JP3725615B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a substrate processing apparatus applied to manufacture of various substrates such as a semiconductor wafer, a glass substrate of a liquid crystal display, a PDP (plasma display), and an EL (electroluminescence).
[0002]
[Prior art]
  Conventionally, in manufacturing processes such as semiconductor wafers, glass substrates for liquid crystal displays, PDPs (plasma displays), ELs (electroluminescence), etc., the substrate is placed and held on a work table in many processes. For example, the substrate is vacuum-adsorbed on the work table to form a coating film of a photoresist solution or the like, or the substrate is placed on the work table via a projecting support pin or the like In this state, the substrate is heated or cooled.
[0003]
[Problems to be solved by the invention]
  By the way, in this kind of substrate processing apparatus, a large foreign matter may be rarely generated due to damage of the substrate being processed, scattering of the solidified resist solution, etc. In the process of scratching or breaking the substrate, or forming a thin film, the substrate quality is deteriorated by causing the thinness of the substrate to be lost and causing the formation failure of the thin film.
[0004]
  Conventionally, such foreign matter on the table has been treated afterwards by wiping by an operator when it is deemed necessary, such as when a substrate is damaged or when a substrate failure occurs, to solve the above problems. No effective measures were taken. However, in recent years, the substrate has become larger and thinner, and even a relatively small foreign substance that is difficult to visually check attached to the table tends to have a great influence on the substrate quality. Therefore, it is required to clean the table regularly and frequently in order to reliably remove foreign matters on the table. However, it is important to leave such work to the operator because of workability or new dust generation. There are problems such as factors.
[0005]
  The present invention has been made in view of the above-described problems, and effectively removes foreign matter adhering to the processing table while reducing the operator's work, thereby effectively preventing deterioration of the substrate quality caused by the foreign matter. It is an object of the present invention to provide a substrate processing apparatus that can perform the above processing.
[0006]
[Means for Solving the Problems]
  In the substrate processing apparatus according to the present invention, the substrate to be processed is held on the work table surface.A slit coater for performing a process of supplying liquid to the substrate while moving the liquid supply head relative to the substrate is provided.In the substrate processing apparatus, remove foreign matter adhering to the work table.Cleaning headWhen,A liquid supply head driving means for allowing the liquid supply head to move in a uniaxial direction across a work position facing the work table surface and a retreat position outside the work table;the aboveCleaning headBetween the work position facing the work table surface and the retreat position outside the work tableAlong the locus of the liquid supply headMake movableCleaning headDriving means and the aboveWhile controlling the liquid supply head driving means to move the liquid supply head from the retracted position to the working position and supply the liquid onto the substratecleaningheadTo remove foreign objects on the work table by moving theCleaning headAnd a control means for controlling the drive means (claim 1).
[0007]
  According to this apparatus, the surface of the work table can be cleaned periodically or automatically at an arbitrary timing, so that a complicated cleaning work by the operator is not necessary, and a certain work is performed because the table is mechanically cleaned. It is possible to ensure accuracy.
[0008]
  More specifically, the liquid supply head and the cleaning head are movably mounted on a common rail provided in the uniaxial direction (claim 2). In addition, the retracting position of the liquid supply head and the retracting position of the cleaning head are provided on opposite sides of the work table (Claim 3).
[0009]
  UpCleaningheadAs a non-contact type that sucks at least foreign matter on the work tablethingAnd a contact-type device having means for wiping the work table surface can be applied.4,5). These cleaningheadIn the non-contact type apparatus, the work table surface can be protected, and the contact type apparatus can improve the foreign substance removal performance. Also these cleaningheadFurthermore, if a peeling promoting means for promoting the peeling of the foreign matter by reducing the adhesion of the foreign matter to the work table is provided (claim)6), Higher foreign matter removal performance can be obtained. In particular, when a cleaning liquid supply device is provided as a peeling accelerating means and the work table surface is wiped off while supplying the cleaning liquid to the work table, a drying means for drying the work table surface after wiping is further provided. (Claims7), It is possible to improve the efficiency of the cleaning work. Moreover, if a device that blows ionized air onto the work table is used as a peeling promoting means (claim)10), It is possible to effectively remove the foreign matter adsorbed electrostatically on the work table.
