JP2007189231A - コア電源および接地の分配を容易にするための第2基板を有する集積回路 - Google Patents
コア電源および接地の分配を容易にするための第2基板を有する集積回路 Download PDFInfo
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- JP2007189231A JP2007189231A JP2007004020A JP2007004020A JP2007189231A JP 2007189231 A JP2007189231 A JP 2007189231A JP 2007004020 A JP2007004020 A JP 2007004020A JP 2007004020 A JP2007004020 A JP 2007004020A JP 2007189231 A JP2007189231 A JP 2007189231A
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Abstract
【解決手段】集積回路100は、第1基板104、第1基板104に取り付けられた集積回路ダイ102、および集積回路ダイ102の少なくとも一部分の上に重なる第2基板106を備える。第2基板106は、第1基板104の導体にワイヤ・ボンドされ、集積回路ダイ102の導体に電気的に接続された、少なくとも1つの導体を備える。例示的実施形態では、第2基板106の導体は、集積回路ダイのためのコア電源および接地接続を提供するために使用される。
【選択図】図1
Description
また、単一のパッケージ集積回路内に複数の集積回路ダイを有することも可能であり、そのようなダイはそれぞれ本明細書中で説明されたようにその少なくとも一部分で上に重なる少なくとも1つの追加基板を有する。
Claims (10)
- 第1基板と、
前記第1基板に取り付けられた集積回路ダイと、
前記集積回路ダイの少なくとも一部分の上に重なる第2基板と
を備える集積回路であって、
前記第2基板は、前記第1基板の導体にワイヤ・ボンドされ、前記集積回路ダイの導体に電気的に接続された少なくとも1つの導体を備える、集積回路。 - 前記第1基板はボール・グリッド・アレイ基板を備える、請求項1に記載の集積回路。
- 前記第2基板はフリップチップ基板を備える、請求項1に記載の集積回路。
- 前記第2基板は、前記第2基板の上面上の複数の導体と、前記第2基板の下面上の複数の導体と、前記第2基板をその上面からその下面に貫通する複数のビアとを備え、前記各ビアは、前記第2基板の1つまたは複数の前記上面導体と前記第2基板の1つまたは複数の前記下面導体の間の電気的接続を提供する、請求項1に記載の集積回路。
- 前記第2基板の前記下面導体のうちの複数のものは、前記集積回路ダイのそれぞれの導体に電気的に接続される、請求項4に記載の集積回路。
- 前記第2基板の前記下面導体の前記複数のものは、それぞれのはんだバンプを介して前記集積回路ダイの前記それぞれの導体に電気的に接続される、請求項5に記載の集積回路。
- 前記集積回路ダイは、上面の周辺近くに配列された複数のボンド・パッドおよび前記上面の中央領域に配列された複数の導体を有する上面を有し、前記第2基板は、前記集積回路ダイの前記上面の前記中央領域の上に重なり、前記中央領域の前記導体に電気的に接触している導体を有する、請求項1に記載の集積回路。
- 第1および第2基板の間に結合された集積回路ダイを備える集積回路であって、
前記第1基板は、前記集積回路ダイを支持し前記集積回路ダイおよび前記第2基板にワイヤ・ボンドされた、ボール・グリッド・アレイ基板を備え、
前記第2基板は、前記集積回路ダイの上に重なりそれに電気的に接触しているフリップチップ基板を備える、
集積回路。 - 集積回路を形成する方法であって、
集積回路ダイを第1基板に取り付ける工程と、
前記集積回路ダイの少なくとも一部分の上に重なる第2基板を提供する工程と、
前記第2基板の少なくとも1つの導体を前記第1基板の導体にワイヤ・ボンドする工程であって、前記第2基板の前記導体はまた前記集積回路ダイの導体にも電気的に接続される工程とを含む方法。 - 前記第2基板は、前記集積回路ダイが前記第1基板に取り付けられる前に前記ダイに接続される、請求項9に記載の方法。
Applications Claiming Priority (2)
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US11/332,040 US20070164446A1 (en) | 2006-01-13 | 2006-01-13 | Integrated circuit having second substrate to facilitate core power and ground distribution |
US11/332040 | 2006-01-13 |
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JP2007189231A true JP2007189231A (ja) | 2007-07-26 |
JP5522886B2 JP5522886B2 (ja) | 2014-06-18 |
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JP2007004020A Expired - Fee Related JP5522886B2 (ja) | 2006-01-13 | 2007-01-12 | コア電源および接地の分配を容易にするための第2基板を有する集積回路 |
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US (1) | US20070164446A1 (ja) |
JP (1) | JP5522886B2 (ja) |
KR (1) | KR101355274B1 (ja) |
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TWI363240B (en) | 2008-03-31 | 2012-05-01 | Au Optronics Corp | Active array substrate, electrode substrate, and liquid crystal display panel |
JP2010192680A (ja) * | 2009-02-18 | 2010-09-02 | Elpida Memory Inc | 半導体装置 |
US8405214B2 (en) * | 2011-08-12 | 2013-03-26 | Nanya Technology Corp. | Semiconductor package structure with common gold plated metal conductor on die and substrate |
US11227846B2 (en) | 2019-01-30 | 2022-01-18 | Mediatek Inc. | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure |
WO2020205625A1 (en) * | 2019-03-29 | 2020-10-08 | Robotik Innovations, Inc. | Flex-rigid sensor array structure for robotic systems |
CN115831935B (zh) * | 2023-02-15 | 2023-05-23 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构和芯片封装方法 |
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2006
- 2006-01-13 US US11/332,040 patent/US20070164446A1/en not_active Abandoned
- 2006-11-29 TW TW095144184A patent/TWI464836B/zh not_active IP Right Cessation
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2007
- 2007-01-11 KR KR1020070003448A patent/KR101355274B1/ko not_active IP Right Cessation
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US20070164446A1 (en) | 2007-07-19 |
TW200731478A (en) | 2007-08-16 |
KR101355274B1 (ko) | 2014-01-27 |
KR20070076448A (ko) | 2007-07-24 |
JP5522886B2 (ja) | 2014-06-18 |
TWI464836B (zh) | 2014-12-11 |
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