JP2006179924A5 - - Google Patents

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Publication number
JP2006179924A5
JP2006179924A5 JP2005368189A JP2005368189A JP2006179924A5 JP 2006179924 A5 JP2006179924 A5 JP 2006179924A5 JP 2005368189 A JP2005368189 A JP 2005368189A JP 2005368189 A JP2005368189 A JP 2005368189A JP 2006179924 A5 JP2006179924 A5 JP 2006179924A5
Authority
JP
Japan
Prior art keywords
embedded
discrete chip
capacitor
smt
chip capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005368189A
Other languages
English (en)
Japanese (ja)
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JP2006179924A (ja
Filing date
Publication date
Priority claimed from US11/289,961 external-priority patent/US7778038B2/en
Application filed filed Critical
Publication of JP2006179924A publication Critical patent/JP2006179924A/ja
Publication of JP2006179924A5 publication Critical patent/JP2006179924A5/ja
Pending legal-status Critical Current

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JP2005368189A 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法 Pending JP2006179924A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63781704P 2004-12-21 2004-12-21
US11/289,961 US7778038B2 (en) 2004-12-21 2005-11-30 Power core devices and methods of making thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012034405A Division JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Publications (2)

Publication Number Publication Date
JP2006179924A JP2006179924A (ja) 2006-07-06
JP2006179924A5 true JP2006179924A5 (enExample) 2009-02-12

Family

ID=35999575

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005368189A Pending JP2006179924A (ja) 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法
JP2012034405A Pending JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012034405A Pending JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Country Status (5)

Country Link
US (1) US7778038B2 (enExample)
EP (1) EP1675448A1 (enExample)
JP (2) JP2006179924A (enExample)
KR (1) KR100754714B1 (enExample)
TW (1) TWI314029B (enExample)

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US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US20060158828A1 (en) * 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7435627B2 (en) * 2005-08-11 2008-10-14 International Business Machines Corporation Techniques for providing decoupling capacitance
US7361843B2 (en) * 2005-09-28 2008-04-22 Dell Products L.P. AC coupling of power plane sections using improved capacitance stitching material
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7504706B2 (en) * 2005-10-21 2009-03-17 E. I. Du Pont De Nemours Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7919804B2 (en) * 2005-11-08 2011-04-05 Oracle America, Inc. Power distribution for high-speed integrated circuits
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US7336501B2 (en) * 2006-06-26 2008-02-26 Ibiden Co., Ltd. Wiring board with built-in capacitor
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JP4905254B2 (ja) * 2007-05-25 2012-03-28 トヨタ自動車株式会社 コンデンサ一体バスバーの製造方法
TWM335792U (en) * 2007-08-16 2008-07-01 Aflash Technology Co Ltd Device structure of IC
CN101978800A (zh) * 2008-03-24 2011-02-16 日本特殊陶业株式会社 部件内置布线基板
US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US9041208B2 (en) 2011-11-02 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure
CN103458608A (zh) * 2012-06-05 2013-12-18 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8941434B1 (en) * 2013-07-12 2015-01-27 Samsung Display Co., Ltd. Bus encoding scheme based on non-uniform distribution of power delivery network components among I/O circuits
KR101499721B1 (ko) * 2013-08-09 2015-03-06 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
KR102071763B1 (ko) * 2014-02-21 2020-01-30 미쓰이금속광업주식회사 내장 캐패시터층 형성용 동장 적층판, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법
US9472425B2 (en) 2015-03-19 2016-10-18 Qualcomm Incorporated Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
US9673179B1 (en) 2016-07-20 2017-06-06 International Business Machines Corporation Discrete electronic device embedded in chip module
DE102018201158B4 (de) 2018-01-25 2024-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum bestücken einer leiterplatte

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JP3825324B2 (ja) * 2002-01-07 2006-09-27 京セラ株式会社 多層配線基板
JP4488684B2 (ja) 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
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JPWO2004089049A1 (ja) * 2003-03-28 2006-07-06 Tdk株式会社 多層基板およびその製造方法
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US20060158828A1 (en) 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
US7701052B2 (en) 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

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