[0010]
  The cleaning head has a box-shaped housing having an opening that opens toward the work table. In the housing, a means for wiping the work table surface and a cleaning agent as the peeling accelerating means are provided. And a cleaning agent supply device that supplies the inside of the housing (claim 8). In this case, the housing may further include a drying means for drying the work table surface.
[0011]
  Further, in an apparatus that performs processing by sucking and holding a substrate on the work table surface, if the substrate is sucked and held with foreign matter adhering to the work table surface, the substrate is often significantly deformed or damaged. Therefore, when the work table is to hold the substrate by suction (claim)11), It is possible to improve the substrate quality by appropriately removing foreign matter on the work table.
[0012]
  Further, the cleaning is performed only when the substrate processing apparatus is in operation and the substrate is not placed on the work table.headas well asCleaning headIf the control means is configured to operate the drive means (claims)12), It is possible to appropriately clean the work table without hindering the substrate processing work. In particular, cleaning at any preset timingheadas well asCleaning headIf the drive means is actuated (claims)13), It is possible to clean the work table without impairing the substrate processing efficiency.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described with reference to the drawings.
[0014]
  FIG. 1 schematically shows a substrate processing system to which the present invention is applied. As shown in the figure, the substrate processing system 10 is provided with a standby unit 12, a coater unit 14 and a bake unit 18 in order from the upstream side (left side in the figure), and is loaded into the standby unit 12. The substrate after the cleaning process is configured to perform a predetermined process while being sequentially transferred between the units by the transfer robot 15. That is, the substrate carried into the standby unit 12 is first formed with a thin film of a resist solution on the surface thereof in the coater unit 14. Then, after the substrate is heated and cooled in the bake unit 18, it is carried out to the next process.
[0015]
  In the present embodiment, the substrate is a square substrate, and the thin film of the resist solution in the coater unit 14 is formed by a slit coater 16 as shown in FIG. Hereinafter, the slit coater 16 will be described.
[0016]
  As shown in the figure, the slit coater 16 is provided with a stage 25 serving as a base, and a table 26 for holding the substrate W is integrally provided on the upper surface of the stage 25. The table 26 has a square shape slightly larger than the substrate W, and a plurality of suction holes 27 communicating with a negative pressure generator (not shown) are formed at appropriate positions on the surface. That is, the substrate W is carried from the standby unit 12 by the transfer robot 15 and placed on the table 26 and is vacuum-sucked from the lower surface through the suction holes 27 to be fixed to the surface of the table 26. ing.
[0017]
  Further, a liquid supply head 31 for supplying a resist solution onto the substrate W and a cleaning head 41 for cleaning the surface of the table 26 are provided above the table 26, and each of them is uniaxially (see FIG. 2). In the direction indicated by the white arrow (hereinafter referred to as the front-rear direction).
[0018]
  That is, the stage 25 is provided with a pair of rails 28 extending in the front-rear direction and ball screw shafts 35 and 43 that are rotationally driven by servomotors 36 and 44, respectively. In addition, a pair of front and rear U-shaped frames 34 and 42 extending in the width direction (a direction orthogonal to the front and rear direction on the plane) and rising at both ends are provided below the stage 25. Both ends are respectively attached to the rail 28, and the liquid supply head 31 is supported between both ends of one frame 34, and the cleaning head 41 is supported between both ends of the other frame 42. The ball screw shaft 35 is screwed into a nut portion (not shown) provided in the frame 34, and the ball screw shaft 43 is screwed into a nut portion (not shown) provided in the frame 42. Thus, the liquid supply head 31 moves in the front-rear direction along the rail 28 integrally with the frame 34 by the rotation of the ball screw shaft 35 by the operation of the servo motor 36, while the ball screw shaft 43 is operated by the operation of the servo motor 44. The cleaning head 41 moves in the front-rear direction integrally with the frame 42 by the rotation.
