CN101081396A - Substrates fixed disk cleaning unit, cleaning device and cleaning method - Google Patents
Substrates fixed disk cleaning unit, cleaning device and cleaning method Download PDFInfo
- Publication number
- CN101081396A CN101081396A CNA2007101038595A CN200710103859A CN101081396A CN 101081396 A CN101081396 A CN 101081396A CN A2007101038595 A CNA2007101038595 A CN A2007101038595A CN 200710103859 A CN200710103859 A CN 200710103859A CN 101081396 A CN101081396 A CN 101081396A
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- fixed disk
- cleaning
- substrates fixed
- cleaning unit
- hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a baseplate fixed disk cleaning unit, cleaning device and cleaning method for cleaning impurities fixed on the surface of baseplate fixed disk in order to perform a great variety of baseplate handle working such as coating photoresist on the baseplate. The said baseplate fixed disk cleaning unit comprises: main body; spray hole formed on the said main body and spraying cleaning liquor to the said baseplate fixed disk to separate the impurities on the said baseplate fixed disk; suction port away from the said spray hole at resent distance to suck the impurities sepatated by the said cleaning liquor.
Description
Technical field
The present invention relates to a kind of cleaning unit, cleaning device and cleaning method of substrates fixed disk, relate in particular to substrates fixed disk cleaning unit, cleaning device and the cleaning method of the impurity that is used to remove the substrates fixed disk upper surface, this substrates fixed disk is used for fixing substrate to carry out on substrate multiple processing substrate operation such as coating photoresist.
Background technology
Usually, the method for coating photoresist comprises on substrate: photoresist is carried on the roller coating method of rolling described roller in a certain direction after the outside of cylindrical roller on substrate and applying photoresist; Placing substrate on the plectane supporter and after central authorities' drippage photoresist of described substrate, being rotated, on substrate, apply the spin coating method of photoresist thus according to centrifugal force; Nozzle by the slit form is sprayed onto substrate with photoresist, simultaneously inswept in a certain direction substrate and the slit coating method that applies.
In above-mentioned coating method,, use spin coating method when therefore forming high-accuracy pattern because the roller coating method is difficult to the uniformity and the film thickness of accurate control photoresist film.But spin coating method uses when being adapted on the less substrate of size such as chip the coating photoactive substance, and is not suitable for display panels with size and all big panel display apparatus substrates of weight such as glass substrates.This is heavyly more just to be difficult to the high speed rotary plate more because substrate is big more, and carry out high speed when rotating the easy more damage of substrate and energy consumption also big more.Based on these reasons, mainly use the slit coating method when on large-size glass substrate, applying photoresist.
Fig. 1 is the structural representation of general slit coating machine, and Fig. 2 is the deimpurity state profile of substrates fixed disk supernatant from slit coating machine shown in Figure 1.
As shown in Figure 1, general slit coating machine 100 comprises: the substrates fixed disk 102 that is used for fixing mounting substrate GS; Photoresist PR is coated in gap nozzle 110 on the substrate GS; Support a pair of nozzle transfer unit 120 that described gap nozzle 110 both sides are longitudinally advanced gap nozzle 110; Be attached to the photoresist supply department 115 of described nozzle transfer unit one side; Transfer the first photoresist supply pipes 116 of photoresist PR to described gap nozzle 110 from described photoresist supply department 115; The second photoresist supply pipe 117 to the described photoresist 115 supply photoresist PR of supply department.
Described gap nozzle 110 is strip nozzles, and the lower end central authorities of the gap nozzle relative with substrate GS form the ejiction opening of fine shape of slit, by described ejiction opening a certain amount of photoresist PR are sprayed onto on the substrate.Described photoresist supply department 115 applies predetermined pressure and sprays the unit of photoresist PR to described gap nozzle 110 supply photoresist PR and to the photoresist PR that is supplied.Usually, described photoresist supply department 115 comprises pump, thereby applies certain pressure to gap nozzle 110, and the photoresist PR that will be stored in the gap nozzle according to this pressure is sprayed onto on the substrate.
The described gap nozzle 110 of aforesaid slit coating machine is spraying photoresist PR to substrate GS when substrate one end longitudinally advances with certain speed, thereby evenly applies photoresist PR on substrate GS.
