JP2007165844A - 基板から部品を分離する方法 - Google Patents

基板から部品を分離する方法 Download PDF

Info

Publication number
JP2007165844A
JP2007165844A JP2006260495A JP2006260495A JP2007165844A JP 2007165844 A JP2007165844 A JP 2007165844A JP 2006260495 A JP2006260495 A JP 2006260495A JP 2006260495 A JP2006260495 A JP 2006260495A JP 2007165844 A JP2007165844 A JP 2007165844A
Authority
JP
Japan
Prior art keywords
substrate
plate
producing
vacuum
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006260495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007165844A5 (https=
Inventor
Joern Besinger
ベジンガー ビョルン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of JP2007165844A publication Critical patent/JP2007165844A/ja
Publication of JP2007165844A5 publication Critical patent/JP2007165844A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2006260495A 2005-09-26 2006-09-26 基板から部品を分離する方法 Pending JP2007165844A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005046031A DE102005046031B3 (de) 2005-09-26 2005-09-26 Verfahren zur Separierung von Teilen aus einem Substrat

Publications (2)

Publication Number Publication Date
JP2007165844A true JP2007165844A (ja) 2007-06-28
JP2007165844A5 JP2007165844A5 (https=) 2009-11-05

Family

ID=37499487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006260495A Pending JP2007165844A (ja) 2005-09-26 2006-09-26 基板から部品を分離する方法

Country Status (8)

Country Link
US (1) US8193073B2 (https=)
EP (1) EP1767502A1 (https=)
JP (1) JP2007165844A (https=)
KR (1) KR20070034974A (https=)
CN (1) CN1974165A (https=)
DE (1) DE102005046031B3 (https=)
SG (1) SG131081A1 (https=)
TW (1) TW200730313A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011084531A3 (en) * 2009-12-15 2011-11-24 Solexel, Inc. Mobile vacuum carriers for thin wafer processing
US8399331B2 (en) 2007-10-06 2013-03-19 Solexel Laser processing for high-efficiency thin crystalline silicon solar cell fabrication
US9076642B2 (en) 2009-01-15 2015-07-07 Solexel, Inc. High-Throughput batch porous silicon manufacturing equipment design and processing methods
US10829864B2 (en) 2009-01-15 2020-11-10 Trutag Technologies, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101054920B1 (ko) * 2009-01-09 2011-08-05 주식회사 디엠에스 임프린트 장치
KR101309865B1 (ko) * 2009-12-23 2013-09-16 엘지디스플레이 주식회사 평판 표시 소자의 제조 장치 및 방법
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
CN106952850B (zh) * 2017-04-17 2023-09-08 如皋市大昌电子有限公司 一种芯片批量定位系统
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
KR102380777B1 (ko) * 2020-09-03 2022-03-30 주식회사 시스템알앤디 유리제품 분리장치 및 이를 이용한 분리방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068145A (ja) * 1992-06-26 1994-01-18 Rohm Co Ltd 薄板ガラスの加工法
JP2001002438A (ja) * 1999-06-15 2001-01-09 Mitsuboshi Diamond Industrial Co Ltd ガラススクライバー
JP2001024050A (ja) * 1999-07-08 2001-01-26 Disco Abrasive Syst Ltd ワーク保持装置
JP2001176821A (ja) * 1999-12-16 2001-06-29 Pmt:Kk 半導体製造における切断加工方法
JP2003051466A (ja) * 2001-08-07 2003-02-21 Sony Corp 半導体ウエーハのダイシング装置およびダイシング方法
DE10337920A1 (de) * 2003-08-18 2005-03-17 Schott Ag Verfahren zur Herstellung von Bauteilen

