JP2007165844A5 - - Google Patents

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Publication number
JP2007165844A5
JP2007165844A5 JP2006260495A JP2006260495A JP2007165844A5 JP 2007165844 A5 JP2007165844 A5 JP 2007165844A5 JP 2006260495 A JP2006260495 A JP 2006260495A JP 2006260495 A JP2006260495 A JP 2006260495A JP 2007165844 A5 JP2007165844 A5 JP 2007165844A5
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JP
Japan
Prior art keywords
substrate
plate
producing
component
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006260495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007165844A (ja
Filing date
Publication date
Priority claimed from DE102005046031A external-priority patent/DE102005046031B3/de
Application filed filed Critical
Publication of JP2007165844A publication Critical patent/JP2007165844A/ja
Publication of JP2007165844A5 publication Critical patent/JP2007165844A5/ja
Pending legal-status Critical Current

Links

JP2006260495A 2005-09-26 2006-09-26 基板から部品を分離する方法 Pending JP2007165844A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005046031A DE102005046031B3 (de) 2005-09-26 2005-09-26 Verfahren zur Separierung von Teilen aus einem Substrat

Publications (2)

Publication Number Publication Date
JP2007165844A JP2007165844A (ja) 2007-06-28
JP2007165844A5 true JP2007165844A5 (https=) 2009-11-05

Family

ID=37499487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006260495A Pending JP2007165844A (ja) 2005-09-26 2006-09-26 基板から部品を分離する方法

Country Status (8)

Country Link
US (1) US8193073B2 (https=)
EP (1) EP1767502A1 (https=)
JP (1) JP2007165844A (https=)
KR (1) KR20070034974A (https=)
CN (1) CN1974165A (https=)
DE (1) DE102005046031B3 (https=)
SG (1) SG131081A1 (https=)
TW (1) TW200730313A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8399331B2 (en) 2007-10-06 2013-03-19 Solexel Laser processing for high-efficiency thin crystalline silicon solar cell fabrication
KR101054920B1 (ko) * 2009-01-09 2011-08-05 주식회사 디엠에스 임프린트 장치
US8906218B2 (en) 2010-05-05 2014-12-09 Solexel, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate
US9076642B2 (en) 2009-01-15 2015-07-07 Solexel, Inc. High-Throughput batch porous silicon manufacturing equipment design and processing methods
CN102754199A (zh) * 2009-12-15 2012-10-24 速力斯公司 用于薄晶片处理的可移动真空载具
KR101309865B1 (ko) * 2009-12-23 2013-09-16 엘지디스플레이 주식회사 평판 표시 소자의 제조 장치 및 방법
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
CN106952850B (zh) * 2017-04-17 2023-09-08 如皋市大昌电子有限公司 一种芯片批量定位系统
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
KR102380777B1 (ko) * 2020-09-03 2022-03-30 주식회사 시스템알앤디 유리제품 분리장치 및 이를 이용한 분리방법

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
JP3263128B2 (ja) * 1992-06-26 2002-03-04 ローム株式会社 薄板ガラスの加工法
US5618759A (en) 1995-05-31 1997-04-08 Texas Instruments Incorporated Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof
US5803797A (en) 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
WO1999046211A1 (en) 1998-03-11 1999-09-16 Hitachi, Ltd. Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate
JP2000006100A (ja) * 1998-06-24 2000-01-11 Beldex:Kk 板状ワークの破断装置
DE19910559A1 (de) * 1999-03-10 2000-09-14 Espe Dental Ag Subgingivales Pulverstrahlen
JP4421697B2 (ja) * 1999-06-15 2010-02-24 三星ダイヤモンド工業株式会社 ブレイク装置
JP4342039B2 (ja) * 1999-06-15 2009-10-14 三星ダイヤモンド工業株式会社 ガラススクライバー及びスクライブ方法
JP2001024050A (ja) * 1999-07-08 2001-01-26 Disco Abrasive Syst Ltd ワーク保持装置
JP4388640B2 (ja) 1999-09-10 2009-12-24 株式会社ディスコ Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル
JP2001176821A (ja) * 1999-12-16 2001-06-29 Pmt:Kk 半導体製造における切断加工方法
DE10016628A1 (de) * 2000-04-04 2001-10-18 Schott Glas Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen
DE10041519C1 (de) * 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
DE10060696A1 (de) * 2000-12-07 2002-06-27 Wacker Chemie Gmbh Vorrichtung und Verfahren zum ultraschallunterstützten Schleifen einer Werkstückkante
CN1223531C (zh) * 2001-07-25 2005-10-19 弗拉基米尔·斯捷潘诺维奇·孔德拉坚科 脆性的非金属材料的切割方法
JP2003051466A (ja) 2001-08-07 2003-02-21 Sony Corp 半導体ウエーハのダイシング装置およびダイシング方法
US6746022B2 (en) 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece
NL1022463C2 (nl) 2003-01-22 2004-07-26 Fico Bv Drager, houder, lasersnij-inrichting en werkwijze voor het met behulp van laserlicht separeren van halfgeleider producten.
DE10337920B4 (de) * 2003-08-18 2008-08-28 Schott Ag Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes

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