At this moment, described substrates fixed disk 102 utilizes vacuum that described substrate GS is fixed loading.For this reason, the surface of described substrates fixed disk 102 forms the microscopic carvings pattern 103 that is made of a plurality of grooves.Described microscopic carvings pattern 103 laterally reaches the straight-line groove that vertically forms by a plurality of edges and roughly is lattice shape (how much exaggerating demonstration for the shape of clearly representing described microscopic carvings pattern 103 in the accompanying drawing).The described intersection point that laterally reaches vertical straight-line groove intersection forms vertical vacuum hole 103h respectively.The lower end of described vertical vacuum hole 103h is connected in vavuum pump (not shown), thereby forms vacuum and fixing base in the straight-line groove of described microscopic carvings pattern 103.
So, will load and unload carried base board continually, and form vacuum in the groove of described microscopic carvings pattern owing to be used for fixing on the substrates fixed disk 102 of mounting substrate GS, so residual impurity easily in the groove of the upper surface of substrates fixed disk 102 and microscopic carvings pattern 103.These impurity need regularly be cleared up.
For this reason, utilize substrates fixed disk to clean by the staff in the past and use rag (wiper) 30 with direct cleaning base plate fixed disk 102 upper surfaces of manual mode, therefore very loaded down with trivial details.Especially, along with the maximization that also becomes of the size of the more and more large-scale change substrates fixed disk of substrate, therefore carrying out described washing and cleaning operation by manual method becomes inefficent.
Particularly, when in the groove of described microscopic carvings pattern 103 impurity being arranged, utilize described cleaning to remove and have limitation with rag 30.Especially, the top crest line part of described microscopic carvings pattern 103, be the upper surface of substrates fixed disk 102 and the crossing part angulation of groove of microscopic carvings pattern 103, if therefore this part and described cleaning rub with rag 30, then may produce more impurity because of described cleaning is worn with rag 30.
Summary of the invention
The present invention proposes in order to solve aforesaid problem, its purpose is to provide a kind of substrates fixed disk cleaning unit, cleaning device and cleaning method, thereby omit manual working during the impurity on removing substrates fixed disk and carry out accurate washing and cleaning operation, and on the large substrate fixed disk, also can carry out effective washing and cleaning operation.
To achieve these goals, the substrates fixed disk cleaning unit that embodiment of the present invention provided comprises: main body; Be formed on described main body and to the spray-hole of described substrates fixed disk jet cleaner, to be used to separate the impurity on the described substrates fixed disk; Separate the inlet hole of preset distance from described spray-hole, to be used to suck the impurity that separates by described cleaning agent.
And described inlet hole preferably forms a plurality of around described spray-hole.
And described cleaning agent can comprise nonreactive gas or sublimability solids.At this moment, described sublimability solids preferably comprise dry ice.
And the formation spray-hole of described main body and the face of inlet hole preferably comprise the inclined plane that is directed downwards inclination from described spray-hole towards inlet hole.
The cleaning device of substrates fixed disk provided by the present invention comprises the cleaning unit that above-mentioned embodiment provides, the support component that described cleaning unit is set and moves along a certain direction with respect to substrates fixed disk.
And described cleaning unit preferably is arranged as a plurality of and is listed as the above zigzag fashion that forms with two.
And described cleaning unit preferably is located on the support component and can moves in the vertical direction.
And described cleaning unit preferably is located on the described support component, and can be along moving with the perpendicular direction of described a certain direction.
The substrates fixed disk cleaning method that further embodiment of this invention provided comprises step: for removing impurity on the described substrates fixed disk to described substrates fixed disk jet cleaner; The impurity that suction is removed by described cleaning agent.
And, preferably also comprise by being formed on the step of the vacuum hole gas jet on the described substrates fixed disk.
Description of drawings
Fig. 1 is the structural representation of general slit coating machine;
Fig. 2 is according to the state profile of prior art from the substrates fixed disk removal of contamination of the slit coating machine shown in Fig. 1;
Fig. 3 and Fig. 4 are schematic diagram and the longitudinal sectional drawing according to substrates fixed disk cleaning unit provided by the present invention;
Fig. 5 is the state profile of the substrates fixed disk cleaning unit removal of contamination provided by the present invention shown in Fig. 3 and Fig. 4;
Fig. 6 is the schematic diagram according to substrates fixed disk cleaning device provided by the present invention;
Fig. 7 is the schematic diagram that is provided with the slit coating machine of substrates fixed disk cleaning device provided by the present invention;
Fig. 8 is the Pareto diagram that is located at the substrates fixed disk cleaning unit of substrates fixed disk cleaning device provided by the present invention;
Fig. 9 is the variation profile of substrates fixed disk cleaning unit provided by the present invention.