[0019]
  The liquid supply head 31 has a slit-like supply port 32 extending in the width direction at the lower part, and from a resist liquid supply tank (not shown) via a feed pipe 33 connected to the upper part of the liquid supply head 31. The resist solution fed at a constant pressure is fed onto the substrate W through the supply port 32.
[0020]
  On the other hand, as shown in FIG. 3, the cleaning head 41 includes a pressure portion 52 having an ultrasonic generator 53 and an exhaust pipe 56 (inside a box-shaped housing 50 having a lower opening extending in the width direction. And a vacuum part 54 connected to a negative pressure supply device for collecting dust via a dust collecting unit (see FIG. 2), and by generating ultrasonic air in the pressure part 52 and blowing it onto the surface of the table 26. The foreign matter adhering to the table 26 is peeled off, and this is sucked and discharged through a slit-like opening 55 formed in the vacuum portion 54. The pressure part 52 and the vacuum part 54 are configured so that foreign matter can be sucked while blowing ultrasonic air over the entire width direction of the table 26.
[0021]
  In FIG. 2, reference numeral 29 denotes a solvent pot for storing an anti-drying solvent provided on the side of the table 26 so as to be movable up and down via a lifting mechanism (not shown). When the solvent pot 29 is raised in a state of being disposed above the solvent pot 29, the supply port 32 of the liquid supply head 31 is disposed in the solvent atmosphere, and the resist solution existing in the supply port 32 is dried. It is to be prevented.
[0022]
  By the way, the slit coater 16 configured as described above has a controller having a microcomputer as a constituent element although not shown in the drawing, and includes the servo motors 36 and 44, the liquid supply head 31 and the cleaning head. All devices for operating 41 are connected to this controller. When the substrate processing system 10 is in operation, the liquid supply head 31 is operated in accordance with a program stored in advance to form a thin film of resist solution on the substrate W, and the cleaning head 41 is operated at a predetermined timing to operate the table 26. In order to clean the surface, the servo motors 36, 44 and the like are controlled by the controller.
[0023]
  Here, an example of the substrate processing operation in the slit coater 16 having the above configuration will be described with reference to FIG.
[0024]
  Before the operation of the slit coater 16, as shown in FIG. 4A, the liquid supply head 31 and the cleaning head 41 are respectively set at the retracted positions in the front and rear direction with the table 26 sandwiched therebetween. By holding the pot 29 in the raised position, the supply port 32 of the liquid supply head 31 is disposed in the solvent atmosphere.
[0025]
  When the slit coater 16 is operated, the substrate W is loaded by the transfer robot 15 and placed on the table 26. At the same time, negative pressure is supplied to the lower surface of the table 26 through the suction holes 27. Thus, the substrate W is vacuum-sucked and fixed to the surface of the table 26. Further, the solvent pot 29 is moved to the lower end position until the setting of the substrate W on the table 26 is completed.
[0026]
  When the setting of the substrate W is completed, the liquid supply head 31 starts to move and moves toward the cleaning head 41 on the right side in the figure, and then a resist solution having a constant pressure is fed to the liquid supply head 31. Then, the liquid supply head 31 is moved from the right side to the left side of the substrate W (from the right side to the left side in the figure), whereby a thin film of resist solution is formed on the substrate W (FIG. 4). (B)).
[0027]
  When the thin film is formed, the liquid supply head 31 is reset to the retracted position (FIG. 4C), the supply of negative pressure to the suction hole 27 is shut off, and then the substrate W is transferred to the transfer robot 15. Is carried out to the next process, that is, the bake unit 18.
