JP2007165691A - 半導体パッケージ用多層基板及びその製造方法 - Google Patents
半導体パッケージ用多層基板及びその製造方法 Download PDFInfo
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- JP2007165691A JP2007165691A JP2005361629A JP2005361629A JP2007165691A JP 2007165691 A JP2007165691 A JP 2007165691A JP 2005361629 A JP2005361629 A JP 2005361629A JP 2005361629 A JP2005361629 A JP 2005361629A JP 2007165691 A JP2007165691 A JP 2007165691A
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- multilayer substrate
- semiconductor package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】半導体パッケージ用多層基板1において、基材フィルム4の両面に配線パターン5を形成し、その配線パターン5間をめっきされた導通穴6にて電気的に接合し、配線パターン5表面にソルダーマスク層7を施して基本ユニット2a,2bとし、各基本ユニット2a,2b同士を基材フィルム4のみからなる折り返し部3で連結し、これら基本ユニット2a,2bを折り返し部3にて折り返して重ね合わせ、折り返しによって向かい合った配線パターン5間を導電部材8にて電気的に接合したものである。
【選択図】図1
Description
2a,2b 基本ユニット
3 折り返し部
4 基材フィルム
5 配線層(配線パターン)
6 導通ビア(導通穴)
7 ソルダーマスク層
8 導電部材
20 半導体パッケージ
Claims (8)
- 半導体パッケージ用多層基板において、基材フィルムの両面に配線パターンを形成し、その配線パターン間をめっきされた導通穴にて電気的に接合し、上記配線パターン表面にソルダーマスク層を施して基本ユニットとし、各基本ユニット同士を基材フィルムのみからなる折り返し部で連結し、これら基本ユニットを上記折り返し部にて折り返して重ね合わせ、折り返しによって向かい合った配線パターン間を導電部材にて電気的に接合したことを特徴とする半導体パッケージ用多層基板。
- 長尺の上記基材フィルムの長さ方向あるいは幅方向に上記基本ユニットを複数個形成すると共に、各基本ユニット同士を連結する上記折り返し部を複数個形成し、上記基本ユニットを上記折り返し部にて長さ方向あるいは幅方向に複数回折り返して多段に重ね合わせた請求項1記載の半導体パッケージ用多層基板。
- 上記基材フィルムの厚さが50μm以下である請求項1または2記載の半導体パッケージ用多層基板。
- 上記ソルダーマスク層として、その厚さが上記配線パターンの厚さよりも110%以上厚い感光性ドライフィルムを使用した請求項1〜3いずれかに記載の半導体パッケージ用多層基板。
- 上記ソルダーマスク層は、少なくともエッジがフォトパターニングにより形成され、エッジの位置精度が設計値に対して±100μm以下である請求項1〜4いずれかに記載の半導体パッケージ用多層基板。
- 上記導電部材は、導電ペーストあるいは、はんだである請求項1〜5いずれかに記載の半導体パッケージ用多層基板。
- 上記基本ユニット間の距離が、上記ソルダーマスク層の厚さの250%以下である請求項1〜6いずれかに記載の半導体パッケージ用多層基板。
- 半導体パッケージ用多層基板の製造方法において、基材フィルムに導通穴を形成し、その導通穴を銅めっきし、上記基材フィルムの両面に配線パターンを形成し、その配線パターンの表面および上記基材フィルムの両面にソルダーマスク層を形成し、折り返しによって向かい合う配線パターンの表面に導電部材を設けてなる基本ユニットと、基材フィルムのみからなる折り返し部とを形成した後、上記基本ユニットを上記折り返し部にて折り返して重ね合わせることを特徴とする半導体パッケージ用多層基板の製造方法。
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JP2005361629A JP4655917B2 (ja) | 2005-12-15 | 2005-12-15 | 半導体パッケージ用多層基板及びその製造方法 |
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JP2005361629A JP4655917B2 (ja) | 2005-12-15 | 2005-12-15 | 半導体パッケージ用多層基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007165691A true JP2007165691A (ja) | 2007-06-28 |
JP4655917B2 JP4655917B2 (ja) | 2011-03-23 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002171069A (ja) * | 2000-12-04 | 2002-06-14 | Ibiden Co Ltd | 多層配線基板、及びその製造方法 |
JP2002299826A (ja) * | 2001-03-30 | 2002-10-11 | Toshiba Chem Corp | 多層プリント配線基板、半導体装置、及び、これらの製造方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002171069A (ja) * | 2000-12-04 | 2002-06-14 | Ibiden Co Ltd | 多層配線基板、及びその製造方法 |
JP2002299826A (ja) * | 2001-03-30 | 2002-10-11 | Toshiba Chem Corp | 多層プリント配線基板、半導体装置、及び、これらの製造方法 |
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