Main symbol description: 30 is rag, and 100 is the slit coating machine, and 102 is substrates fixed disk, 103 are the microscopic carvings pattern, and 103h is a vacuum hole, and 104 is impurity, 110 is gap nozzle, and 120 is the nozzle transfer unit, and 200 is cleaning unit, 220 is main body, and 222 is spray-hole, and 222c is a connecting portion, 223 is playpipe, 223c, 225c are nut, and 224 is inlet hole, and 224c is a connecting portion, 225 is suction line, 240 is installation portion, and 242 is the main body connecting portion, and 244 for being provided with connecting portion, 260 for being provided with nut, 300 is support component, and 310 is supported hole, and GS is a substrate.
The specific embodiment
Below, the preferred embodiment of the substrates fixed disk cleaning unit that present invention will be described in detail with reference to the accompanying is provided, cleaning device and cleaning method.Substrates fixed disk cleaning unit provided by the present invention and cleaning device go for adopting the fixedly substrate board treatment of any kind of of the substrates fixed disk of mounting substrate.Just, will describe as cleaning object with the substrates fixed disk that in the background technology part, carried out the general slit coating machine of explanation of direct use substrates fixed disk cleaning unit provided by the present invention and cleaning device below.Therefore, omit explanation to the slit coating machine at this, to this slit coating machine referring to Fig. 1 and Fig. 2.
Fig. 3 and Fig. 4 are schematic diagram and the longitudinal sectional drawing according to substrates fixed disk cleaning unit provided by the present invention, and Fig. 5 is the state profile of the substrates fixed disk cleaning unit removal of contamination provided by the present invention shown in Fig. 3 and Fig. 4.
As shown in the figure, substrates fixed disk cleaning unit 200 provided by the present invention comprise cylindrical-shaped main body 220, connect the spray-hole 222 at described main body 220 centers, the playpipe 223 that is connected with described spray-hole 222, the installation portion 240 that separate preset distance with described spray-hole 222 and center on a plurality of inlet holes 224 of spray-hole 222 settings, the suction line 225 that links to each other with described inlet hole 224, be used for described main body 220 is installed to external device (ED).
As shown in Figure 4, the roughly cylindrical shape of described main body 220, the heart connects along its length and forms spray-hole 222 therein, and the upper end of described spray-hole 222 is formed for connecting the connecting portion 222c of playpipe 223.Described connecting portion 222c is the outstanding tube with predetermined thickness that is formed on spray-hole 222 upper ends, and forms screw thread at its outer peripheral face.One end of described playpipe 22 3 forms flange, described flange face is close to the upper surface of described connecting portion 222c, and the nut 223c that runs through described playpipe 223 carries out screw thread with the outer peripheral face of described connecting portion 222c and combines, and described thus playpipe 223 realizes that with connecting portion 222c air-tightness is connected.The method that connects playpipe 223 at described spray-hole 222 can also adopt various forms except said structure, because this is the known technology in field under the present invention, therefore omit illustrating other modes.
Around the described spray-hole 222, the edge of promptly described main body 220 along the circumferential direction forms a plurality of inlet holes 224, and described inlet hole 224 can connect suction line 225 in the manner described above respectively.But as shown in the figure, in order to simplify external structure, an inlet hole 224 in the described inlet hole 224 runs through described main body 220, in addition other inlet hole forms desired depth and is closed on it, and form connecting the annular interface channel 224d of described inlet hole 224 mid portions and residue inlet hole 224 upper ends, a described then inlet hole 224 (according to the mode identical with above-mentioned spray-hole 222) is connected with an end of described suction line 225 in conjunction with nut 225c at the connecting portion 224c of end formed thereon.
At this moment, though main body described in the accompanying drawing 220 is illustrated as parts, but in order in main body, to form annular interface channel 224d, preferably so that to be benchmark be divided into top and bottom with described main body 220 the horizontal center of annular interface channel 224d and after making separately, top and sub-body are carried out combination and constituted a main body 220.
So, the other end that one end is connected in the playpipe 223 of described spray-hole 222 upper ends is connected in the cleaning agent source of supply (not shown) of supplying the substrates fixed disk cleaning agent, and the other end that an end is connected in the suction line 225 of described inlet hole 224 upper ends is connected in vavuum pump (not shown).Therefore, by the lower end jet cleaner of described spray-hole 222, the lower end by inlet hole 224 sucks the impurity on described cleaning agent and the described substrates fixed disk 102.