[0028]
  When the substrate W is unloaded, the cleaning head 41 starts to move, and the cleaning head 41 is reciprocated from the right side to the left side of the table 26. The surface of the table 26 is cleaned by operating the cleaning head 41 during the forward movement (FIGS. 4D and 4E). That is, the ultrasonic air is generated in the pressure portion 52 during the forward movement of the cleaning head 41, so that foreign matter adhered to the table surface is blown away and sucked and collected by the vacuum portion 54 via the exhaust pipe 56. It is discharged outside.
[0029]
  When the cleaning head 41 is reset to the retracted position in this way, the next substrate W is carried onto the table 26 by the transfer robot 15 and the liquid supply head 31 is operated to form a thin film of resist solution on the substrate W as described above. Is done.
[0030]
  By the way, in a series of substrate processing operations of the slit coater 16 as described above, the cleaning head 41 is operated by a program setting by the controller or a manual operation.
(1) When the slit coater 16 is in operation and before stoppage due to the end of work, or at any one of these times,
(2)Every time one substrate W is processed,
(3) Every time processing of one lot of substrates W composed of a predetermined number of substrates W is completed,
(4) When it is recognized as particularly necessary when the substrate W is damaged,
(5) the above(1)-(4)Any combination of
It can be operated with.
[0031]
  In addition, the number of operations, that is, the number of times the coater unit 14 is reciprocated is not limited to one reciprocation as described above. For example, when the substrate W is damaged, particularly when cleaning needs to be performed with great focus. The table 26 is cleaned while the coater unit 14 is reciprocated a plurality of times, or the part is controlled so as to be intensively cleaned while being reciprocated only at a specific part on the table 26.
[0032]
  As described above, according to the slit coater 16 described above, the table 26 can be automatically cleaned by operating the cleaning head 41, so that it is not necessary to wipe the table surface by a conventional operator. The operator's work can be reduced. In addition, since the table 26 is mechanically cleaned by the cleaning head 41, work accuracy can be kept constant. Therefore, for example, the cleaning head 41 is frequently operated regularly, so that the surface of the table 26 can be kept in an appropriate state, and this causes foreign matter adhering to the table surface which has been a problem in this type of conventional apparatus. It is possible to prevent the substrate from being damaged or damaged due to the above, and as a result, the substrate quality can be ensured more reliably.
[0033]
  In particular, according to the cleaning head 41, the surface of the table 26 is cleaned without contacting the table 26, so that the table 26 is appropriately cleaned, but the table 26 is damaged or new foreign matters are removed by the cleaning. Will not be generated.
[0034]
  By the way, as a structure of the cleaning head which cleans the table 26 surface, it shows in FIG. 5-6 other than what is called a non-contact type structure which attracts | sucks and discharges a foreign material, generating ultrasonic air as mentioned above, for example. Such a contact-type cleaning head 60 can also be configured. This example will be described below.
[0035]
  As shown in FIG. 5, the cleaning head 60 is also provided with a box-shaped housing 61 having a lower opening extending in the width direction, like the cleaning head 41. Inside the housing 61, there are provided a nozzle 62 that discharges the cleaning liquid to the table 26 and a wiping device 63 on the surface of the table 26, and an exhaust pipe 67 that sucks and discharges the atmosphere inside the housing 61 to the outside. Connected to the side of the.
[0036]
  The nozzle 62 is connected to a cleaning liquid storage tank via a pump, and discharges cleaning liquid such as isopropyl alcohol, ECA (ethyl celsoleb acetate), propylene glycol monomethyl ether acetate, etc., to the table 26, for example. ing.
[0037]
  On the other hand, the wiping device 63 includes a driving roller 65a that is rotated by driving of the stepping motor 64, a driven roller 65c that is disposed horizontally at an appropriate interval, and a lower opening of the housing 61 between them. The presser roller 65b is arranged at a position facing the table 26, and a clean cloth 66 made of, for example, long fibers, which is mounted over the rollers and hardly generates dust. Each of the rollers 65 a to 65 c and the clean cloth 66 is set such that the width direction dimension thereof is longer than the width direction dimension of the table 26.
