JP2006179923A5 - - Google Patents

Download PDF

Info

Publication number
JP2006179923A5
JP2006179923A5 JP2005368188A JP2005368188A JP2006179923A5 JP 2006179923 A5 JP2006179923 A5 JP 2006179923A5 JP 2005368188 A JP2005368188 A JP 2005368188A JP 2005368188 A JP2005368188 A JP 2005368188A JP 2006179923 A5 JP2006179923 A5 JP 2006179923A5
Authority
JP
Japan
Prior art keywords
capacitor
foil
individualized
laminate
planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005368188A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006179923A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2006179923A publication Critical patent/JP2006179923A/ja
Publication of JP2006179923A5 publication Critical patent/JP2006179923A5/ja
Pending legal-status Critical Current

Links

JP2005368188A 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法 Pending JP2006179923A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63800104P 2004-12-21 2004-12-21
US28988405P 2005-11-30 2005-11-30

Publications (2)

Publication Number Publication Date
JP2006179923A JP2006179923A (ja) 2006-07-06
JP2006179923A5 true JP2006179923A5 (enExample) 2009-01-29

Family

ID=36010289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005368188A Pending JP2006179923A (ja) 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法

Country Status (5)

Country Link
US (1) US20060158828A1 (enExample)
EP (1) EP1675449A1 (enExample)
JP (1) JP2006179923A (enExample)
KR (1) KR100754712B1 (enExample)
TW (1) TW200629688A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7875808B2 (en) * 2005-09-19 2011-01-25 Industrial Technology Research Institute Embedded capacitor device having a common coupling area
US7701052B2 (en) 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7509608B1 (en) 2006-01-30 2009-03-24 Xilinx, Inc. Integrated system noise management—clock jitter
US7428717B1 (en) 2006-01-30 2008-09-23 Xilinx, Inc. Integrated system noise management—system level
US7412673B1 (en) * 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—bounce voltage
US7412668B1 (en) 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—decoupling capacitance
US7572709B2 (en) * 2006-06-29 2009-08-11 Intel Corporation Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
US7902662B2 (en) 2007-04-02 2011-03-08 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7841075B2 (en) * 2007-06-19 2010-11-30 E. I. Du Pont De Nemours And Company Methods for integration of thin-film capacitors into the build-up layers of a PWB
US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
KR20110047795A (ko) 2009-10-30 2011-05-09 삼성전기주식회사 범프가 구비된 인쇄회로기판의 제조방법
WO2015183762A1 (en) 2014-05-24 2015-12-03 Georgia Tech Research Corporation Chip-scale embedded carbon nanotube electrochemical double layer supercapacitor
JP7250391B1 (ja) 2022-11-07 2023-04-03 株式会社アクアライン シートキャパシタ及びバッテリー
TWI898767B (zh) * 2024-08-07 2025-09-21 崑山科技大學 應用於切換式電源定電流輸出的輸出電容佈局設計方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5428499A (en) * 1993-01-28 1995-06-27 Storage Technology Corporation Printed circuit board having integrated decoupling capacitive core with discrete elements
US5504993A (en) * 1994-08-30 1996-04-09 Storage Technology Corporation Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
US5469324A (en) * 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
JP2001185442A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板
US6446317B1 (en) * 2000-03-31 2002-09-10 Intel Corporation Hybrid capacitor and method of fabrication therefor
US6407929B1 (en) * 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
US6611419B1 (en) * 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

Similar Documents

Publication Publication Date Title
JP2006196886A5 (enExample)
JP2006179923A5 (enExample)
JP2006179924A5 (enExample)
TW200735742A (en) Multilayered wiring board and method for fabricating the same
TW200644005A (en) Multilayer electronic component and manufacturing method thereof
JP2013247353A5 (enExample)
WO2008036574A3 (en) Method of fabricating a security tag in an integrated surface processing system
TW200717676A (en) Stack structure of semiconductor component embedded in supporting board and method for fabricating the same
JP2013069807A5 (enExample)
JP2009283739A5 (enExample)
WO2009063932A1 (ja) 太陽電池モジュール用裏面保護シートおよびそれで保護した太陽電池モジュール
TW200833211A (en) Circuit board structure with capacitor embedded therein and method for fabricating the same
JP2010231969A5 (enExample)
JP2009081356A5 (enExample)
JP2014110390A5 (enExample)
WO2009063455A3 (en) Electronic inlay structure and method of manufacture therof
TW200733160A (en) Capacitor to be incorporated in wiring substarate, method for manufacturing the capacitor, and wiring substrate
TW200740311A (en) Capacitance laminate and printed circuit board apparatus and method
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
JP2009130054A5 (enExample)
EP1715496A4 (en) ELECTRIC DOUBLE-LAYER CONDENSER
WO2009034834A1 (ja) セラミック多層基板及びその製造方法
WO2009041044A1 (ja) 半導体モジュール、半導体モジュールの製造方法および携帯機器
SE0701372L (sv) Laminatstruktur
WO2007070356A3 (en) Package using array capacitor core