At this moment, can not remain in the material on the substrates fixed disk 102 after described substrates fixed disk cleaning agent is preferably and is ejected on the substrates fixed disk 102.This described substrates fixed disk cleaning agent preferably uses nonreactive gas such as nitrogen, argon gas, air, perhaps uses the sublimability solids that comprise dry ice.Especially, described dry ice is the typical sublimability solid that is used to clean semiconductor substrate surface, and this material is directly distilled in removal of contamination, therefore has to prevent that remnant from taking place and the characteristic of the impaired equivalent risk of substrates fixed disk.
Described installation portion 240 prolongs by the main body connecting portion 242 of the hollow circle tube that is incorporated into main body 220 upside outer peripheral faces with from the center, upper end of described main body connecting portion 242 and the connecting portion 244 that is provided with of the hollow pipe shape that forms constitutes.Though connecting portion 242 of main body described in the accompanying drawing and main body 220 are not to be defined in this by the inner peripheral surface and the outer peripheral face of screw thread in conjunction with correspondence, can carry out combination in various manners.
In addition, described playpipe 223 and suction line 225 are disposed in the described installation portion 240, and the connecting portion 244 that is provided with that runs through described installation portion 240 prolongs to the outside.The described upper end outer peripheral face that connecting portion 244 is set forms screw thread, and carry out screw thread and combine, thereby make the support component 300 of described substrates fixed disk cleaning unit 200 by the substrates fixed disk cleaning device that will be described below supported and move up and down with as shown in Figure 3 the nut 260 that is provided with.
The action of described substrates fixed disk cleaning unit 200 is described below with reference to Fig. 5 of the described substrates fixed disk 102 cleaning units 200 cleaning base plate fixed disk states of expression.
As shown in the figure, at first arrange described substrates fixed disk cleaning unit 200, make that the lower end of described substrates fixed disk cleaning unit 200 is relative with substrates fixed disk 102 tops of need cleaning and be provided with, and make and separate certain distance between the two.Then, the substrates fixed disk cleaning agent from cleaning agent source of supply (not shown) supply is ejected on the substrates fixed disk 102 through playpipe 223 and by the spray-hole 222 that is formed on main body 220 centers.So the substrates fixed disk cleaning agent that sprays from the substrate separating base plate fixed disk 102 impurity 104 and it is swum.So the separated and impurity 104 that swims is inhaled into by the inlet hole 224 that is formed on around the described spray-hole 222 from the substrates fixed disk 102.That is, described inlet hole 224 connects vavuum pumps (not shown) by suction line 225, thereby forms vacuum and suck impurity 104 and remove in inlet hole 224.
At this moment, may take place to flow into situation the vacuum hole 103h that is formed on the described substrates fixed disk 102 from the substrates fixed disk cleaning agent that substrates fixed disk 102 separates and the impurity 104 that swims sprays because of described spray-hole 222.Especially, when impurity 104 was positioned on the described vacuum hole 103h, the problem that vacuum hole 103h is blocked by impurity 104 took place because of the substrates fixed disk cleaning agent that described spray-hole 222 sprays flow into vacuum hole 103h inside in described impurity 104 thus.Therefore, when the impurity 104 that operation cleaning unit 200 provided by the present invention is removed on the substrates fixed disk 102, preferably spray nonreactive gas such as nitrogen, argon gas, air by described vacuum hole 103h.For this reason, in the technology of cleaning base plate fixed disk 102, vertical vacuum hole 103h need cut off and being connected of vavuum pump (not shown), and is connected to nonreactive gas source of supply (not shown).
Constitute and the substrates fixed disk cleaning unit 200 of operation can use separately by said structure, or constitute a device and be attached to go up by a plurality of cleaning units 200 and use as devices such as slit coating machines.Below, explanation is provided with the substrates fixed disk cleaning device of described substrates fixed disk cleaning unit 200 with reference to Fig. 6 to Fig. 8.
Fig. 6 is the schematic diagram according to substrates fixed disk cleaning device provided by the present invention, Fig. 7 is the schematic diagram that is provided with the slit coating machine of substrates fixed disk cleaning device provided by the present invention, and Fig. 8 is the Pareto diagram that is located at the substrates fixed disk cleaning unit of substrates fixed disk cleaning device provided by the present invention.
Substrates fixed disk cleaning device provided by the present invention is made of the support component 300 of aforesaid cleaning unit 200 and the described cleaning unit 200 of support.Described support component 300 forms a plurality of supported holes 310 and to have preset width and the plate object of thickness constitutes by connecting.