[0038]
  When the table 26 is cleaned by the cleaning head 60, the arrow in FIG.(1)-(5)First, after the cleaning head 60 is moved from the retracted position to the end of the table 26, the cleaning head 60 is lowered at this position, whereby the clean cloth 66 of the wiping device 63 is moved by the pressing roller 65b. Touch the table 26 while pressing (arrow)(1), (2)). In this state, the cleaning head 60 is moved while discharging the cleaning liquid from the nozzle 62, and the table 26 is cleaned by wiping with a clean cloth 66 while removing the foreign matter adhering to the surface of the table 26 with the cleaning liquid (arrow).(3)). After the cleaning head 60 is moved to the end of the table 26, the cleaning head 60 is raised and reset to the retracted position (arrow)(4), (5)).
[0039]
  After the cleaning operation as described above is performed a predetermined number of times, the clean cloth 66 is rotated by moving the stepping motor 64 so that a new clean cloth 66 is brought into contact with the table 26. . That is, the wiping of the table 26 is continued and appropriately performed by doing so. At this time, since the atmosphere is sucked and discharged in the housing 61 through the exhaust pipe 67 as described above, the foreign matter already wiped off by the clean cloth 66 is dried and scattered, and again adheres to the table 26. There is no such thing.
[0040]
  The surface of the table 26 can be cleaned also by the configuration of the cleaning head 60 as described above. In particular, according to the cleaning head 60, the surface of the table 26 is wiped off with the clean cloth 66 while reducing the adsorbing power of the foreign matter with the cleaning liquid. Therefore, for example, a resist solution solidified on the surface of the table 26, etc. This is advantageous in comparison with the cleaning head 41 described above.
[0041]
  As a modification of the cleaning head 60, for example, a configuration as shown in FIG. 7 can be adopted. That is, the cleaning head 60 may be further provided with a warm air heater 70 for blowing warm air to the table 26, thereby promoting the drying of the surface of the table 26 after wiping. According to this configuration, even when a cleaning agent having low volatility is used, the cleaning liquid can be dried at an early stage to improve the efficiency of the cleaning operation. Therefore, it is advantageous when a highly volatile cleaning agent cannot be used because the temperature drop of the table 26 affects the quality of the substrate W.
[0042]
  Furthermore, as a modification of the wiping device 63 of the cleaning head 60 shown in FIG. 5, a wiping device 75 as shown in FIG. 8 can be configured. That is, the reel 76 around which the belt-like clean cloth 80 is wound is rotatably supported, and the take-up roller 78 that is rotated by the driving of the stepping motor 79 via the pressing roller 77 through the clean cloth 80 led out from the reel 76. The wiping device 75 that winds up can be configured. According to the wiping device 75, a large number of clean cloths 80 can be stored and used in a small space, and therefore the replacement cycle of the clean cloth 80 can be prolonged as compared with the wiping device 63 shown in FIGS. This is advantageous in terms of maintenance.
[0043]
  By the way, when the above-described cleaning head 60 is applied, it is necessary to raise and lower the cleaning head 60 during the cleaning operation as described above. For such an operation, for example, a configuration as shown in FIG. 9 is adopted. Can be made to do. That is, an air cylinder 68 having rods 68a that can be moved back and forth in the vertical direction is provided at both ends of the frame 42, and a cleaning head 60 is attached to the tip of the rod 68a of the air cylinder 68 via a support member 69. Thus, the cleaning head 60 can be raised and lowered by controlling the supply and discharge of air pressure to and from each air cylinder 68.
[0044]
  The slit coater 16 of the above embodiment is an example of a substrate processing apparatus according to the present invention, and the specific configuration thereof can be appropriately changed without departing from the gist of the present invention.
