TW200802523A - Substrate chuck cleaning unit, cleaning apparatus and cleaning mehtod thereof - Google Patents

Substrate chuck cleaning unit, cleaning apparatus and cleaning mehtod thereof

Info

Publication number
TW200802523A
TW200802523A TW096119772A TW96119772A TW200802523A TW 200802523 A TW200802523 A TW 200802523A TW 096119772 A TW096119772 A TW 096119772A TW 96119772 A TW96119772 A TW 96119772A TW 200802523 A TW200802523 A TW 200802523A
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate chuck
substrate
mehtod
chuck
Prior art date
Application number
TW096119772A
Other languages
Chinese (zh)
Inventor
Seong Kwon
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200802523A publication Critical patent/TW200802523A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides a substrate chuck cleaning unit, cleaning apparatus and cleaning method thereof for cleaning impurities from the upper surface of a substrate chuck. Such a chuck is used to fasten a substrate for processing such as coating photoresist glue, etc. The invented substrate chuck cleaning unit includes: a body; ejection nozzles formed on the body and for spraying a cleaning agent towards the substrate chuck in order to separating impurities from the substrate chuck; and suction nozzles spaced from the above-mentioned ejection nozzles at a specified pitch for sucking in the impurities separated by the cleaning agent.
TW096119772A 2006-06-02 2007-06-01 Substrate chuck cleaning unit, cleaning apparatus and cleaning mehtod thereof TW200802523A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060049646A KR101206775B1 (en) 2006-06-02 2006-06-02 Apparatus and method for cleaning substrate chuck

Publications (1)

Publication Number Publication Date
TW200802523A true TW200802523A (en) 2008-01-01

Family

ID=38911313

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119772A TW200802523A (en) 2006-06-02 2007-06-01 Substrate chuck cleaning unit, cleaning apparatus and cleaning mehtod thereof

Country Status (3)

Country Link
KR (1) KR101206775B1 (en)
CN (1) CN101081396A (en)
TW (1) TW200802523A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857525B1 (en) * 2007-08-31 2008-09-08 중앙대학교 산학협력단 Suction device of minute particles
CN103681247A (en) * 2013-12-30 2014-03-26 上海集成电路研发中心有限公司 Wafer reaction chamber cleaning device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725615B2 (en) * 1996-06-21 2005-12-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP2001079505A (en) * 2000-07-03 2001-03-27 Yokogawa Electric Corp Suction nozzle device
JP4564742B2 (en) * 2003-12-03 2010-10-20 キヤノン株式会社 Exposure apparatus and device manufacturing method

Also Published As

Publication number Publication date
CN101081396A (en) 2007-12-05
KR101206775B1 (en) 2012-11-30
KR20070115357A (en) 2007-12-06

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