Described support component 300 as shown in Figure 7, and is similar with gap nozzle 110, and its two ends can be supported by the nozzle transfer unit 120 of slit coating machine respectively.So, when the two ends of described support component 300 are supported by nozzle transfer unit 120 respectively, by described nozzle transfer unit 120 along the vertically moving of substrates fixed disk 102, thereby make described cleaning unit 200 carry out washing and cleaning operation to whole base plate fixed disk 102.For this reason, described supported hole 310 forms and makes cleaning unit 200 across whole base plate fixed disk 102.That is, being installed on the cleaning unit 200 of described support component 300 can be by a plurality of row that are arranged as.But, consider the spacing between the cleaning unit 200 and be formed on the spray-hole 222 of cleaning unit 200 and the arranging situation of inlet hole 224, as shown in Figure 8, preferably form zigzag fashion with two row.
In addition, when described cleaning unit 200 is installed at described support component 300, the connecting portion 244 that is provided with of described installation portion 240 upwards is inserted into the described supported hole 310 from the bottom of described support component 300, so that the main body 220 of described cleaning unit 200 is arranged in the bottom of support component 300, as shown in Figure 7.The screw thread of the upper end that connecting portion 244 is set to outstanding described in the top of described support component 300 by its outer peripheral face with nut 260 be set combine.At this moment, the lower end of connecting portion 244 is set and length between the nut 260 is set greater than the thickness of described support component 300, therefore described cleaning unit 200 can move up and down with respect to described support component 300.For described cleaning unit 200 is moved up and down smoothly with respect to support component 300, in the supported hole 310 of described support component 300 bearing can also be set.
As mentioned above, cleaning device provided by the present invention is located on the slit coating machine, and the two ends of described support component 300 are supported by the nozzle transfer unit 120 of slit coating machine, thereby according to the top of the mobile cleaning base plate fixed disk 102 of described nozzle transfer unit 120.That is,, then be located at the upper surface of cleaning unit 200 lower surfaces of described support component 300 in the face of substrates fixed disk 102 if under the state that does not have mounting substrate on the substrates fixed disk 102, described support component 300 is fixed in nozzle transfer unit 120.At this moment, be preferably formed as a determining deviation between the upper surface of the lower surface of described cleaning unit 200 and substrates fixed disk 102.
Then, as the explanation that the course of work of cleaning unit 200 is done, be ejected on the substrates fixed disk 102 from the substrates fixed disk cleaning agent process playpipe 223 of cleaning agent source of supply (not shown) supply and by the spray-hole 222 that is formed on main body 220 centers.At this moment, because spray described substrates fixed disk cleaning agent, described cleaning unit 200 suspension predetermined altitudes, thereby between substrates fixed disk 102 upper surfaces and cleaning unit 200, keep preset distance, and described substrates fixed disk cleaning agent under this state from the substrate separating base plate fixed disk 102 impurity 104 and it is swum.So the separated and impurity 104 that swims is inhaled into by the inlet hole 224 that is formed on around the described spray-hole 222 from the substrates fixed disk 102.At this moment, also preferably spray nonreactive gas by the vacuum hole 103h that is formed on the described substrates fixed disk 102.
At this moment, because described cleaning unit 200 is a plurality of along the lateral arrangement of substrates fixed disk 102, and by nozzle transfer unit 120 along the vertically moving of substrates fixed disk 102, therefore can carry out this washing and cleaning operation at short notice to the entire area of substrates fixed disk 102.
Though describe the present invention with reference to drawings and Examples above, the worker of affiliated technical field can carry out various modifications and changes to the present invention under the situation that does not break away from the technology of the present invention thought of putting down in writing in the claim.
For example, though cleaning unit 200 its global shapes of the embodiment that illustrates are cylindrical, also can constitute multiple shapes such as quadrangular prism, hexagon prism.Especially, though main body 220 lower surfaces of the described cleaning unit 200 shown in Fig. 4 are the plane, but as shown in Figure 9, can constitute the inclined plane that is directed downwards inclination from described spray-hole 222 towards inlet hole 224, thereby form predetermined space in the bottom of described main body 220.At this moment, the substrates fixed disk cleaning agent that sprays from described spray-hole 222 flows in described space with the impurity 104 that separates from substrates fixed disk 102 according to this cleaning agent and is inhaled in the inlet hole 224, so can prevent that described impurity 104 from dropping on the outside of cleaning unit 200.