[0045]
  For example, in the cleaning head 41, an ultrasonic generator 53 is provided as a peeling facilitating means for promoting the peeling of the foreign matter attached to the table 26, and the peeling of the foreign matter is promoted by ultrasonic air thereby. In addition to this, for example, an ionizer that blows ionized air onto the table 26 is provided, thereby promoting the separation of the foreign matter electrostatically adsorbed on the table 26, or an air injection nozzle is provided to supply high-pressure compressed air to the table. 26 may be sprayed. Further, in order to further simplify the structure, the pressure portion 52 is omitted from the cleaning head 41, and foreign matters are removed only by suction by the vacuum portion 54, or only air jet nozzles are provided on the cleaning head, and foreign matters are generated by compressed air. You may make it blow off. However, in the case where only the air injection nozzle is provided in the cleaning head and the foreign matter on the table 26 is blown away, for example, it is desirable to separately provide a forced exhaust means or the like in the periphery of the table 26 in order to prevent scattering of particles. .
[0046]
  In the slit coater 16, the table 26 is provided horizontally. For example, as shown in FIG. 10, a table 81 is provided vertically on the stage 80, and the substrate W is vacuum-sucked on the surface of the table 81. In the case of a slit coater that performs processing on the substrate W while moving the liquid supply head 82 along the extension direction guide 86 by a ball screw mechanism or the like (not shown), the same as the cleaning head 41 or the like. By configuring the cleaning head 85 to move up and down along the guide 86 by a ball screw mechanism or the like, the surface of the table 81 can be appropriately cleaned as in the case of the slit coater 16.
[0047]
  In the above embodiment, the example in which the present invention is applied to the slit coater 16 has been described. However, the present invention can be applied to applications other than the slit coater 16, for example, to the bake unit 18. The invention can also be applied. As shown in FIG. 11, the bake unit 18 generally includes a plurality of plates such as hot plates 18a to 18c and a cool plate 18d, and sequentially heats and cools the substrate W while transferring the substrate W onto these plates. Therefore, when the present invention is applied to the bake unit 18, for example, as shown in the figure, the cleaning head 41 can be moved up and down and horizontally above the plates 18a to 18d. Provided, arrow in FIG.(1)-(4)The cleaning head 41 may be configured to perform cleaning while moving over the plates 18a to 18d. Of course, it is possible to provide a cleaning head for each of the plates 18a to 18d, but the above configuration has an advantage that the plates 18a to 18d can be cleaned with a common cleaning head. In some cases, an obstacle such as a suction duct is installed between the plates 18a to 18d for the purpose of removing particles. In such a case, as shown in FIG. The plates 18a to 18d may be cleaned while moving the cleaning head 41 up and down between -18d and avoiding suction ducts and the like.
[0048]
  The present invention is also applicable to a bake unit configured to heat the substrate to a predetermined temperature with a single hot plate other than the bake unit 18 as described above. For example, FIG. 13 is an example of such a bake unit. In the bake unit 90 shown in this figure, a hot plate 92 having a fixed support portion 94 called a proxy ball and a lift pin 93 that can move up and down is provided inside the container 90, and a substrate is placed in the container 90 via the entrance / exit portion 95. W is derived. First, after the substrate W is placed on the lift pins 93 projecting from the raised end position, the lift pins 93 are gradually lowered and placed on the fixed support portion 94, whereby the substrate W is mounted. It is heated to a predetermined temperature. In the case of this bake unit 90, as shown in the figure, for example, the cleaning head 41 is provided above the container 90 so as to be movable up and down and horizontally, and at the time of cleaning, the cleaning head 41 is lowered and the cleaning head 41 is lowered. 14 from the initial position above the rear part (the rear part with respect to the entrance / exit part 95 of the substrate W; the left part in the same figure) in FIG.(1)-(4)It can comprise so that cleaning may be performed, moving as shown in FIG.
