | 日亜化学工業株式会社 | 照明装置 |
US20050039551A1 (en) * | 2003-07-24 | 2005-02-24 | Eric Shute | Tamper evident connector for an engine radiator |
JP2005209537A (ja) * | 2004-01-23 | 2005-08-04 | Koito Mfg Co Ltd | 灯具 |
US7273773B2 (en) * | 2004-01-26 | 2007-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing thereof, and television device |
CN2763972Y (zh) * | 2004-12-11 | 2006-03-08 | 鸿富锦精密工业(深圳)有限公司 | 散热装置组合 |
JP2006245336A (ja) * | 2005-03-03 | 2006-09-14 | Koito Mfg Co Ltd | 発光装置 |
JP4595665B2 (ja) * | 2005-05-13 | 2010-12-08 | 富士電機システムズ株式会社 | 配線基板の製造方法 |
US20060288968A1 (en) * | 2005-06-27 | 2006-12-28 | Control Devices, Inc. | Tamper evident connector for an engine radiator |
JP2007141549A (ja) * | 2005-11-16 | 2007-06-07 | Koito Mfg Co Ltd | 車輌用灯具 |
JP4662361B2 (ja) * | 2006-01-23 | 2011-03-30 | 株式会社小糸製作所 | 光源モジュール |
JP4535453B2 (ja) * | 2006-03-06 | 2010-09-01 | 株式会社小糸製作所 | 光源モジュール及び車輌用灯具 |
-
2006
- 2006-01-23 JP JP2006013696A patent/JP4662361B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-23 US US11/656,525 patent/US7535727B2/en not_active Expired - Fee Related
- 2007-01-23 DE DE102007003256A patent/DE102007003256A1/de not_active Withdrawn
- 2007-01-23 FR FR0752817A patent/FR2902493B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070171662A1 (en) | 2007-07-26 |
JP2007194172A (ja) | 2007-08-02 |
FR2902493A1 (fr) | 2007-12-21 |
US7535727B2 (en) | 2009-05-19 |
DE102007003256A1 (de) | 2007-08-02 |
JP4662361B2 (ja) | 2011-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
ST | Notification of lapse |
Effective date: 20200906 |