JP2007123704A5 - - Google Patents

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Publication number
JP2007123704A5
JP2007123704A5 JP2005316457A JP2005316457A JP2007123704A5 JP 2007123704 A5 JP2007123704 A5 JP 2007123704A5 JP 2005316457 A JP2005316457 A JP 2005316457A JP 2005316457 A JP2005316457 A JP 2005316457A JP 2007123704 A5 JP2007123704 A5 JP 2007123704A5
Authority
JP
Japan
Prior art keywords
electrode pattern
negative electrode
led
shape
resin case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005316457A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007123704A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005316457A priority Critical patent/JP2007123704A/ja
Priority claimed from JP2005316457A external-priority patent/JP2007123704A/ja
Publication of JP2007123704A publication Critical patent/JP2007123704A/ja
Publication of JP2007123704A5 publication Critical patent/JP2007123704A5/ja
Pending legal-status Critical Current

Links

JP2005316457A 2005-10-31 2005-10-31 表面実装型ｌｅｄ Pending JP2007123704A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005316457A JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005316457A JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Publications (2)

Publication Number Publication Date
JP2007123704A JP2007123704A (ja) 2007-05-17
JP2007123704A5 true JP2007123704A5 (enExample) 2008-12-04

Family

ID=38147191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005316457A Pending JP2007123704A (ja) 2005-10-31 2005-10-31 表面実装型ｌｅｄ

Country Status (1)

Country Link
JP (1) JP2007123704A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5189835B2 (ja) * 2007-12-21 2013-04-24 シチズン電子株式会社 反射枠付表面実装型ｌｅｄ
JP5603793B2 (ja) 2011-02-09 2014-10-08 株式会社東芝 半導体発光装置
WO2012116300A2 (en) * 2011-02-24 2012-08-30 Flextronics Ap, Llc Flash system for camera module
JP5848562B2 (ja) * 2011-09-21 2016-01-27 シチズン電子株式会社 半導体発光装置及びその製造方法。
KR101663128B1 (ko) * 2015-02-24 2016-10-10 주식회사 세미콘라이트 반도체 발광소자, 및 이의 제조방법
WO2016137227A1 (ko) * 2015-02-24 2016-09-01 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
CN110379728B (zh) * 2018-04-13 2025-07-18 江西鸿利光电有限公司 一种用于led芯片固晶防反装置及其使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3993302B2 (ja) * 1998-05-20 2007-10-17 ローム株式会社 半導体装置
JP3857435B2 (ja) * 1998-08-31 2006-12-13 ローム株式会社 光半導体素子、光半導体素子の実装構造、および光半導体素子群の包装構造
JP2005101283A (ja) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd 表面実装型発光ダイオード

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