JP2009224741A5 - - Google Patents

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Publication number
JP2009224741A5
JP2009224741A5 JP2008070798A JP2008070798A JP2009224741A5 JP 2009224741 A5 JP2009224741 A5 JP 2009224741A5 JP 2008070798 A JP2008070798 A JP 2008070798A JP 2008070798 A JP2008070798 A JP 2008070798A JP 2009224741 A5 JP2009224741 A5 JP 2009224741A5
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JP
Japan
Prior art keywords
electrode
insulating substrate
electronic component
component package
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008070798A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009224741A (ja
JP5181755B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008070798A priority Critical patent/JP5181755B2/ja
Priority claimed from JP2008070798A external-priority patent/JP5181755B2/ja
Publication of JP2009224741A publication Critical patent/JP2009224741A/ja
Publication of JP2009224741A5 publication Critical patent/JP2009224741A5/ja
Application granted granted Critical
Publication of JP5181755B2 publication Critical patent/JP5181755B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008070798A 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス Expired - Fee Related JP5181755B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008070798A JP5181755B2 (ja) 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008070798A JP5181755B2 (ja) 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス

Publications (3)

Publication Number Publication Date
JP2009224741A JP2009224741A (ja) 2009-10-01
JP2009224741A5 true JP2009224741A5 (enExample) 2011-04-21
JP5181755B2 JP5181755B2 (ja) 2013-04-10

Family

ID=41241184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008070798A Expired - Fee Related JP5181755B2 (ja) 2008-03-19 2008-03-19 電子部品用パッケージ及び表面実装型電子デバイス

Country Status (1)

Country Link
JP (1) JP5181755B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2555426B1 (en) 2010-04-01 2019-01-09 Daishinku Corporation Base of surface-mount-type electronic component-use package, and surface-mount-type electronic component-use package
US8729967B2 (en) * 2011-09-08 2014-05-20 Nihon Dempa Kogyo Co., Ltd. Surface-mounted crystal oscillator and manufacturing method thereof
WO2013180247A1 (ja) * 2012-05-30 2013-12-05 京セラ株式会社 配線基板および電子装置
JP6248539B2 (ja) * 2013-10-28 2017-12-20 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ
JP6176057B2 (ja) * 2013-10-28 2017-08-09 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ
JP7655110B2 (ja) 2021-06-22 2025-04-02 株式会社大真空 電子部品用パッケージのベース、電子部品用パッケージ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158220A (ja) * 2001-11-26 2003-05-30 Kyocera Corp 配線基板
JP2003218489A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 配線基板
JP3781119B2 (ja) * 2003-03-17 2006-05-31 セイコーエプソン株式会社 圧電デバイス用パッケージ及び圧電デバイス
JP2009141455A (ja) * 2007-12-04 2009-06-25 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス

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