[0049]
  Further, in this type of thin film forming apparatus other than the above-described slit coater 16 such as a spin coater and a roll coater, the substrate is vacuum-adsorbed on a table. It is effective to provide a cleaning device for the work table. Furthermore, in an apparatus using a spin coater, an end face cleaning unit for cleaning and removing unnecessary thin film portions formed on the edge of the substrate is generally provided as a subsequent process. In such an end face cleaning unit, Since the work is performed in a state where the substrate is vacuum-sucked on the work table, it is effective to provide the cleaning device as described above for the table.
[0050]
【The invention's effect】
  As described above, the substrate processing apparatus according to the present invention holds the substrate on the work table surface.Provided with a slit coater that performs processing to supply liquid to the substrate while moving the liquid supply head relative to the substrate.In the substrate processing apparatus, remove foreign matter adhering to the work table.Cleaning headWhen,A liquid supply head driving means for allowing the liquid supply head to move in a uniaxial direction across a work position facing the work table surface and a retreat position outside the work table;the aboveCleaning headBetween the work position facing the work table surface and the retreat position outside the work tableAlong the locus of the liquid supply headMake movableCleaning headDriving means;The liquid supply head driving means is controlled to move the liquid supply head from the retracted position to the working position to supply liquid onto the substrate, and the cleaning headTo remove foreign objects on the work table by moving theCleaning headSince the control means for controlling the drive means is provided, the work table surface can be cleaned periodically or automatically at any timing, thereby eliminating the need for complicated cleaning work by the operator and keeping the work accuracy constant. Can be kept in. Therefore, it becomes possible to prevent the substrate from being damaged or damaged due to the adhered foreign matter on the surface of the work table, which has been a problem in this type of conventional apparatus, and the substrate quality can be ensured more reliably. .
[0051]
  Above cleaningheadAs a non-contact type that sucks at least foreign matter on the work tablethingAlternatively, a contact-type device having means for wiping the work table surface can be applied, and cleaning theseheadIn the non-contact type apparatus, the work table surface can be protected, and according to the contact type apparatus, the foreign substance removal performance is enhanced. Also these cleaningheadFurthermore, if a peeling promoting means for further promoting the peeling of the foreign matter by reducing the adhesion of the foreign matter to the work table is provided, a higher foreign matter removing performance can be obtained. In particular, when a cleaning liquid supply device is provided as a peeling accelerating means and the work table surface is wiped off while supplying the cleaning liquid to the work table, a drying means for drying the work table surface after wiping is further provided. This makes it possible to increase the efficiency of the cleaning work. Further, if a device that blows ionized air onto the work table is used as the peeling promoting means, the foreign matter electrostatically adsorbed on the work table can be more effectively removed.
[0052]
  Further, in an apparatus that performs processing by sucking and holding a substrate on the work table surface, if the substrate is sucked and held with foreign matter adhering to the work table surface, the substrate is often significantly deformed or damaged.In particular,In a slit coater that applies a resist solution or the like to the substrate surface, interference fringes are generated on the film surface, and the film thickness distribution tends to deteriorate. Therefore, when the work table is to hold the substrate by suction, the quality of the substrate can be improved by removing foreign matter on the work table.
[0053]
  Furthermore, cleaning is performed for each lot consisting of a predetermined number of substratesheadas well asCleaning headThe cleaning is performed when the substrate processing apparatus is in operation, such as by actuating a driving unit, and the substrate is not placed on the work table.headas well asCleaning headIf the control means is configured to operate the driving means, the work table can be efficiently cleaned.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a substrate processing system.
FIG. 2 is a schematic perspective view showing a slit coater to which the present invention is applied.
FIG. 3 is a schematic cross-sectional view showing a configuration of a cleaning head.
FIGS. 4A to 4E are diagrams illustrating operations of a liquid supply head and a cleaning head in a slit coater.
FIG. 5 is a schematic sectional view showing a modified example of the cleaning head.
6 is a diagram for explaining a table cleaning operation by the cleaning head shown in FIG. 5; FIG.
7 is a schematic cross-sectional view showing a modification of the cleaning head shown in FIG.
