JP2007123704A - 表面実装型ｌｅｄ - Google Patents

表面実装型ｌｅｄ Download PDF

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Publication number
JP2007123704A
JP2007123704A JP2005316457A JP2005316457A JP2007123704A JP 2007123704 A JP2007123704 A JP 2007123704A JP 2005316457 A JP2005316457 A JP 2005316457A JP 2005316457 A JP2005316457 A JP 2005316457A JP 2007123704 A JP2007123704 A JP 2007123704A
Authority
JP
Japan
Prior art keywords
led
resin case
polarity
electrode pattern
mounted led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005316457A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007123704A5 (enExample
Inventor
Kazuhiko Ueno
一彦 上野
Yoshihiro Ogawa
芳宏 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2005316457A priority Critical patent/JP2007123704A/ja
Publication of JP2007123704A publication Critical patent/JP2007123704A/ja
Publication of JP2007123704A5 publication Critical patent/JP2007123704A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2005316457A 2005-10-31 2005-10-31 表面実装型ｌｅｄ Pending JP2007123704A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005316457A JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005316457A JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Publications (2)

Publication Number Publication Date
JP2007123704A true JP2007123704A (ja) 2007-05-17
JP2007123704A5 JP2007123704A5 (enExample) 2008-12-04

Family

ID=38147191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005316457A Pending JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Country Status (1)

Country Link
JP (1) JP2007123704A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152482A (ja) * 2007-12-21 2009-07-09 Citizen Electronics Co Ltd 反射枠付表面実装型ｌｅｄ
JP2012164911A (ja) * 2011-02-09 2012-08-30 Toshiba Corp 半導体発光装置
JP2013069765A (ja) * 2011-09-21 2013-04-18 Citizen Electronics Co Ltd 半導体発光装置及びその製造方法。
JP2014512559A (ja) * 2011-02-24 2014-05-22 デジタルオプティクス コーポレーション カメラモジュールのためのフラッシュシステム
WO2016137227A1 (ko) * 2015-02-24 2016-09-01 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
KR20160103584A (ko) * 2015-02-24 2016-09-02 주식회사 세미콘라이트 반도체 발광소자, 및 이의 제조방법
CN110379728A (zh) * 2018-04-13 2019-10-25 江西鸿利光电有限公司 一种用于led芯片固晶防反装置及其使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330131A (ja) * 1998-05-20 1999-11-30 Rohm Co Ltd 半導体装置
JP2000077724A (ja) * 1998-08-31 2000-03-14 Rohm Co Ltd 光半導体素子、光半導体素子の実装構造、および光半導体素子群の包装構造
JP2005101283A (ja) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd 表面実装型発光ダイオード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330131A (ja) * 1998-05-20 1999-11-30 Rohm Co Ltd 半導体装置
JP2000077724A (ja) * 1998-08-31 2000-03-14 Rohm Co Ltd 光半導体素子、光半導体素子の実装構造、および光半導体素子群の包装構造
JP2005101283A (ja) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd 表面実装型発光ダイオード

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152482A (ja) * 2007-12-21 2009-07-09 Citizen Electronics Co Ltd 反射枠付表面実装型ｌｅｄ
JP2012164911A (ja) * 2011-02-09 2012-08-30 Toshiba Corp 半導体発光装置
US8860075B2 (en) 2011-02-09 2014-10-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device
US9263640B2 (en) 2011-02-09 2016-02-16 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2014512559A (ja) * 2011-02-24 2014-05-22 デジタルオプティクス コーポレーション カメラモジュールのためのフラッシュシステム
JP2013069765A (ja) * 2011-09-21 2013-04-18 Citizen Electronics Co Ltd 半導体発光装置及びその製造方法。
US9159887B2 (en) 2011-09-21 2015-10-13 Citizen Electronics Co., Ltd. Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device
WO2016137227A1 (ko) * 2015-02-24 2016-09-01 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
KR20160103584A (ko) * 2015-02-24 2016-09-02 주식회사 세미콘라이트 반도체 발광소자, 및 이의 제조방법
KR101663128B1 (ko) * 2015-02-24 2016-10-10 주식회사 세미콘라이트 반도체 발광소자, 및 이의 제조방법
CN110379728A (zh) * 2018-04-13 2019-10-25 江西鸿利光电有限公司 一种用于led芯片固晶防反装置及其使用方法

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