JP2006179923A - 電力コアデバイス、およびその作製の方法 - Google Patents

電力コアデバイス、およびその作製の方法 Download PDF

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Publication number
JP2006179923A
JP2006179923A JP2005368188A JP2005368188A JP2006179923A JP 2006179923 A JP2006179923 A JP 2006179923A JP 2005368188 A JP2005368188 A JP 2005368188A JP 2005368188 A JP2005368188 A JP 2005368188A JP 2006179923 A JP2006179923 A JP 2006179923A
Authority
JP
Japan
Prior art keywords
capacitor
foil
dielectric
laminate
individualized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005368188A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006179923A5 (enExample
Inventor
Daniel Irwin Amey Jr
アーウィン アーメイ ジュニア ダニエル
Sounak Banerji
バネルジー ソーナク
William J Borland
ジェイ．ボーランド ウイリアム
David Ross Mcgregor
ロス マクレガー デイヴィッド
Attiganal N Sreeram
エヌ．スリーラム アッティガナル
Karl Hartmann Dietz
ハルトマン ディーツ カール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2006179923A publication Critical patent/JP2006179923A/ja
Publication of JP2006179923A5 publication Critical patent/JP2006179923A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G17/00—Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2005368188A 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法 Pending JP2006179923A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63800104P 2004-12-21 2004-12-21
US28988405P 2005-11-30 2005-11-30

Publications (2)

Publication Number Publication Date
JP2006179923A true JP2006179923A (ja) 2006-07-06
JP2006179923A5 JP2006179923A5 (enExample) 2009-01-29

Family

ID=36010289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005368188A Pending JP2006179923A (ja) 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法

Country Status (5)

Country Link
US (1) US20060158828A1 (enExample)
EP (1) EP1675449A1 (enExample)
JP (1) JP2006179923A (enExample)
KR (1) KR100754712B1 (enExample)
TW (1) TW200629688A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986555B2 (en) 2009-10-30 2015-03-24 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board having bump
JP7250391B1 (ja) 2022-11-07 2023-04-03 株式会社アクアライン シートキャパシタ及びバッテリー

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7875808B2 (en) * 2005-09-19 2011-01-25 Industrial Technology Research Institute Embedded capacitor device having a common coupling area
US7701052B2 (en) 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7509608B1 (en) 2006-01-30 2009-03-24 Xilinx, Inc. Integrated system noise management—clock jitter
US7428717B1 (en) 2006-01-30 2008-09-23 Xilinx, Inc. Integrated system noise management—system level
US7412673B1 (en) * 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—bounce voltage
US7412668B1 (en) 2006-01-30 2008-08-12 Xilinx, Inc. Integrated system noise management—decoupling capacitance
US7572709B2 (en) * 2006-06-29 2009-08-11 Intel Corporation Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
US7902662B2 (en) 2007-04-02 2011-03-08 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7841075B2 (en) * 2007-06-19 2010-11-30 E. I. Du Pont De Nemours And Company Methods for integration of thin-film capacitors into the build-up layers of a PWB
US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
WO2015183762A1 (en) 2014-05-24 2015-12-03 Georgia Tech Research Corporation Chip-scale embedded carbon nanotube electrochemical double layer supercapacitor
TWI898767B (zh) * 2024-08-07 2025-09-21 崑山科技大學 應用於切換式電源定電流輸出的輸出電容佈局設計方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5161086A (en) * 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5428499A (en) * 1993-01-28 1995-06-27 Storage Technology Corporation Printed circuit board having integrated decoupling capacitive core with discrete elements
US5504993A (en) * 1994-08-30 1996-04-09 Storage Technology Corporation Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
US5469324A (en) * 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
JP2001185442A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板
US6446317B1 (en) * 2000-03-31 2002-09-10 Intel Corporation Hybrid capacitor and method of fabrication therefor
US6407929B1 (en) * 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
US6611419B1 (en) * 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986555B2 (en) 2009-10-30 2015-03-24 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board having bump
JP7250391B1 (ja) 2022-11-07 2023-04-03 株式会社アクアライン シートキャパシタ及びバッテリー
JP2024067620A (ja) * 2022-11-07 2024-05-17 株式会社アクアライン シートキャパシタ及びバッテリー

Also Published As

Publication number Publication date
EP1675449A1 (en) 2006-06-28
TW200629688A (en) 2006-08-16
KR20060071329A (ko) 2006-06-26
KR100754712B1 (ko) 2007-09-03
US20060158828A1 (en) 2006-07-20

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