And, though a plurality of cleaning units 200 are set on the support component 300 in the foregoing description, but also can along substrates fixed disk 102 a cleaning unit 200 laterally is set movably, and the driver element that laterally moves described cleaning unit 200 along described is set specially.At this moment, a cleaning unit 200 can clean whole base plate fixed disk 102 along horizontal and vertical movement respectively according to described driver element and nozzle transfer unit.
In sum, the present invention utilizes vacuum to suck the impurity of removing thus by after injection nonreactive gas or the sublimability solids on substrates fixed disk, thereby with noncontact mode cleaning base plate fixed disk.Therefore, the existing contact cleaning way that cleans with rag is different with using, and can not produce additional impurity in cleaning, can improve the cleannes of substrates fixed disk upper surface thus.
Especially because this substrates fixed disk washing and cleaning operation carries out automatically, therefore with existing handwork reduced in comparison the activity duration, enhance productivity thereupon the standby time that reduces the slit coating machine.
And, owing to being installed on the existing slit coating machine, uses the alternative gap nozzle of substrates fixed disk cleaning device provided by the present invention, therefore simplified apparatus structure and operation.
Claims (11)
1, a kind of substrates fixed disk cleaning unit is characterized in that comprising:
Main body;
Be formed on described main body and to the spray-hole of described substrates fixed disk jet cleaner, to be used to separate the impurity on the described substrates fixed disk;
Separate the inlet hole of preset distance from described spray-hole, to be used to suck the impurity that separates by described cleaning agent.
2, cleaning unit according to claim 1 is characterized in that described inlet hole forms a plurality of around described spray-hole.
3, cleaning unit according to claim 1 and 2 is characterized in that described cleaning agent comprises nonreactive gas or sublimability solids.
4, cleaning unit according to claim 3 is characterized in that described sublimability solids comprise dry ice.
5, cleaning unit according to claim 1 and 2 is characterized in that the formation spray-hole of described main body and the bread of inlet hole contain the inclined plane that is directed downwards inclination from described spray-hole towards inlet hole.
6, a kind of cleaning device is characterized in that comprising:
According to claim 1 or 2 cleaning units that provided;
The support component that described cleaning unit is set and moves along a certain direction with respect to substrates fixed disk.
7, cleaning device according to claim 6 is characterized in that described cleaning unit is arranged as a plurality of and with the above zigzag fashion that forms of two row.
8, cleaning device according to claim 6 is characterized in that described cleaning unit is located on the support component and can moves in the vertical direction.
9, cleaning device according to claim 6 is characterized in that described cleaning unit is located on the described support component, and can be along moving with the perpendicular direction of described a certain direction.
10, a kind of cleaning method is used for the cleaning base plate fixed disk, it is characterized in that comprising step:
For removing impurity on the described substrates fixed disk to described substrates fixed disk jet cleaner;
The impurity that suction is removed by described cleaning agent.
11, cleaning method according to claim 10 is characterized in that also comprising by being formed on the step of the vacuum hole gas jet on the described substrates fixed disk.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060049646A KR101206775B1 (en) | 2006-06-02 | 2006-06-02 | Apparatus and method for cleaning substrate chuck |
| KR1020060049646 | 2006-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101081396A true CN101081396A (en) | 2007-12-05 |
Family
ID=38911313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101038595A Pending CN101081396A (en) | 2006-06-02 | 2007-05-17 | Substrates fixed disk cleaning unit, cleaning device and cleaning method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101206775B1 (en) |
| CN (1) | CN101081396A (en) |
| TW (1) | TW200802523A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681247A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | Wafer reaction chamber cleaning device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100857525B1 (en) * | 2007-08-31 | 2008-09-08 | 중앙대학교 산학협력단 | Suction device of minute particles |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3725615B2 (en) * | 1996-06-21 | 2005-12-14 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2001079505A (en) * | 2000-07-03 | 2001-03-27 | Yokogawa Electric Corp | Suction nozzle device |
| JP4564742B2 (en) * | 2003-12-03 | 2010-10-20 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
-
2006
- 2006-06-02 KR KR1020060049646A patent/KR101206775B1/en not_active IP Right Cessation
-
2007
- 2007-05-17 CN CNA2007101038595A patent/CN101081396A/en active Pending
- 2007-06-01 TW TW096119772A patent/TW200802523A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681247A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | Wafer reaction chamber cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070115357A (en) | 2007-12-06 |
| TW200802523A (en) | 2008-01-01 |
| KR101206775B1 (en) | 2012-11-30 |
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Open date: 20071205 |