JP2007129239A - チップ型電気素子及びそれを含む表示装置 - Google Patents

チップ型電気素子及びそれを含む表示装置 Download PDF

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Publication number
JP2007129239A
JP2007129239A JP2006300340A JP2006300340A JP2007129239A JP 2007129239 A JP2007129239 A JP 2007129239A JP 2006300340 A JP2006300340 A JP 2006300340A JP 2006300340 A JP2006300340 A JP 2006300340A JP 2007129239 A JP2007129239 A JP 2007129239A
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JP
Japan
Prior art keywords
chip
type electric
dielectric layers
main body
electric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006300340A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007129239A5 (en:Method
Inventor
Hyeong-Cheol Ahn
亨 哲 安
Hyung-Guel Kim
炯 傑 金
Kun-Bin Lee
建 斌 李
Dong-Hwan Kim
東 煥 金
Ahn-Ho Jee
安 ▲ホ▼ 池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2007129239A publication Critical patent/JP2007129239A/ja
Publication of JP2007129239A5 publication Critical patent/JP2007129239A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Ceramic Capacitors (AREA)
  • Details Of Resistors (AREA)
JP2006300340A 2005-11-04 2006-11-06 チップ型電気素子及びそれを含む表示装置 Withdrawn JP2007129239A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050105281A KR20070048330A (ko) 2005-11-04 2005-11-04 칩형 전기 소자 및 이를 포함하는 표시 장치

Publications (2)

Publication Number Publication Date
JP2007129239A true JP2007129239A (ja) 2007-05-24
JP2007129239A5 JP2007129239A5 (en:Method) 2009-11-05

Family

ID=38036427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006300340A Withdrawn JP2007129239A (ja) 2005-11-04 2006-11-06 チップ型電気素子及びそれを含む表示装置

Country Status (5)

Country Link
US (1) US20070102805A1 (en:Method)
JP (1) JP2007129239A (en:Method)
KR (1) KR20070048330A (en:Method)
CN (1) CN101013630A (en:Method)
TW (1) TW200729252A (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10128035B2 (en) 2011-11-22 2018-11-13 Volterra Semiconductor LLC Coupled inductor arrays and associated methods
US9281739B2 (en) * 2012-08-29 2016-03-08 Volterra Semiconductor LLC Bridge magnetic devices and associated systems and methods
DE102012222224B4 (de) * 2012-12-04 2016-02-18 SUMIDA Components & Modules GmbH Magnetischer Kern und mehrteilige Kernanordnung
US9083332B2 (en) 2012-12-05 2015-07-14 Volterra Semiconductor Corporation Integrated circuits including magnetic devices
CN103515093A (zh) * 2013-07-24 2014-01-15 中国电子科技集团公司第五十五研究所 一种具有内部互连结构的片式电容及其制备方法
KR102097325B1 (ko) * 2014-09-23 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101792381B1 (ko) * 2016-01-04 2017-11-01 삼성전기주식회사 전자부품 및 그 제조방법
US10068529B2 (en) * 2016-11-07 2018-09-04 International Business Machines Corporation Active matrix OLED display with normally-on thin-film transistors
CN109637764B (zh) * 2018-12-29 2022-05-17 广东爱晟电子科技有限公司 高精度高可靠多层低阻热敏芯片及其制作方法
CN113270251A (zh) 2020-02-17 2021-08-17 日东电工株式会社 带标记的电感器及带标记的层叠片

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034864A (en) * 1997-11-14 2000-03-07 Murata Manufacturing Co., Ltd. Multilayer capacitor
US6218729B1 (en) * 1999-03-11 2001-04-17 Atmel Corporation Apparatus and method for an integrated circuit having high Q reactive components
US6970362B1 (en) * 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
TWI251313B (en) * 2003-09-26 2006-03-11 Seiko Epson Corp Intermediate chip module, semiconductor device, circuit board, and electronic device

Also Published As

Publication number Publication date
CN101013630A (zh) 2007-08-08
TW200729252A (en) 2007-08-01
US20070102805A1 (en) 2007-05-10
KR20070048330A (ko) 2007-05-09

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