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
US5618759A (en) 1995-05-31 1997-04-08 Texas Instruments Incorporated Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof
US5803797A (en) 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
WO1999046211A1 (en) 1998-03-11 1999-09-16 Hitachi, Ltd. Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate
JP2000006100A (ja) * 1998-06-24 2000-01-11 Beldex:Kk 板状ワークの破断装置
DE19910559A1 (de) * 1999-03-10 2000-09-14 Espe Dental Ag Subgingivales Pulverstrahlen
JP4421697B2 (ja) * 1999-06-15 2010-02-24 三星ダイヤモンド工業株式会社 ブレイク装置
JP4388640B2 (ja) 1999-09-10 2009-12-24 株式会社ディスコ Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル
DE10016628A1 (de) * 2000-04-04 2001-10-18 Schott Glas Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen
DE10041519C1 (de) * 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
DE10060696A1 (de) * 2000-12-07 2002-06-27 Wacker Chemie Gmbh Vorrichtung und Verfahren zum ultraschallunterstützten Schleifen einer Werkstückkante
CN1223531C (zh) * 2001-07-25 2005-10-19 弗拉基米尔·斯捷潘诺维奇·孔德拉坚科 脆性的非金属材料的切割方法
US6746022B2 (en) 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece
NL1022463C2 (nl) 2003-01-22 2004-07-26 Fico Bv Drager, houder, lasersnij-inrichting en werkwijze voor het met behulp van laserlicht separeren van halfgeleider producten.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068145A (ja) * 1992-06-26 1994-01-18 Rohm Co Ltd 薄板ガラスの加工法
JP2001002438A (ja) * 1999-06-15 2001-01-09 Mitsuboshi Diamond Industrial Co Ltd ガラススクライバー
JP2001024050A (ja) * 1999-07-08 2001-01-26 Disco Abrasive Syst Ltd ワーク保持装置
JP2001176821A (ja) * 1999-12-16 2001-06-29 Pmt:Kk 半導体製造における切断加工方法
JP2003051466A (ja) * 2001-08-07 2003-02-21 Sony Corp 半導体ウエーハのダイシング装置およびダイシング方法
DE10337920A1 (de) * 2003-08-18 2005-03-17 Schott Ag Verfahren zur Herstellung von Bauteilen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8399331B2 (en) 2007-10-06 2013-03-19 Solexel Laser processing for high-efficiency thin crystalline silicon solar cell fabrication
US9076642B2 (en) 2009-01-15 2015-07-07 Solexel, Inc. High-Throughput batch porous silicon manufacturing equipment design and processing methods
US10829864B2 (en) 2009-01-15 2020-11-10 Trutag Technologies, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate
WO2011084531A3 (en) * 2009-12-15 2011-11-24 Solexel, Inc. Mobile vacuum carriers for thin wafer processing

Also Published As

Publication number Publication date
DE102005046031B3 (de) 2007-07-12
TW200730313A (en) 2007-08-16
CN1974165A (zh) 2007-06-06
SG131081A1 (en) 2007-04-26
US8193073B2 (en) 2012-06-05
US20070105347A1 (en) 2007-05-10
EP1767502A1 (de) 2007-03-28
KR20070034974A (ko) 2007-03-29

Similar Documents

Publication Publication Date Title
KR100383206B1 (ko) 웨이퍼의 분할 방법 및 반도체 장치의 제조 방법
KR20260007302A (ko) 칩들을 본딩하기 위한 방법 및 디바이스
KR101006526B1 (ko) 웨이퍼 마운트 테이프, 이를 이용한 웨이퍼 가공 장치 및 방법
CN1101458A (zh) 锯切数字微型镜器件以后的圆片工艺
CN111463162B (zh) 载体板的去除方法
JPH09141646A (ja) 基板加工方法
JP2007165844A (ja) 基板から部品を分離する方法
CN110828362B (zh) 载板的去除方法
CN110197794B (zh) 剥离方法
KR102733730B1 (ko) 웨이퍼의 가공 방법
CN111293069B (zh) 器件芯片的制造方法
TWI882147B (zh) 載板之除去方法
KR100539271B1 (ko) 휨 방지 재질을 사용하는 반도체 칩의 다이 접착 방법
JP4362755B2 (ja) 板状部材の分割方法及び分割装置
US20100051190A1 (en) Method for applying an adhesive layer on thin cut semiconductor chips of semiconductor wafers
CN112435951B (zh) 载体板的去除方法
TWI845750B (zh) 載板之除去方法
JP2025073150A (ja) 保護部材の固定方法
US8580070B2 (en) Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer
JP2007180252A (ja) 半導体装置の製造方法
CN113964074B (zh) 载体板的去除方法
TWI843906B (zh) 被加工物之保持方法
JP2000195878A (ja) ウェーハ搬送・固定治具及び半導体装置の製造方法
JP2008016485A (ja) ウェーハ搬送方法及びウェーハ搬送ユニット

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090911

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090911

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111012

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111013

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120112

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120117

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120412

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120906

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130305