8 is a schematic cross-sectional view showing a modification of the cleaning head shown in FIG.
9 is a front view showing an example of a configuration for raising and lowering the cleaning head shown in FIG.
FIG. 10 is a schematic view showing another example of a slit coater.
FIG. 11 is a schematic view showing an example in which a cleaning head is provided in a bake unit.
12A and 12B are diagrams for explaining the cleaning operation of the cleaning head shown in FIG.
FIG. 13 is a schematic diagram showing another example in which a cleaning head is provided in the bake unit.
14 is a diagram illustrating a cleaning operation of the cleaning head shown in FIG.
[Explanation of symbols]
  10 Substrate processing system
  14 Coater unit
  16 Slit coater
  25 stages
  26 tables
  27 Suction hole
  28 rails
  29 Solvent pot
  31 Liquid supply head
  32 Supply port
  33 Feeding pipe
  34, 42 frames
  35, 43 Ball screw shaft
  36, 44 Servo motor
  41 Cleaning head

Claims (13)

In a substrate processing apparatus provided with a slit coater that performs a process of supplying a liquid to the substrate while moving the liquid supply head relative to the substrate while holding the substrate to be processed on the work table surface.
A cleaning head for removing foreign matter adhering to the work table;
A liquid supply head driving means for allowing the liquid supply head to move in a uniaxial direction across a work position facing the work table surface and a retreat position outside the work table;
A cleaning head driving means for allowing travel along the trajectory of the liquid supply head over the retracted position of the work table outwardly with working position facing the cleaning head on the work table surface,
The liquid supply head is moved from the retracted position to the working position to control the liquid supply head driving means to supply liquid onto the substrate, and the cleaning head is moved from the retracted position to the working position to remove foreign matters on the work table. And a control means for controlling the cleaning head driving means. The substrate processing apparatus according to claim 1, wherein the liquid supply head and the cleaning head are movably mounted on a common rail provided in the uniaxial direction . The substrate processing apparatus according to claim 1 or 2 and the retracted position retracted position and the cleaning head of the liquid supply head across the working table is characterized that you have provided opposite to each other. The cleaning head is for removing foreign matter in a non-contact state with respect to the work table, one of claims 1 to 3, characterized by being configured to suck the foreign matter on at least the working table the substrate processing apparatus of the crab according. The cleaning head, a substrate processing apparatus according to any one of claims 1 to 3, characterized in that it comprises means for wiping the work table surface. 6. The substrate processing apparatus according to claim 4 , wherein the cleaning head is provided with a peeling accelerating means for reducing the adhesion of the foreign matter to the work table and promoting the peeling of the foreign matter . The cleaning head includes means for wiping the work table surface, and a cleaning agent supply device for supplying a cleaning agent to the work table surface as the peeling promoting means. The cleaning head dries the work table surface. the substrate processing apparatus according to claim 6, wherein Rukoto such comprises a drying means. The cleaning head has a box-shaped housing having an opening that opens toward the work table . In the housing, a means for wiping the work table surface and a cleaning agent as the peeling promoting means are supplied to the work table surface. The substrate processing apparatus according to claim 6 , further comprising a cleaning agent supply device configured to suck the inside of the housing . 9. The substrate processing apparatus according to claim 8 , further comprising drying means for drying the work table surface in the housing . The release promoting means is a substrate processing apparatus according to claim 6, characterized in that the shall blowing air ionized in the work table. 11. The substrate processing apparatus according to claim 1, wherein the work table is configured to suck and hold a substrate on the surface thereof. The control means operates the cleaning head and the cleaning driving means only when the substrate processing apparatus is in operation and the substrate is not placed on the work table. Item 12. The substrate processing apparatus according to any one of Items 1 to 11. The control means performs the cleaning at every predetermined timing. 13. The substrate processing apparatus according to claim 12, wherein the substrate processing apparatus is for operating a cleaning head and a cleaning head driving means.

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