TW200629688A - Power core devices and methods of making thereof - Google Patents

Power core devices and methods of making thereof

Info

Publication number
TW200629688A
TW200629688A TW094145439A TW94145439A TW200629688A TW 200629688 A TW200629688 A TW 200629688A TW 094145439 A TW094145439 A TW 094145439A TW 94145439 A TW94145439 A TW 94145439A TW 200629688 A TW200629688 A TW 200629688A
Authority
TW
Taiwan
Prior art keywords
capacitor
power core
making
methods
core devices
Prior art date
Application number
TW094145439A
Other languages
English (en)
Chinese (zh)
Inventor
Daniel Irwin Amey Jr
Sounak Banerji
William J Borland
David Ross Mcgregor
Attiganal N Sreeram
Karl Hartmann Dietz
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200629688A publication Critical patent/TW200629688A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G17/00—Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094145439A 2004-12-21 2005-12-21 Power core devices and methods of making thereof TW200629688A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63800104P 2004-12-21 2004-12-21
US28988405P 2005-11-30 2005-11-30

Publications (1)

Publication Number Publication Date
TW200629688A true TW200629688A (en) 2006-08-16

Family

ID=36010289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145439A TW200629688A (en) 2004-12-21 2005-12-21 Power core devices and methods of making thereof

Country Status (5)

Country Link
US (1) US20060158828A1 (enExample)
EP (1) EP1675449A1 (enExample)
JP (1) JP2006179923A (enExample)
KR (1) KR100754712B1 (enExample)
TW (1) TW200629688A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
DE102006043032A1 (de) * 2005-09-19 2007-04-12 Industrial Technology Research Institute, Chutung Eingebettete Kondensatorvorrichtung mit einer gemeinsamen Verbindungsfläche
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7509608B1 (en) 2006-01-30 2009-03-24 Xilinx, Inc. Integrated system noise management—clock jitter
US7412673B1 (en) * 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—bounce voltage
US7412668B1 (en) 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—decoupling capacitance
US7428717B1 (en) 2006-01-30 2008-09-23 Xilinx, Inc. Integrated system noise management—system level
US7572709B2 (en) * 2006-06-29 2009-08-11 Intel Corporation Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
US7902662B2 (en) 2007-04-02 2011-03-08 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7841075B2 (en) * 2007-06-19 2010-11-30 E. I. Du Pont De Nemours And Company Methods for integration of thin-film capacitors into the build-up layers of a PWB
US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
KR20110047795A (ko) 2009-10-30 2011-05-09 삼성전기주식회사 범프가 구비된 인쇄회로기판의 제조방법
EP3149754B1 (en) 2014-05-24 2022-07-13 Georgia Tech Research Corporation Chip-scale embedded carbon nanotube electrochemical double layer supercapacitor
JP7250391B1 (ja) 2022-11-07 2023-04-03 株式会社アクアライン シートキャパシタ及びバッテリー
TWI898767B (zh) * 2024-08-07 2025-09-21 崑山科技大學 應用於切換式電源定電流輸出的輸出電容佈局設計方法
WO2026121806A1 (ko) * 2024-12-06 2026-06-11 동아대학교 산학협력단 프린팅 방식으로 제작한 수동소자를 내장한 스너버 회로를 포함하는 전력반도체 pcb 모듈 제조장치 및 방법

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5428499A (en) * 1993-01-28 1995-06-27 Storage Technology Corporation Printed circuit board having integrated decoupling capacitive core with discrete elements
US5504993A (en) * 1994-08-30 1996-04-09 Storage Technology Corporation Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
US5469324A (en) * 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
JP2001185442A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板
US6446317B1 (en) * 2000-03-31 2002-09-10 Intel Corporation Hybrid capacitor and method of fabrication therefor
US6407929B1 (en) * 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
US6611419B1 (en) * 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

Also Published As

Publication number Publication date
KR100754712B1 (ko) 2007-09-03
KR20060071329A (ko) 2006-06-26
EP1675449A1 (en) 2006-06-28
US20060158828A1 (en) 2006-07-20
JP2006179923A (ja) 2006-07-06

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